SG2014009468A - Compression molding method and device for light-emitting device reflector - Google Patents

Compression molding method and device for light-emitting device reflector

Info

Publication number
SG2014009468A
SG2014009468A SG2014009468A SG2014009468A SG2014009468A SG 2014009468 A SG2014009468 A SG 2014009468A SG 2014009468 A SG2014009468 A SG 2014009468A SG 2014009468 A SG2014009468 A SG 2014009468A SG 2014009468 A SG2014009468 A SG 2014009468A
Authority
SG
Singapore
Prior art keywords
light
molding method
compression molding
reflector
emitting device
Prior art date
Application number
SG2014009468A
Other languages
English (en)
Inventor
Masanobu Ikeda
Hideo Nakayama
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of SG2014009468A publication Critical patent/SG2014009468A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
SG2014009468A 2011-08-25 2012-08-09 Compression molding method and device for light-emitting device reflector SG2014009468A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011183501A JP5764821B2 (ja) 2011-08-25 2011-08-25 圧縮成形方法及び装置
PCT/JP2012/070368 WO2013027601A1 (ja) 2011-08-25 2012-08-09 発光装置用リフレクタの圧縮成形方法及び装置

Publications (1)

Publication Number Publication Date
SG2014009468A true SG2014009468A (en) 2014-04-28

Family

ID=47746348

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2014009468A SG2014009468A (en) 2011-08-25 2012-08-09 Compression molding method and device for light-emitting device reflector

Country Status (6)

Country Link
JP (1) JP5764821B2 (ja)
KR (1) KR101927827B1 (ja)
CN (1) CN103764363B (ja)
SG (1) SG2014009468A (ja)
TW (1) TWI614109B (ja)
WO (1) WO2013027601A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6127660B2 (ja) * 2013-03-29 2017-05-17 株式会社カネカ 発光素子実装用リードフレーム、発光素子実装用樹脂成型体及びその製造方法、並びにトランスファ成型用金型
KR101504256B1 (ko) * 2013-12-11 2015-03-20 주식회사 루멘스홀딩스 발광 소자 패키지용 금형 장치
JP6298719B2 (ja) * 2014-06-09 2018-03-20 Ｔｏｗａ株式会社 樹脂封止装置及び樹脂封止方法
JP6546879B2 (ja) * 2016-05-26 2019-07-17 アピックヤマダ株式会社 樹脂成形金型および樹脂成形方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4484329B2 (ja) * 2000-07-21 2010-06-16 アピックヤマダ株式会社 樹脂封止方法及び樹脂封止装置
JP3897565B2 (ja) * 2001-10-25 2007-03-28 アピックヤマダ株式会社 樹脂封止装置及び樹脂封止方法
JP2003291147A (ja) * 2002-04-03 2003-10-14 Apic Yamada Corp 成型金型および樹脂封止装置
JP2005219297A (ja) 2004-02-04 2005-08-18 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2006027098A (ja) * 2004-07-16 2006-02-02 Apic Yamada Corp 樹脂モールド方法および樹脂モールド装置
JP2007142289A (ja) * 2005-11-21 2007-06-07 Sharp Corp 発光装置
JP2009124012A (ja) * 2007-11-16 2009-06-04 Towa Corp 電子部品の圧縮成形方法及び金型
JP4553944B2 (ja) * 2008-01-10 2010-09-29 アピックヤマダ株式会社 樹脂モールド方法および樹脂モールド装置
JP5174630B2 (ja) * 2008-11-26 2013-04-03 Ｔｏｗａ株式会社 光学成形品の圧縮成形方法
JP5419070B2 (ja) * 2009-03-13 2014-02-19 アピックヤマダ株式会社 樹脂封止装置
JP5327042B2 (ja) * 2009-03-26 2013-10-30 豊田合成株式会社 Ｌｅｄランプの製造方法
KR101140961B1 (ko) 2009-10-26 2012-05-03 삼성전기주식회사 광학소자용 패키지 기판 및 제조방법
JP2011140550A (ja) * 2010-01-06 2011-07-21 Shin-Etsu Chemical Co Ltd 光学素子ケース成形用付加硬化型シリコーン樹脂組成物及び光半導体装置
JP5562273B2 (ja) * 2011-03-02 2014-07-30 Ｔｏｗａ株式会社 光電子部品の製造方法及び製造装置

Also Published As

Publication number Publication date
CN103764363B (zh) 2016-09-14
KR20140053208A (ko) 2014-05-07
KR101927827B1 (ko) 2018-12-11
WO2013027601A1 (ja) 2013-02-28
TW201309457A (zh) 2013-03-01
JP5764821B2 (ja) 2015-08-19
JP2013043391A (ja) 2013-03-04
TWI614109B (zh) 2018-02-11
CN103764363A (zh) 2014-04-30

Similar Documents

Publication Publication Date Title
EP2753151A4 (en) LIGHTING METHOD AND LIGHT EMITTING DEVICE
EP2753150A4 (en) LIGHTING METHOD, AND LUMINESCENT DEVICE
TWI562423B (en) Light-emitting device and lighting device
GB2513221B (en) Lighting device
EP2751472A4 (en) LIGHTING DEVICE
EP2711995A4 (en) LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
PL2798265T3 (pl) Urządzenie odbłyśnika oraz urządzenie oświetleniowe zawierające takie urządzenie odbłyśnika
EP2742277A4 (en) ILLUMINATION DEVICE
EP2778505A4 (en) LIGHTING DEVICE AND PROJECTION SYSTEM
EP2732198A4 (en) ILLUMINATION DEVICE
EP2729733A4 (en) ILLUMINATION DEVICE
EP2560219A4 (en) LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP2730840A4 (en) ILLUMINATION DEVICE
EP2759763A4 (en) LIGHTING DEVICE
EP2748528A4 (en) LIGHTING DEVICE
EP2726776A4 (en) ILLUMINATION DEVICE
EP2704219A4 (en) METHOD FOR PRODUCING A LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE
EP2738446A4 (en) LIGHT-EMITTING DEVICE AND LIGHTING DEVICE
EP2720663A4 (en) COMPRESSION DEVICE
EP2701139A4 (en) LIGHT EMITTING DEVICE AND BLOCK FOR THE LIGHT EMITTING DEVICE
GB2489538B (en) Lighting device
GB2489513B (en) Lighting device
EP2687772A4 (en) LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING A RESIN BALL FOR THIS LIGHT EMITTING DEVICE
EP2778506A4 (en) LIGHTING DEVICE
EP2799209A4 (en) DEVICE AND METHOD FOR BLOW MOLDING