SG47064A1 - Standardized mechanical interface (smif) pod - Google Patents

Standardized mechanical interface (smif) pod

Info

Publication number
SG47064A1
SG47064A1 SG1996005245A SG1996005245A SG47064A1 SG 47064 A1 SG47064 A1 SG 47064A1 SG 1996005245 A SG1996005245 A SG 1996005245A SG 1996005245 A SG1996005245 A SG 1996005245A SG 47064 A1 SG47064 A1 SG 47064A1
Authority
SG
Singapore
Prior art keywords
smif
pod
mechanical interface
standardized mechanical
standardized
Prior art date
Application number
SG1996005245A
Other languages
English (en)
Inventor
Randall S Williams
Nicholas T Cheesebrow
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Publication of SG47064A1 publication Critical patent/SG47064A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
SG1996005245A 1994-05-24 1995-01-05 Standardized mechanical interface (smif) pod SG47064A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/248,306 US5482161A (en) 1994-05-24 1994-05-24 Mechanical interface wafer container

Publications (1)

Publication Number Publication Date
SG47064A1 true SG47064A1 (en) 1998-03-20

Family

ID=22938541

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996005245A SG47064A1 (en) 1994-05-24 1995-01-05 Standardized mechanical interface (smif) pod

Country Status (7)

Country Link
US (1) US5482161A (ja)
EP (1) EP0684631B1 (ja)
JP (1) JPH07315477A (ja)
KR (1) KR950034659A (ja)
DE (1) DE69501916T2 (ja)
ES (1) ES2114276T3 (ja)
SG (1) SG47064A1 (ja)

Families Citing this family (80)

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US5895191A (en) * 1995-08-23 1999-04-20 Asyst Technologies Sealable, transportable container adapted for horizontal loading and unloading
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US5628121A (en) * 1995-12-01 1997-05-13 Convey, Inc. Method and apparatus for maintaining sensitive articles in a contaminant-free environment
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
US6286688B1 (en) * 1996-04-03 2001-09-11 Scp Global Technologies, Inc. Compliant silicon wafer handling system
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
US5915562A (en) * 1996-07-12 1999-06-29 Fluoroware, Inc. Transport module with latching door
US5711427A (en) * 1996-07-12 1998-01-27 Fluoroware, Inc. Wafer carrier with door
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
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WO1998059229A2 (en) * 1997-06-23 1998-12-30 Genco Robert M Pod monitor for use in a controlled environment
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US6736268B2 (en) * 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US5957292A (en) * 1997-08-01 1999-09-28 Fluoroware, Inc. Wafer enclosure with door
US5944602A (en) * 1997-09-09 1999-08-31 Tumi Manufacturing, Inc. Portable cleanroom cabinet assembly
US6164664A (en) * 1998-03-27 2000-12-26 Asyst Technologies, Inc. Kinematic coupling compatible passive interface seal
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US6398032B2 (en) * 1998-05-05 2002-06-04 Asyst Technologies, Inc. SMIF pod including independently supported wafer cassette
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US6871741B2 (en) * 1998-05-28 2005-03-29 Entegris, Inc. Composite substrate carrier
US8083272B1 (en) * 1998-06-29 2011-12-27 Industrial Technology Research Institute Mechanically actuated air tight device for wafer carrier
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US6216874B1 (en) * 1998-07-10 2001-04-17 Fluoroware, Inc. Wafer carrier having a low tolerance build-up
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KR100345520B1 (ko) * 1999-12-31 2002-07-24 아남반도체 주식회사 파드의 락킹 장치
KR100330479B1 (ko) * 2000-02-17 2002-04-01 황인길 웨이퍼가 정렬된 캐리어를 수납하기 위한 파드 도어와 캐리어를 보호하기 위한 캐리어 커버를 체결시키기 위한 체결 장치
US6338409B1 (en) 2000-04-13 2002-01-15 International Business Machines Corporation Reticle SMIF pod in situ orientation
US6303398B1 (en) 2000-05-04 2001-10-16 Advanced Micro Devices, Inc. Method and system of managing wafers in a semiconductor device production facility
TW433258U (en) * 2000-06-23 2001-05-01 Ind Tech Res Inst Improved door body structure for a pod
JP2004527100A (ja) * 2000-12-13 2004-09-02 エンテグリス ケイマン リミテッド 横方向フローティングラッチハブ構造体
JP4508463B2 (ja) * 2001-04-20 2010-07-21 信越ポリマー株式会社 容器の蓋体用手動開閉治具
US6923325B2 (en) 2001-07-12 2005-08-02 Entegris, Inc. Horizontal cassette
JP4329541B2 (ja) * 2001-11-27 2009-09-09 インテグリス・インコーポレーテッド ドアにより機能化されるアース経路を有した前方開閉型ウエハーキャリア及びウエハーキャリアのドアを経由したアース経路を設ける方法
US7121414B2 (en) * 2001-12-28 2006-10-17 Brooks Automation, Inc. Semiconductor cassette reducer
US6880718B2 (en) 2002-01-15 2005-04-19 Entegris, Inc. Wafer carrier door and spring biased latching mechanism
US7175026B2 (en) 2002-05-03 2007-02-13 Maxtor Corporation Memory disk shipping container with improved contaminant control
US20040074808A1 (en) * 2002-07-05 2004-04-22 Entegris, Inc. Fire retardant wafer carrier
US7258520B2 (en) 2002-08-31 2007-08-21 Applied Materials, Inc. Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing
US6955197B2 (en) 2002-08-31 2005-10-18 Applied Materials, Inc. Substrate carrier having door latching and substrate clamping mechanisms
US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
KR100572321B1 (ko) * 2003-10-02 2006-04-19 삼성전자주식회사 반도체 소자 제조 설비 및 방법 그리고 이에 사용되는스토커
KR100583726B1 (ko) * 2003-11-12 2006-05-25 삼성전자주식회사 기판 처리 장치 및 기판 처리 방법
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US7325693B2 (en) * 2003-11-16 2008-02-05 Entegris, Inc. Wafer container and door with cam latching mechanism
US7328836B2 (en) * 2004-02-03 2008-02-12 Taiwan Semiconductor Manufacturing Co., Ltd. Smart tag holder and cover housing
US7328727B2 (en) * 2004-04-18 2008-02-12 Entegris, Inc. Substrate container with fluid-sealing flow passageway
CN100363241C (zh) * 2004-04-29 2008-01-23 家登精密工业股份有限公司 传送盒的填充装置
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CN1313331C (zh) * 2004-08-30 2007-05-02 财团法人工业技术研究院 洁净容器结构
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US7528936B2 (en) * 2005-02-27 2009-05-05 Entegris, Inc. Substrate container with pressure equalization
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TWM320179U (en) * 2006-06-09 2007-10-01 Gudeng Prec Industral Co Ltd Gas filling equipment and filling chamber therein for photomask conveying box
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TW200929357A (en) * 2007-12-20 2009-07-01 Gudeng Prec Industral Co Ltd Gas filling apparatus
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US20180362910A1 (en) * 2015-06-15 2018-12-20 Entegris, Inc, Aseptic pods and load ports
USD799825S1 (en) * 2015-08-31 2017-10-17 Entegris, Inc. Container
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WO2017058497A1 (en) * 2015-10-01 2017-04-06 Entegris, Inc. Substrate container with improved substrate retainer and door latch assist mechanism
WO2017205708A1 (en) * 2016-05-26 2017-11-30 Entegris, Inc. Latching mechanism for a substrate container
FR3053157B1 (fr) * 2016-06-22 2018-10-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Boitier de dispositif microelectronique
US11139188B2 (en) * 2017-04-28 2021-10-05 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
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JP7234527B2 (ja) * 2018-07-30 2023-03-08 Tdk株式会社 センサー内蔵フィルタ構造体及びウエハ収容容器
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Also Published As

Publication number Publication date
DE69501916D1 (de) 1998-05-07
ES2114276T3 (es) 1998-05-16
US5482161A (en) 1996-01-09
EP0684631A1 (en) 1995-11-29
JPH07315477A (ja) 1995-12-05
EP0684631B1 (en) 1998-04-01
DE69501916T2 (de) 1998-07-30
KR950034659A (ko) 1995-12-28

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