ES2114276T3 - Capsula de interfaz mecanica normalizada (smif). - Google Patents

Capsula de interfaz mecanica normalizada (smif).

Info

Publication number
ES2114276T3
ES2114276T3 ES95400025T ES95400025T ES2114276T3 ES 2114276 T3 ES2114276 T3 ES 2114276T3 ES 95400025 T ES95400025 T ES 95400025T ES 95400025 T ES95400025 T ES 95400025T ES 2114276 T3 ES2114276 T3 ES 2114276T3
Authority
ES
Spain
Prior art keywords
box
door
carrier
cam
smif
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
ES95400025T
Other languages
English (en)
Inventor
Randall S Williams
Nicholas T Cheesebrow
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fluoroware Inc
Original Assignee
Fluoroware Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fluoroware Inc filed Critical Fluoroware Inc
Application granted granted Critical
Publication of ES2114276T3 publication Critical patent/ES2114276T3/es
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
  • Packages (AREA)

Abstract

UNA CANALETA DE INTERCONEXION MECANICA ESTANDARIZADA (SMIF) PARA UTILIZAR EN CONJUNCION CON SISTEMAS SMIF. LA CANALETA ES UTILIZADA PARA TRANSPORTAR UN ARTICULO, COMO LAMINAS SEMICONDUCTORAS O SIMILAR, ENTRE LOCALIZACIONES COMO ESTACIONES PROCESADORAS DE SMIF. LA CANALETA INCLUYE UNA CAJA QUE TIENE UN EXTREMO ABIERTO Y UNA PUERTA DE CAJA QUE SE UNE A MODO DE SELLAJE Y QUE CIERRA EL EXTREMO ABIERTO. LA CAJA CONTIENE UN PORTADOR EXTRAIBLE QUE SE ALOJA EN LA PUERTA DE CAJA Y QUE TIENE UN LADO ABIERTO PARA LA INSERCION Y EXTRACCION DE LOS ARTICULOS. LA CANALETA POSEE UN MECANISMO DE ENGANCHE EN LA PUERTA DE LA CAJA QUE UTILIZA UNA RUEDA DE ESTRELLA CON PUNTAS QUE ROTAN Y QUE SE EXTIENDEN HACIA FUERA DESDE UNAS RANURAS EN LA PUERTA DE LA CAJA Y QUE SE INTRODUCEN EN RANURAS EN EL INTERIOR DE LAS PAREDES LATERALES DE LA CAJA. LAS PUNTAS SE MUEVEN ENTONCES VERTICALMENTE HACIA ABAJO, PARA UNIR A MODO DE SELLAJE LA PUERTA DE CAJA A LA CAJA. LA RUEDA DE ESTRELLA ABRAZA UN REBORDE DE LEVA CONCENTRICO QUE TIENE UNA SUPERFICIE DE LEVA ANGULADA, UNIDA POR HORQUILLAS DE PIEZAS IMPULSADAS DE LEVA QUE SE EXTIENDEN RADIALMENTE HACIA DENTRO DESDE LA RUEDA DE ESTRELLA. ESTA ESTA CONFIGURADA Y POSICIONADA EN LA PUERTA DE CAJA, DE FORMA QUE UNA ROTACION PARCIAL ROTA LAS PUNTAS DESDE EL INTERIOR DE LA CAJA PARA EXTENDERSE HACIA FUERA DE LAS RANURAS. EN EL PUNTO DE EXTENSION, UN TOPE LIMITA MAS AUN LA ROTACION DE LA RUEDA DE ESTRELLA, CAUSANDO QUE LAS PIEZAS IMPULSADAS DE LEVA SIGAN A LA SUPERFICIE DE LEVA AL SER EL REBORDE DE LEVA ROTADO MAS ALLA, DESPLAZANDO LA RUEDA DE ESTRELLA HACIA ABAJO, CAUSANDO ASI UNA UNION DE LAS PUNTAS CON LAS RANURAS EN LA CAJA Y DESPLAZANDO LA PUERTA DE CAJA HACIA ABAJO PARA UNIR A MODO DE SELLAJE ESTA CON LA CAJA. UN PAR DE VALVULAS DE UNA SOLA DIRECCION PURGAN EL INTERIOR DE LA CANALETA. UN BRAZO DE ALINEACION PIVOTA A MODO DE BALANCIN DESDE LA PARTE SUPERIOR INTERNA DE LA CAJA. EL BRAZO DE ALINEACION TIENE UN DEDO DE UNION QUE UNE LA PARTE SUPERIOR DEL PORTADOR A UNAPARTE DE RETENCION QUE SE EXTIENDE EN FRENTE DEL LADO ABIERTO DEL MISMO; AL SER ELEVADO EL PORTADOR DE LAMINAS JUNTO CON LA PUERTA DE CAJA HASTA LA CAJA, EL DEDO CONECTA LA PARTE SUPERIOR DEL PORTADOR PARA BALANCEAR LA PARTE DE RETENCION ENFRENTE DEL LADO ABIERTO DEL PORTADOR, PARA SUJETAR LAS LAMINAS EN SU SITIO. EL BRAZO DE ALINEACION SE BALANCEA MEDIANTE UN SEGMENTO FLEXIBLE, ELIMINANDO EL RALLADO O FROTADO DE LAS PARTES.
ES95400025T 1994-05-24 1995-01-05 Capsula de interfaz mecanica normalizada (smif). Expired - Lifetime ES2114276T3 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/248,306 US5482161A (en) 1994-05-24 1994-05-24 Mechanical interface wafer container

Publications (1)

Publication Number Publication Date
ES2114276T3 true ES2114276T3 (es) 1998-05-16

Family

ID=22938541

Family Applications (1)

Application Number Title Priority Date Filing Date
ES95400025T Expired - Lifetime ES2114276T3 (es) 1994-05-24 1995-01-05 Capsula de interfaz mecanica normalizada (smif).

Country Status (7)

Country Link
US (1) US5482161A (es)
EP (1) EP0684631B1 (es)
JP (1) JPH07315477A (es)
KR (1) KR950034659A (es)
DE (1) DE69501916T2 (es)
ES (1) ES2114276T3 (es)
SG (1) SG47064A1 (es)

Families Citing this family (80)

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US5895191A (en) * 1995-08-23 1999-04-20 Asyst Technologies Sealable, transportable container adapted for horizontal loading and unloading
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USRE38221E1 (en) 1995-10-13 2003-08-19 Entegris, Inc. 300 mm microenvironment pod with door on side
US5873468A (en) * 1995-11-16 1999-02-23 Sumitomo Sitix Corporation Thin-plate supporting container with filter means
US5628121A (en) * 1995-12-01 1997-05-13 Convey, Inc. Method and apparatus for maintaining sensitive articles in a contaminant-free environment
US5806574A (en) * 1995-12-01 1998-09-15 Shinko Electric Co., Ltd. Portable closed container
US6286688B1 (en) * 1996-04-03 2001-09-11 Scp Global Technologies, Inc. Compliant silicon wafer handling system
US5711427A (en) * 1996-07-12 1998-01-27 Fluoroware, Inc. Wafer carrier with door
US5788082A (en) * 1996-07-12 1998-08-04 Fluoroware, Inc. Wafer carrier
US5915562A (en) * 1996-07-12 1999-06-29 Fluoroware, Inc. Transport module with latching door
US5879458A (en) * 1996-09-13 1999-03-09 Semifab Incorporated Molecular contamination control system
JP3062113B2 (ja) * 1997-04-16 2000-07-10 九州日本電気株式会社 ウェハー保管ボックス帯電化によるごみ付着防止機構
WO1998059229A2 (en) * 1997-06-23 1998-12-30 Genco Robert M Pod monitor for use in a controlled environment
US6736268B2 (en) 1997-07-11 2004-05-18 Entegris, Inc. Transport module
US6010008A (en) * 1997-07-11 2000-01-04 Fluoroware, Inc. Transport module
US5957292A (en) * 1997-08-01 1999-09-28 Fluoroware, Inc. Wafer enclosure with door
US5944602A (en) * 1997-09-09 1999-08-31 Tumi Manufacturing, Inc. Portable cleanroom cabinet assembly
US6164664A (en) * 1998-03-27 2000-12-26 Asyst Technologies, Inc. Kinematic coupling compatible passive interface seal
DE69836425T2 (de) * 1998-04-06 2007-09-27 Dainichi Shoji K.K. Behälter
JP3280305B2 (ja) * 1998-04-13 2002-05-13 信越半導体株式会社 精密基板輸送容器
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US6398032B2 (en) * 1998-05-05 2002-06-04 Asyst Technologies, Inc. SMIF pod including independently supported wafer cassette
US6871741B2 (en) * 1998-05-28 2005-03-29 Entegris, Inc. Composite substrate carrier
US6808668B2 (en) * 1998-05-28 2004-10-26 Entegris, Inc. Process for fabricating composite substrate carrier
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US6216874B1 (en) * 1998-07-10 2001-04-17 Fluoroware, Inc. Wafer carrier having a low tolerance build-up
JP3556480B2 (ja) * 1998-08-17 2004-08-18 信越ポリマー株式会社 精密基板収納容器
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US6641349B1 (en) * 1999-04-30 2003-11-04 Tdk Corporation Clean box, clean transfer method and system
JP3769417B2 (ja) * 1999-06-30 2006-04-26 株式会社東芝 基板収納容器
KR100345520B1 (ko) * 1999-12-31 2002-07-24 아남반도체 주식회사 파드의 락킹 장치
KR100330479B1 (ko) * 2000-02-17 2002-04-01 황인길 웨이퍼가 정렬된 캐리어를 수납하기 위한 파드 도어와 캐리어를 보호하기 위한 캐리어 커버를 체결시키기 위한 체결 장치
US6338409B1 (en) 2000-04-13 2002-01-15 International Business Machines Corporation Reticle SMIF pod in situ orientation
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US20040101385A1 (en) * 2002-11-25 2004-05-27 Ta-Kuang Chang Semiconductor process apparatus and SMIF pod used therein
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JP6666930B2 (ja) * 2015-06-15 2020-03-18 インテグリス・インコーポレーテッド 試料移送ポッド
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FR3053157B1 (fr) * 2016-06-22 2018-10-12 Commissariat A L'energie Atomique Et Aux Energies Alternatives Boitier de dispositif microelectronique
US11139188B2 (en) * 2017-04-28 2021-10-05 Sinfonia Technology Co., Ltd. Gas supply device, method for controlling gas supply device, load port, and semiconductor manufacturing apparatus
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Also Published As

Publication number Publication date
DE69501916T2 (de) 1998-07-30
KR950034659A (ko) 1995-12-28
JPH07315477A (ja) 1995-12-05
EP0684631B1 (en) 1998-04-01
DE69501916D1 (de) 1998-05-07
EP0684631A1 (en) 1995-11-29
SG47064A1 (en) 1998-03-20
US5482161A (en) 1996-01-09

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