SG2014003156A - Adjustable current shield for electroplating processes - Google Patents

Adjustable current shield for electroplating processes

Info

Publication number
SG2014003156A
SG2014003156A SG2014003156A SG2014003156A SG2014003156A SG 2014003156 A SG2014003156 A SG 2014003156A SG 2014003156 A SG2014003156 A SG 2014003156A SG 2014003156 A SG2014003156 A SG 2014003156A SG 2014003156 A SG2014003156 A SG 2014003156A
Authority
SG
Singapore
Prior art keywords
adjustable current
electroplating processes
current shield
shield
electroplating
Prior art date
Application number
SG2014003156A
Other languages
English (en)
Inventor
Wilhelm Sandmann Gunther
Siury Kerstin
Schroiff Christian
Original Assignee
Globalfoundries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Globalfoundries Inc filed Critical Globalfoundries Inc
Publication of SG2014003156A publication Critical patent/SG2014003156A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
SG2014003156A 2013-02-18 2014-01-15 Adjustable current shield for electroplating processes SG2014003156A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/769,585 US20140231245A1 (en) 2013-02-18 2013-02-18 Adjustable current shield for electroplating processes

Publications (1)

Publication Number Publication Date
SG2014003156A true SG2014003156A (en) 2014-09-26

Family

ID=51264089

Family Applications (1)

Application Number Title Priority Date Filing Date
SG2014003156A SG2014003156A (en) 2013-02-18 2014-01-15 Adjustable current shield for electroplating processes

Country Status (6)

Country Link
US (1) US20140231245A1 (zh)
KR (1) KR20140103864A (zh)
CN (1) CN103993345A (zh)
DE (1) DE102014202114A1 (zh)
SG (1) SG2014003156A (zh)
TW (1) TW201433660A (zh)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8475636B2 (en) 2008-11-07 2013-07-02 Novellus Systems, Inc. Method and apparatus for electroplating
US9822461B2 (en) 2006-08-16 2017-11-21 Novellus Systems, Inc. Dynamic current distribution control apparatus and method for wafer electroplating
TWI550139B (zh) 2011-04-04 2016-09-21 諾菲勒斯系統公司 用於裁整均勻輪廓之電鍍裝置
US9909228B2 (en) 2012-11-27 2018-03-06 Lam Research Corporation Method and apparatus for dynamic current distribution control during electroplating
JP6335763B2 (ja) * 2014-11-20 2018-05-30 株式会社荏原製作所 めっき装置及びめっき方法
US9752248B2 (en) 2014-12-19 2017-09-05 Lam Research Corporation Methods and apparatuses for dynamically tunable wafer-edge electroplating
JP6335777B2 (ja) 2014-12-26 2018-05-30 株式会社荏原製作所 基板ホルダ、基板ホルダで基板を保持する方法、及びめっき装置
US9567685B2 (en) 2015-01-22 2017-02-14 Lam Research Corporation Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
JP6538541B2 (ja) * 2015-12-21 2019-07-03 株式会社荏原製作所 レギュレーションプレート、これを備えためっき装置及びめっき方法
WO2017120003A1 (en) 2016-01-06 2017-07-13 Applied Materials, Inc. Systems and methods for shielding features of a workpiece during electrochemical deposition
JP2017137519A (ja) * 2016-02-01 2017-08-10 株式会社荏原製作所 めっき装置
JP6891060B2 (ja) * 2017-07-11 2021-06-18 株式会社荏原製作所 レギュレーションプレート、アノードホルダ、及び基板ホルダ
JP7014553B2 (ja) * 2017-09-22 2022-02-01 株式会社荏原製作所 めっき装置
JP7193381B2 (ja) * 2019-02-28 2022-12-20 株式会社荏原製作所 めっき装置
EP3719180A1 (en) * 2019-04-04 2020-10-07 ATOTECH Deutschland GmbH Apparatus and method for electrochemically isolating a section of a substrate
JP7193418B2 (ja) * 2019-06-13 2022-12-20 株式会社荏原製作所 めっき装置
CN110284164B (zh) * 2019-08-06 2021-03-23 蚌埠富源电子科技有限责任公司 一种电子连接器针插孔镀金液及其电镀设备
JP7227875B2 (ja) * 2019-08-22 2023-02-22 株式会社荏原製作所 基板ホルダおよびめっき装置
CN110607543A (zh) * 2019-10-23 2019-12-24 新阳硅密（上海）半导体技术有限公司 可调节屏蔽装置以及利用其实现的电镀屏蔽方法
KR20220078494A (ko) * 2020-12-03 2022-06-10 가부시키가이샤 에바라 세이사꾸쇼 도금 장치 및 도금 방법
KR102470673B1 (ko) * 2021-05-20 2022-11-25 (주)네오피엠씨 애노드를 덮는 차폐판의 자동 이동장치
JP7074937B1 (ja) * 2021-06-04 2022-05-24 株式会社荏原製作所 めっき装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4027491B2 (ja) * 1998-03-03 2007-12-26 株式会社荏原製作所 ウエハのメッキ方法及び装置
JP2004225129A (ja) * 2003-01-24 2004-08-12 Ebara Corp めっき方法及びめっき装置
KR20120011476A (ko) * 2010-07-29 2012-02-08 현대제철 주식회사 연속주조를 위한 용강 공급 방법 및 용강 공급 노즐

Also Published As

Publication number Publication date
US20140231245A1 (en) 2014-08-21
KR20140103864A (ko) 2014-08-27
CN103993345A (zh) 2014-08-20
DE102014202114A1 (de) 2014-08-21
TW201433660A (zh) 2014-09-01

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