SG47417A1 - Solderable connectors for high density electronic assemblies - Google Patents
Solderable connectors for high density electronic assembliesInfo
- Publication number
- SG47417A1 SG47417A1 SG1996000989A SG1996000989A SG47417A1 SG 47417 A1 SG47417 A1 SG 47417A1 SG 1996000989 A SG1996000989 A SG 1996000989A SG 1996000989 A SG1996000989 A SG 1996000989A SG 47417 A1 SG47417 A1 SG 47417A1
- Authority
- SG
- Singapore
- Prior art keywords
- high density
- electronic assemblies
- density electronic
- solderable
- connectors
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/02—Soldered or welded connections
- H01R4/028—Soldered or welded connections comprising means for preventing flowing or wicking of solder or flux in parts not desired
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10325—Sockets, i.e. female type connectors comprising metallic connector elements integrated in, or bonded to a common dielectric support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/10886—Other details
- H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15239993A | 1993-11-15 | 1993-11-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG47417A1 true SG47417A1 (en) | 1998-04-17 |
Family
ID=22542757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG1996000989A SG47417A1 (en) | 1993-11-15 | 1994-11-14 | Solderable connectors for high density electronic assemblies |
Country Status (6)
Country | Link |
---|---|
US (1) | US5453017A (zh) |
EP (1) | EP0729650A4 (zh) |
JP (1) | JP3399959B2 (zh) |
SG (1) | SG47417A1 (zh) |
TW (1) | TW249303B (zh) |
WO (1) | WO1995014312A1 (zh) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10131225B4 (de) * | 1983-12-29 | 2012-07-05 | Tyco Electronics Amp Gmbh | Kontaktelement von zur Oberflächenmontage geeigneten Bauteilen sowie Verfahren zum Anbringen von Lot an diese Kontaktelemente |
GB9401918D0 (en) * | 1994-02-01 | 1994-03-30 | Amp Gmbh | Connector with terminals having anti-wicking gel |
US6939173B1 (en) | 1995-06-12 | 2005-09-06 | Fci Americas Technology, Inc. | Low cross talk and impedance controlled electrical connector with solder masses |
JP3027593U (ja) * | 1995-11-16 | 1996-08-13 | モレックス インコーポレーテッド | 電気コネクタの導電ターミナル |
US6093035A (en) * | 1996-06-28 | 2000-07-25 | Berg Technology, Inc. | Contact for use in an electrical connector |
US5904581A (en) * | 1996-07-17 | 1999-05-18 | Minnesota Mining And Manufacturing Company | Electrical interconnection system and device |
SG71046A1 (en) | 1996-10-10 | 2000-03-21 | Connector Systems Tech Nv | High density connector and method of manufacture |
EP1311032B1 (en) * | 1996-10-10 | 2006-09-20 | Fci | High density connector and method of manufacture |
US6139336A (en) * | 1996-11-14 | 2000-10-31 | Berg Technology, Inc. | High density connector having a ball type of contact surface |
US20020106832A1 (en) | 1996-11-26 | 2002-08-08 | Gregory B. Hotchkiss | Method and apparatus for attaching solder members to a substrate |
US5957736A (en) * | 1997-11-19 | 1999-09-28 | Ddk Ltd. | Electronic part |
US6116921A (en) * | 1998-02-16 | 2000-09-12 | The Whitaker Corporation | Electrical connector having recessed solderball foot |
JP3317893B2 (ja) * | 1998-03-27 | 2002-08-26 | 太陽誘電株式会社 | 面実装型コイル |
DE19813932A1 (de) * | 1998-03-28 | 1999-09-30 | Wuerth Elektronik Gmbh & Co Kg | Befestigungsanordnung eines Steckverbinders an einer Leiterplatte |
JP3068557B2 (ja) * | 1998-04-30 | 2000-07-24 | 北川工業株式会社 | プリント配線板の接地構造及び当該接地構造に用いられる導電部材 |
EP1202390B1 (en) * | 2000-10-25 | 2008-05-21 | Japan Aviation Electronics Industry, Limited | An electronic component and a method of manufacturing the same |
US7297003B2 (en) | 2003-07-16 | 2007-11-20 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
US7537461B2 (en) * | 2003-07-16 | 2009-05-26 | Gryphics, Inc. | Fine pitch electrical interconnect assembly |
CN100459833C (zh) * | 2003-07-16 | 2009-02-04 | 格瑞费克斯公司 | 具有联锁接触系统的电互连组件 |
EP1819018B1 (en) * | 2004-12-03 | 2012-12-05 | Murata Manufacturing Co., Ltd. | Electric contact part, coaxial connector, and electric circuit device using the part and the connector |
US20060196857A1 (en) * | 2005-03-03 | 2006-09-07 | Samtec, Inc. | Methods of manufacturing electrical contacts having solder stops |
US7172438B2 (en) * | 2005-03-03 | 2007-02-06 | Samtec, Inc. | Electrical contacts having solder stops |
WO2007086147A1 (ja) * | 2006-01-25 | 2007-08-02 | Kabushiki Kaisha Nihon Micronics | 通電試験用プローブ、プローブ組立体およびその製造方法 |
JP2007240235A (ja) * | 2006-03-07 | 2007-09-20 | Micronics Japan Co Ltd | 通電試験用プローブおよびプローブ組立体 |
KR101353650B1 (ko) | 2006-03-20 | 2014-02-07 | 알앤디 소켓, 인코포레이티드 | 미세 피치 전기 상호접속 조립체용 복합 접촉체 |
US7239529B1 (en) * | 2006-03-30 | 2007-07-03 | Inventec Corporation | Fixing member for auxiliary circuit board |
JP4954050B2 (ja) * | 2007-12-20 | 2012-06-13 | モレックス インコーポレイテド | 端子及びコネクタ |
US8052434B2 (en) * | 2009-04-20 | 2011-11-08 | Hon Hai Precision Ind. Co., Ltd. | Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint |
TWM380606U (en) * | 2009-11-12 | 2010-05-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
JP4887412B2 (ja) * | 2009-09-18 | 2012-02-29 | ヒロセ電機株式会社 | 回路基板用電気コネクタ |
JP5126244B2 (ja) * | 2010-02-12 | 2013-01-23 | 株式会社村田製作所 | 回路モジュール |
US8894422B2 (en) | 2010-04-20 | 2014-11-25 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminal having waveform arrangement adjacent to tail portion perfecting solder joint |
US9142932B2 (en) | 2010-04-20 | 2015-09-22 | Hon Hai Precision Industry Co., Ltd. | Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint |
JP5479406B2 (ja) * | 2011-06-30 | 2014-04-23 | 日本航空電子工業株式会社 | コネクタ |
CN203180152U (zh) * | 2013-02-07 | 2013-09-04 | 番禺得意精密电子工业有限公司 | 电连接器 |
WO2016069570A2 (en) * | 2014-10-27 | 2016-05-06 | Fci Asia Pte. Ltd | Circular power connectors |
CN111403937A (zh) * | 2020-03-24 | 2020-07-10 | 东莞立德精密工业有限公司 | 金属端子及其制作方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3864004A (en) * | 1972-11-30 | 1975-02-04 | Du Pont | Circuit board socket |
US3989331A (en) * | 1974-08-21 | 1976-11-02 | Augat, Inc. | Dual-in-line socket |
US4183611A (en) * | 1976-05-13 | 1980-01-15 | Amp Incorporated | Inlaid contact |
JPH0748386B2 (ja) * | 1990-07-24 | 1995-05-24 | 山一電機工業株式会社 | コンタクト |
US5136122A (en) * | 1991-05-13 | 1992-08-04 | Motorola, Inc. | Braided fiber omega connector |
US5104324A (en) * | 1991-06-26 | 1992-04-14 | Amp Incorporated | Multichip module connector |
US5199884A (en) * | 1991-12-02 | 1993-04-06 | Amp Incorporated | Blind mating miniature connector |
-
1994
- 1994-11-14 EP EP95901232A patent/EP0729650A4/en not_active Withdrawn
- 1994-11-14 WO PCT/US1994/013051 patent/WO1995014312A1/en not_active Application Discontinuation
- 1994-11-14 JP JP51452595A patent/JP3399959B2/ja not_active Expired - Fee Related
- 1994-11-14 SG SG1996000989A patent/SG47417A1/en unknown
- 1994-11-29 TW TW083111076A patent/TW249303B/zh active
- 1994-12-09 US US08/352,986 patent/US5453017A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0729650A1 (en) | 1996-09-04 |
TW249303B (zh) | 1995-06-11 |
JPH09505437A (ja) | 1997-05-27 |
EP0729650A4 (en) | 1997-01-15 |
WO1995014312A1 (en) | 1995-05-26 |
US5453017A (en) | 1995-09-26 |
JP3399959B2 (ja) | 2003-04-28 |
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