SG177391A1 - Method of manufacturing an injection-molded article - Google Patents
Method of manufacturing an injection-molded article Download PDFInfo
- Publication number
- SG177391A1 SG177391A1 SG2011096617A SG2011096617A SG177391A1 SG 177391 A1 SG177391 A1 SG 177391A1 SG 2011096617 A SG2011096617 A SG 2011096617A SG 2011096617 A SG2011096617 A SG 2011096617A SG 177391 A1 SG177391 A1 SG 177391A1
- Authority
- SG
- Singapore
- Prior art keywords
- molded article
- injection
- mold
- heat
- molding
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 50
- 238000000465 moulding Methods 0.000 claims abstract description 43
- 239000011342 resin composition Substances 0.000 claims abstract description 39
- 238000001746 injection moulding Methods 0.000 claims abstract description 24
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 4
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 abstract description 8
- 206010061592 cardiac fibrillation Diseases 0.000 abstract description 5
- 230000002600 fibrillogenic effect Effects 0.000 abstract description 5
- 238000002347 injection Methods 0.000 description 99
- 239000007924 injection Substances 0.000 description 99
- 229920006038 crystalline resin Polymers 0.000 description 41
- 239000007788 liquid Substances 0.000 description 31
- 125000003118 aryl group Chemical group 0.000 description 18
- 238000000034 method Methods 0.000 description 18
- 229920001721 polyimide Polymers 0.000 description 18
- 238000004506 ultrasonic cleaning Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 11
- 239000009719 polyimide resin Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 229920000728 polyester Polymers 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- -1 alicyclic diol Chemical class 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920006149 polyester-amide block copolymer Polymers 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 5
- 230000033228 biological regulation Effects 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 239000012778 molding material Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- FJKROLUGYXJWQN-UHFFFAOYSA-N 4-hydroxybenzoic acid Chemical compound OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- UITKHKNFVCYWNG-UHFFFAOYSA-N 4-(3,4-dicarboxybenzoyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 UITKHKNFVCYWNG-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- 229940090248 4-hydroxybenzoic acid Drugs 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 238000007088 Archimedes method Methods 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 241000357437 Mola Species 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- IMHDGJOMLMDPJN-UHFFFAOYSA-N dihydroxybiphenyl Natural products OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012847 fine chemical Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- ZHDTXTDHBRADLM-UHFFFAOYSA-N hydron;2,3,4,5-tetrahydropyridin-6-amine;chloride Chemical compound Cl.NC1=NCCCC1 ZHDTXTDHBRADLM-UHFFFAOYSA-N 0.000 description 1
- 208000015181 infectious disease Diseases 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 229920006259 thermoplastic polyimide Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3828—Moulds made of at least two different materials having different thermal conductivities
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/76—Measuring, controlling or regulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0079—Liquid crystals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
To provide a molding technology for obtaining a molded article from a liquid crystal resin composition to have a superior appearance, in which fibrillation of the surface of the injection-molded article is suppressed even if ultrasonically cleaned. In particular, to provide a molding technology that is implementable even under conditions where the mold temperature is no greater than 100°C. In injection molding of a liquid crystal resin composition, injection molding is performed using a mold having a heat-insulating layer formed on a mold inner surface, and under molding conditions that satisfy a certain relational formula, in which tl is thickness of the heat-insulating layer (pm), S is injection molding speed (mm/sec), t2 is thickness of the injection-molded article (mm), and T is mold temperature (°C). Preferably, molding is performed at a mold temperature no greater than 100°C.
Description
METHOD OF MANUFACTURING AN INJECTICN-MCLDED ARTICLE
The present invention relates to a method of manufacturing an injection-molded article using a liquid crystalline resin composition.
A group of plastics called engineering plastics exhibit high strength, and can be used in place of metal components.
Among these, a group of plastics called liquid crystalline resins maintains a crystalline structure when molten. Due to the crystalline structure, high strength is one of the characteristics of liguid crystalline resins. Furthermore, liquid crystalline resins have little volumetric change between molten and solidifying states due to low change in the crystalline structure when solidifying. As a result, there is an advantage in liquid crystalline resins in having low mold shrinkage and excelling in dimensional accurancy cf molded articles.
Capitalizing on the above such advantages of high strength and the dimensional accurancy being superior, liguid crystalline resin compositions have been adapted to be used in precision equipment components. However, in a case of precision equipment and optical equipment, a small amount of foreign particles, dust, etc. will affect equipment performance. As a result, for components used in precision
P-2121(PSTF-035)
equipment and optical equipment, e.g., components for camera modules and the like, ultrasonic cleaning 1s performed using water or the like to remove small foreign particles, oil content, dust, etc. adhering to the surface of the components.
However, for molded articles made by molding a liquid crystalline resin composition, the molecular orientation is particularly high in the surface portion, and thus the surface relatively easily fibrillates. As a result, if the surface of a molded article peels off, it will become a main contributor to fallen debris (foreign particles). Therefore, since the generation of foreign particles and the like is a problem, it is very difficult to ultrasonically clean molded articles made by molding a liquid crystalline resin composition.
The above-mentioned generation of foreign particles and the like occurs due to the molecular orientation being particularly high in the surface of the molded article as mentioned in the foregoing. Therefore, as a resin molded article with improved surface characteristics, a resin molded article containing liquid crystalline polymer and fiber filler has been disclosed that is characterized in having a flat surface for which a difference in the surface roughness Ra value obtained by a specific surface tape-peeling test is 0.4 um or less (Patent Document 1).
Bccording to the method described in Patent Document 1, it is useful for components of electric and electronic equipment or optical equipment, and makes it to prevent surface particle (foreign particle) generation. When using the technology
P-2121(PSTF-035)
described in Patent Document 1 in this way, an improvement in the surface characteristics is possible.
However, as described in the Examples of Patent Document 1, foreign particle generation according tc Patent Document 1 indicates foreign particles generating when cleaning a surface by gently stirring in purified water for 1 minute. Therefore, with the improvement in surface characteristics according to the method described in Patent Document 1, a result is not achieved that satisfies fibrillation suppression during ultrasonic cleaning. In other words, with the above-mentioned method described in Patent Document 1, an extraordinarily great amount of foreign particles will generate when exposing the resin molded article to severe conditions such as those of ultrascnic cleaning or the like.
In addition, with Patent Document 1, it is established that a higher mold temperature when molding is more preferable in order to suppress the generation ¢f the above-mentioned foreign particles and the like. Actually, molding was performed at conditions with a mold temperature of 130°C in the Examples of Patent Document 1. In the case of the condition of the mold temperature being set to a temperature exceeding 100°C, temperature regulation cannot be done using water, and thus temperature regulation must be performed using oil. As a result, from the point of view of facilitating the production of injection molded articles, it has been desired to mold under conditions of a mold temperature no higher than 100°C.
P-2121{(PSTE-035)
Furthermore, since the molecular orientation is particularly high at the surface portion of injection molded articles, surface fibrillation tends to occur and tends to fuzz if ultrasonic cleaning or the like is performed. As a result, a technology for surface characteristic improvement has been demanded that can be applied to injection molded articles.
In addition, the above such fuzz in the surface and the above such peeling of the molded article surface harm the appearance of the injection molded article. As a result, it has also been demanded to provide a superior external appearance to injection molded articles made by injection molding a liquid crystalline resin composition.
Patent Document 1: Japanese Unexamined Patent Application
Publication No. 2008-239950
Problems to be Solved by the Invention
The present invention has been made in order te solve the aforementioned such problems, and an cbject thereof is to provide a molding technelogy for obtaining a molded article from a liguid crystal resin composition to have a superior appearance, in which fibrillation of the surface of the injection-molded article is suppressed even if ultrasonically cleaned. In particular, it is to provide a molding technology practicable even at conditions of a mold temperature of no higher than 100°C.
P-2121(PSTF-035)
Means for Solving the Problems
The present inventors carried out diligent research in order tc solve the above-menticned problems. As a result, in injection molding of a liquid crystalline resin composition, it was found that the above-mentioned problems could be solved by using a mold in which a heat-insulating layer is formed on a mold inner surface, and injection molding under molding conditions satisfying a specific relational formula, in which tl is the thickness of the heat-insulating layer, $ is the injection speed, t2 is the thickness of the injection molded article, and T is the mold temperature. More specifically, the present invention provides the following.
According to a first aspect of the invention, in a method of manufacturing an injection-molded article by injection molding of a liquid crystal resin composition, injection molding is performed using a mold having a heat-insulating layer formed on a mold inner surface, and under molding conditions that satisfy the following formula (I), in which tl is thickness of the heat-insulating layer (um), S$ is injection molding speed (mm/sec), t2 is thickness of the injection- molded article (mm), and T is mold temperature (°C). (11x88) /t2+T21000- « (1)
According to a second aspect, in the method of manufacturing an injection molded article as described in the first aspect, injection molding is performed under molding conditions that satisfy the following formula (II). (1 1x8) S11 2+T1T22000- «(117
P-2121(PSTF-035)
According to a third aspect, in the method of manufacturing an injection molded article as described in the first or second aspect, the heat-insulating layer has a thermal conductivity of no more than 5 W/ {mK}.
According to a fourth aspect, in the method of manufacturing an injection molded article as described in any one of the first to third aspects, the heat-insulating layer includes a polyimide resin.
According to a fifth aspect, in the method of manufacturing an injection molded article as described in any one of the first to fourth aspects, the mold temperature is no greater than 100°C.
The injection molded articles obtained by the manufacturing method of the present invention do not generate fallen debris (foreign particles) from peeling of the molded article surface, even if ultrasonically cleaned. As a result, the injection molded articles to be used in precision equipment, cptical equipment and the like manufactured by the manufacturing method of the present invention can be subjected to ultrasonic cleaning easily, and thus the cleaning operation during component manufacturing can be performed more efficiently.
The injection molded articles cbtained by the manufacturing method of the present invention have a superior appearance. In particular, the surface of the injection molded articles obtained by the manufacturing method of the present
P-2121(PSTF-035)
invention will not easily peel cff; therefore, the attractive appearance tends to be maintained over a long period of Time.
The manufacturing method of the present invention can be performed under conditions in which the mold temperature is no higher than 100°C. Due to this, temperature regulation of the meld upon obtaining an injection molded article can be performed not with oil, but with water. As a result, a superior injection molded article can be obtained easily.
FIG. 1 is a view showing multi-layered structures of injection molded articles obtained according to the production method of the present invention;
FIG. 2 is a view showing multi-layered structures of injection molded articles obtained according te the production method of the conventional technology; and
FIG. 3 is a view showing a multi-layered structure of an injection molded article produced at conditions satisfying the formula (II).
Although embodiments of the present invention will be explained in detail hereinafter, the present invention is not to be at all limited to the following embodiment, and can be implemented by including suitable modifications within the scope of the object of the present invention.
In the injection molding of a liguid crystalline resin
P-2121(PSTF-033)
composition, the present invention is characterized in using a mold in which a heat-insulating layer is formed on a mold inner surface, and in injection molding at molding conditions satisfying a certain relational formula, in which tl is the thickness of the heat-insulating layer (um), 5 1s the injectiecn molding speed (mm/sec), t2 is the thickness of the injection-molded article (mm), and T is the mold temperature (°C). Hereinafter, the present invention will be explained in the order of a liquid crystalline resin composition, and a method of manufacturing an injection molded article.
Liguid Crystalline Resin Composition
The method of manufacturing an injection molded article of the present invention can be applied to all liquid crystalline resin compositions containing a liquid crystalline resin.
Liguid Crystalline Resin
Liquid crystalline resin indicates a melt processable polymer having a property of being able to form an optically anisotropic molten phase. The property of the anisotropic molten phase can be confirmed by a common method employing an orthogonal polarizer. More specifically, confirmation of the anisotropic molten phase can be performed using a Leitz polarizing microscope by observing a molten sample placed on a
Leitz hot stage at a magnification of 40 times under a nitrogen atmosphere. When a liquid crystalline resin that can be employed in the present invention is examined between an orthogonal polarizer, polarized light normally penetrates even if in a molten stationary state, for example, and thus
P2121{PSTF-035)
exhibits anisotropy optically.
Although the above such liguid crystalline resin is not particularly limited, it is preferably an aromatic polyester or aromatic polyester amide, and a polyester partly containing aromatic polyester or aromatic polyester amide in the same molecular chain is also in the scope thereof. When these are melted at 0.1% by weight concentration in pentafluorcophencl at 60°C, it is preferable to use a polyester having a inherent viscosity {I.V.) of at least about 2.0 dl/g, and more preferably 2.0 to 10.0 dl/g.
Particularly preferable as the aromatic polyester or aromatic polyester amide for liquid crystalline resins that can be employed in the present invention are an aromatic polyester, or aromatic polyester amide having at least one compound selected from the group of aromatic hydroxycarboxylic acid, aromatic hydroxylamine and aromatic diamine as a constituent component.
More specifically, (1) polyesters mainly composed of at least one of aromatic hydroxycarboxylic acid and derivatives thereof; (2) polyesters mainly composed of (a) at least one of aromatic hydroxycarboxylic acid and derivatives thereof, (b) at least one of aromatic dicarboxylic acid, alicyclic dicarboxylic acid and derivatives thereof; and (c¢) at least one of aliphatic diol, alicyclic diol, aliphatic diol and derivatives thereof; (3) polyester amides mainly composed of (a) at least one of aromatic hydroxycarboxylic acid and derivatives thereof, (Db)
P-2121(PSTF-035)
at least one of arcmatic hydroxylamine, aromatic diamine and derivatives thereof, and {(c} at least one of aromatic dicarboxylic acid, alicyclic dicarboxylic acid and derivatives thereof; (4) polyester amides mainly composed of (a) at least one of aromatic hydroxycarboxylic acid and derivatives thereof, (b} at least one of aromatic hydroxylamine, aromatic diamine and derivatives thereof, (c¢) at least one of aromatic dicarboxylic acid, alicyclic dicarboxylic acid and derivatives thereof, and (d) at least one aromatic diol, alicyclic diol, aliphatic dicl and derivatives thereof; etc. can be exemplified, and a molecular weight modifier may be further used together with the above-mentioned constituent components as necessary.
As preferred examples of specific compounds configuring the liquid crystalline resins that can be employed in the present invention, aromatic hydroxycarboxylic acids such as p- hydroxybenzoic acid, é6~hydroxy-2-napthoic acid, aromatic diols such as 2,6~naphthalenedicl, 1,4~dihydroxynaphthalene, 4,4"- dihydroxybiphenyl, hydroquinone, resorcin, and compounds represented by the following general formula (2) and the following general formula (B); aromatic dicarboxylic acids such as terepntalic acid, isophthalic acid, 4,4'- diphenyldicarboxylic acid, 2,é-naphthalenedicarboxylic acid, and compounds represented by the following general formula (CY): and aromatic amines such as p-aminophenol and p- phenylenediamine can be exemplified.
P2121(PSTF-035)
Ore csc LA) (X: is a group selected from an alkylene (C; to C4), alkydene, -0-, =S50~, =80p~, =~S5- and -~-CO-.) 0 on Ha 3 co - -(B) wooo—{ Hrd coo . a (0) {(Y: 1s a group selected from = {(CHz)n.~ {(n=1 to 4) and =O (CH) 0=- (n=1 to 4).)
Other Components
A composition imparted with a desired property by adding other resins, a nucleating agent, carbon black, pigment such as an inorganic calcined pigment, or an added agent such as an antioxidant, a stabilizer, a plasticizer, a lubricant, a mold release agent, a fire retardant, or the like to the liguid crystalline resin composition used in the present invention, in ranges not inhibiting the effects of the present invention, is also included in the liquid crystalline resin composition used in the present invention.
Method of Manufacturing Injection Molded Article
In the injection molding of the above-mentioned liquid crystalline resin composition, the method of manufacturing an injection molded article of the present invention uses a mold in which a heat-insulating layer is formed on a mold inner
P-2121(PSTF-035)
surface, and performs injection molding at molding conditions satisfy the following formula (I), in which tl is the thickness of the heat-insulating layer (pm), S is the infection molding speed (mm/sec), tZ is the thickness of the injection-molded article {mm}, and T 1s the mold temperature {°Cy. (L1xX8) /t2+T21000- «(13
Mold
In the method of manufacturing an injection molded article of the present invention, a mold is used in which a heat- insulating layer is formed on an inner surface of the mold (surface on the inside of the mold). Due to the heat- insulating layer formed on the surface inside of the mold, it is difficult for the liguid crystalline resin composition streamed into the mold to solidify in the vicinity of the mold surface. As a result, the molecules contained in the resin composition prior to sclidification contacting the resin composition that has solidified at the mold surface are drawn to the resin composition after sclidification thereof, whereby it is possible to suppress the molecular orientation from increasing at the molded article surface.
So long as the heat-insulating layer formed on the inner surface of the mold acts to delay the sclidification of the liquid crystalline resin composition at the mold surface, the materials and the like thereof are not particularly limited.
In addition, a meld on which a heat-insulating layer is formed on a portion of the mold inner surface is also included as the
P2121(PSTF035)
“mold in which a heat-insulating layey is formed in a mold inner surface. In the method of manufacturing an injection molded article of the present invention, it 1s necessary to form at least on the entirety of a mold inner surface portion corresponding to the portion of the molded article at which favorable appearance characteristics are desired, and it is preferable to form over the entirety of the mold inner surface.
The thickness {tl} of the heat-insulating layer is not particularly limited if adjusted sc as to satisfy the above formula (I) as described above. The thickness of the heat- insulating layer formed on the above-mentioned mold inner surface may be uniform, and may be contain a part of different thickness. In the case of the thickness of the heat-insulating layer not being uniform, the average thickness ig defined as tl.
In addition, the thermal conductivity of the heat- insulating layer formed on the mold inner surface is particularly preferably no more than 5 W/ (mK). By adjusting the thermal conductivity of the heat-insulating layer to the above-mentioned range, even if the injection molded article is molded at a mold temperature of 100°C or less, the molded article surface will not peel off while performing ultrasonic cleaning or the like, and thus an injection molded article having a superior appearance is more easily obtained. It should be noted that the above-mentioned thermal conductivity indicates the thermal conductivity measured by the method described in the Examples.
P2121{PSTF-035)
In addition, since a liquid crystalline resin composition of high temperature is poured into the mold during injection molding, the heat-insulating layer must have a heat-resisting property so as to withstand the high temperatures during molding.
The heat-insulating layer formed on the inner surface of the mold to be used in the method of manufacturing an injection melded article of the present invention preferably contains polyimide resin. This is because the polyimide resin has the above-mentioned thermal conductivity of no more than 5
W/ (mK), and has a heat-resisting property to adequately withstand the high temperatures during injection molding. As specific examples of polyimide resins that can be used, a pyromellitic acid (PMDA)-based polyimide, biphenyltetracarboxylic acid-based polyimide, polyamide-imide using trimellitic acid, bismaleimide-based resin (bhigmaleimide/triazine-based or the like), benzophenonetetracarboxylic acid-based polyimide, acetylene- terminated polyimide, a thermoplastic polyimide, and the like can be exemplified. It should be noted that a heat-insulating layer composed of a polyimide resin is particularly preferable.
As preferable materials other than polyimide resin, for example, a tetraflucoroethylene resin or the like can be exemplified.
The method of forming the heat-insulating layer on the inner surface of the mold is not particularly limited. For example, forming the heat-insulating layer on the inner
P2212 1(PSTE035)
surface of the mold by the following method is preferable.
A method of forming a heat-insulating layer such as a polyimide film by coating a solution of a polymer precursor such as a polyimide precursor that can form a pelymeric heat- insulating layer onto the mold surface, heating the solvent to evaporate, and then polymerizing by superheating; a method of vapor deposition polymerizing a monomer for a heat resistant polymer, e.g., pyromellitic anhydride and 4,4-diaminodiphenyl ether; or on a mold of planar shape, a method of forming heat- insulating layer adhered on a desired portion of a mold using a suitable fastening technique employing a polymeric heat- insulating film or a polymeric heat-insulating film of adhesive-tape form can be exemplified. In addition, it is also possible to form a polyimide film, and further form a chrome (Cry film or titanium nitride (TiN) film as a metallic skin layer on this surface,
Molding Conditions
The method of manufacturing an injection molded article of the present invention is characterized in performing injection molding under molding conditions that satisfy the relational formula of the following formula (I), in which tl is the thickness of the heat-insulating layer (um), S is the injection molding speed (mm/sec), t2 is the thickness of the injection-molded article {mm), and 7 is the mold temperature {°Cy. (1 1x8) Je 2-T210060 + «01
By manufacturing the injection molded article under the
P2121(PSTE035)
above such conditions, the boundary between the outer layer and skin layer in the injection molded article obtained will not exist in at least a portion of the injection molded article, as described below. Surface peeling of the injection molded article is caused by peeling cf the cuter layer further formed on the skin layer; however, in the present invention, an injection molded article that does not have this outer layer in at least a portion of the injection molded article is obtained. As a result, it is possible to obtain a high-quality injection molded article superior in the appearance and without peeling of the surface even if ultrascnically cleaned.
The injection molded article obtained by the method of manufacturing of the present invention is characterized by eliminating the boundary between the outer layer and the skin layer of the injection molded article at least in one part thereof. As a result of such an injection molded article being cbtained, the effect of suppressing surface peeling of the injection molded article is remarkably raised. The injection molded article having superior appearance for which peeling of the molded article surface is extremely reduced in this way is assumed to be obtained by preventing the liguid crystalline resin composition poured into the mold from immediately solidifying, and suppressing the molecules in the resin composition prior to solidification from being drawn by the solidified resin compesition, and the molecular orientation from increasing at the molded article surface.
The heat-insulating layer has a function of suppressing
P-2121(PSTF-035)
the resin composition from immediately solidifying at the mola surface when the liquid crystalline resin composition in the molten state is poured to the mold as described in the foregoing.
By improving the injection speed, the time for the resin composition to be filled into the mold shortens. In other words, the filling of the liquid crystalline resin composition into the mold can be completed at a stage at which solidifying of the liquid crystalline resin compositions has not progressed too much. As a result, it is possible To suppress the molecules of a portion prior to solidifying from being drawn by the hardened resin composition, and the molecular orientation from increasing at the molded article surface.
A long time is required to fill the liquid crystalline resin composition into the mold when the thickness of the injection molded article is excessively thick. As a result, when the thickness of the injection molded article is excessively thick, a phenomenon tends to occur whereby molecules of a portion prior to solidifying are drawn by the solidified resin composition and the molecular orientation at the molded article surface increases.
By setting the mold temperature T to be high, it is possible to delay the solidifying of the liquid crystalline resin composition in the vicinity of the inside surface of the mold in particular. As a result, it is possible to suppress a phenomenon whereby molecules of a portion prior to solidifying are drawn by the solidified resin composition and the
P-2121(PSTF-035)
molecular orientation at the molded article surface increases.
The characteristic of the present invention is in the aspect of having found that the boundary between the outer layer and skin layer of an injection molded article surface is eliminated by adjusting such that the heat-insulating layer thickness tl {pm}, injection speed 5 (mm/sec), mold temperature
T (°C), and injection molded article thickness £2 (mm) satisfy the above formula (I).
Then, with the present invention, a superior injection molded article in various forms (particularly in a case of t2 (mm} being thick as well) can be manufactured by adjusting the injection speed S (mm/sec), heat-insulating layer thickness tl (um), and mold temperature T (°C). This is because, if satisfying the above formula (I), the poundary between the outer layer and skin layer of the injection molded article will not exist at least in a pertion.
Tn addition, by injection molding at molding conditions satisfying the following formula (II), it becomes more difficult for surface peeling to occur, and it is possible to obtain an injection molded article having a remarkably superior appearance. More specifically, by performing injection molding at conditions satisfying the following formula (II), it becomes easier for a molded article to be obtained in which a boundary between the outer layer and skin layer is entirely nonexistent. Hereinafter, the manufacturing conditions of the manufacturing method of the present invention will be explained in detail.
P2121(PSTF-035)
(11x88) /t2+T22000- + -(11)
First, the heat-insulating layer thickness tl {um} will be explained. So long as the heat-insulating layer thickness ti is adjusted so as to satisfy the above formula (I), this thickness is not particularly limited. Although differing depending on the type of liquid crystalline resin composition used, shape of the injection molded article, and the like, it is preferable to adjust the heat-insulating layer thickness tl to 1 um to 1000 um in the manufacturing method of the present invention. Adjusting the heat-insulating layer thickness to at least 1 um is preferable in order for a suitable heat- insulating effect to be achieved, and adjusting to no more than 1000 pm is preferable for the reason of the precision of the molded article. More preferably, the heat-insulating layer thickness tl is from 10 pm to 300 pm.
Next, the injection speed S (mm/sec) will be explained.
Similarly to the above-mentioned heat-insulating layer thickness tl, the injection speed $ only needs to be adjusted so as to satisfy the above formula (I). Although differing depending on the type of liquid crystalline resin composition used, shape of the injection molded article, and the like, it is preferable to adjust the injection speed S in the range of mm/sec to 1000 m/sec in the manufacturing method of the present invention. Adjusting the injection speed to at least 20 mm/sec 1s preferable due te being able to prevent hesitation, and adjusting the injection speed to no more than 1000 mm/sec is preferable due to being able to prevent jetting.
P-2121(PSTF-(35)
More preferably, the injection speed is from 50 mm/sec to 500 mm/sec.
Next, the mold temperature T (°C) will be explained.
Similarly to the above heat-insulating layer thickness tl and the like, the mold temperature T only needs to be adjusted so as to satisfy the above formula (I). Although differing depending on the type of liquid crystalline resin composition used, shape of the injection molded article, and the like, it is preferable to adjust the mold temperature T to no higher than 100°C in the manufacturing method of the present invention. By setting the mold temperature to no higher than 100°C, the temperature regulation of the mold can be performed using water, and a high-guality injection molded article can be cbtained easily. More preferably, the range of mold temperature is from 50° to 100°C.
By adjusting the above-mentioned heat-insulating layer thickness tl, injection speed S$, and mold temperature 7, 1t is possible to adjust the injection molded article thickness t2 in a wide range. More specifically, under the conditions satisfying the above formula (I), it is possible to adjust the injection molded article thickness t2 to 0.2 mm to 10 mm.
Under the conditions satisfying the above formula (II), it is possible to set t2 to 0.2 mm to 5 mm. Although the above problems tend to arise particularly in the range of the injection molded article thickness t2 of 0.2 mm to 3 mm, it is possible to easily obtain a high-quality injection molded article having superior appearance without surface peeling by
P-2121(PSTF-035)
molding according to the manufacturing method of the present invention.
Injection Molded Article
When the liquid crystalline resin composition is molded, a multi-layer structure is formed. FIG. 1 shows multi-layered structures (from the central portion to surface portion} of injection molded articles obtained by the manufacturing method of the present invention. As shown in FIG. 1A, a boundary between the outer layer and skin layer does not exist in the injection molded article obtained by the manufacturing method of the present invention at least in a portion of the molded article surface. Therefore, even if performing ultrasonic cleaning or the like on an injection molded article obtained by way of the manufacturing method of the present invention, a portion at which surface peeling occurs is decreased, as shown in FIG. 1B.
In contrast, FIG. 2 shows multi-layered structures (from the central portion to surface portion) of injection molded articles obtained according to a manufacturing method of the conventional technology. As shown in FIG. 2A, an outer layer exists at the entire surface of the injection molded article.
Therefore, when performing ultrasonic cleaning or the like on the injection molded article obtained according to the manufacturing method of the conventional technology, surface peeling occurs at the entire surface, as shown in FIG. ZB.
Furthermore, FIG. 3 shows the multi-layered structure (from the central portion to surface portion} of an injection
P2121(PSTF-035)
molded article manufactured under conditions satisfying the above formula (II). As shown in FIG. 3, even among the injection molded articles obtained according to the manufacturing method of the present invention, a boundary between the outer layer and skin layer tends to be entirely nonexistent for the injection molded article manufactured under conditions satisfying the above formula (II). Therefore, even if performing ultrasonic cleaning or the like, an injection molded article is formed for which it is remarkably difficult for surface peeling to cccur.
As in the foregoing, the injection molded article obtained by way of the manufacturing method of the present invention has a superior appearance, without peeling of the surface occurring, even if performing ultrasonic cleaning. Furthermore, by setting the mold temperature to no more than 100°C, a high- quality injection molded article can be obtained easily.
Hereinafter, the present invention will be explained in further detail based on Examples; however, the present invention is not to be limited by these Examples.
Materials
Liquid crystalline resin 1: “Vectra (registered trademark) £13017, containing glass fiber 30% by mass, melting point 335°C, melt viscosity 40 Pas (manufactured by Polyplastics
Co., Ltd.)
Heat-insulating layer formation material 1: polyimide resin
P-2121(PSTF-035)
tape (manufactured by Sumitomo 3M Limited), thermal conductivity 0.2 W/ (mK)
Heat-insulating layer formation material 2: polyimide resin varnish (manufactured by Fine Chemicals Japan), thermal conductivity 0.2 W/ (mK)
Heat-insulating layer formation material 3: polyimide resin film (manufactured by DuPont Toray Co., Ltd.), thermal conductivity 0.2 W/ (mK)
The thermal conductivities of the above-mentioned polyimide resins were calculated by measuring the coefficient of thermal diffusivity according to the laser flash method, the specific gravity according to the Archimedes method, and the gpecific heat using a D3C.
Example 1
Using the liguid crystalline resin 1 as a molding material, the heat-insulating layer formation material 1 was pasted on the mold cavity surface of a mold for sheet molding with 20 mm width, 50 mm length, and 0.5 mm thickness, and melding was performed under molding conditions such as the injection speed and the mold temperature in Table 1, whereby an injection molded article was obtained. It should be noted that the conditions other than rhe molding conditions shown in the table are as follows.
Molding Conditions
Cylinder set temperature: 350°C
Screw rotation speed: 150 rpm
Example 2
P-2121(PSTF035)
Using the liquid crystalline resin 1 as a molding material, the heat-insulating layer formation material 2 was sprayed onto the mold cavity surface of a mold for sheet molding of a 40 mm square with 1 mm thickness, baked for one hour, after which the polyimide surface was polished to adjust to the neat-insulating layer thickness in Table 1, and then molding was performed under molding conditions such as the injection speed and the mold temperature in Table 1, whereby an injection molded article was obtained. It should ke noted that the molding conditions other than those shown in Table 1 are the same as Example 1.
Example 3
Bn injection molded article was manufactured by the same method as Example 2 except for changing the molding conditions to the conditions shown in Table 1. It should be noted that the molding conditions other than those shown in Table 1 are similar to Example 1.
Example 4
Using the liquid crystalline resin 1 as a molding material, the heat-insulating layer formation material 3 was applied with double-sided tape onto the mold cavity surface of an IS0 standard test piece mold, and molding was performed under molding conditions such as the injection speed and the mold temperature in Table 1, whereby an injection molded article was obtained. It should be noted that the molding conditions other than those shown in Table 1 are the same as Example 1.
Example 5
P-2121(PSTF-035)
An injection molded article was manufactured by the same method as Example 4 except for changing the molding conditions to the conditions shown in Table 1. It should be noted that the molding conditicns other than those shown in Table 1 are the same as Example 1.
Comparative Example 1 an injection molded article was manufactured by the same method as Example 4 except for changing the molding conditions +o the conditions shown in Table 1. It should be noted that the molding conditions other than those shown in Table 1 are the same as Example 1.
Comparative Example 2
An injection molded article was manufactured by the same method as Example 1 except for a heat-insulating layer not being formed in the mold.
Comparative Example 3
An injection molded article was manufactured by the same method as Comparative Example 2 except for changing the molding conditions to the conditions shown in Table 1. It should be noted that the molding conditions other than those shown in Table 1 are the same as Example 1.
Evaluation of Molded Articles
Cross-cut adhesion test evaluation and ultrasonic cleaning test evaluation were carried out on the injection molded articles of the Examples and Comparative Examples.
Cross-cut Adhesion Test Evaluation
The evaluation was performed by a method based on JIS
P2121{PSTF-035)
K5400, and evaluation was performed by the number of grid cells peeled among one hundred l-mm square grid cells. The evaluation test results are shown in Table 1.
Ultrasonic Cleaning Test Evaluation
The injection molded articles of the Examples and
Comparative Examples were immersed in water, ultrasonic cleaning was conducted for 1 minute, and the fibril generation situation of the surface was measured as a whitening phenomenon of the surface, whereby the existence of fibril generation was evaluated. The evaluation test results are shown in Table 1. [table 11]
P-2121{(PSTF-035)
: Comp { Comp | Comp arat arat arat
Exam Exam Exam Exam Exam . . . le 1 le 2 le 3 le 4 les ve VE Ve
P b Pp P p Exam Exam Exam pletl i plez2 | pled
PI Film
Thickness (xt) | 70 10 20 125 125 125 (um) iniection speed (8) 50 200 100 50 200 15 200 200 (mm/sec) ; i
Molded Article
Thickness (2) 1 4 4 4 0.5 0.5 {mm) mold temperature (T} | 80 100 100 100 140 (°c) ore [am a ene [sel |e
Cross=- the cut . , peell
Adhesion ng 0 0 0 23 100 100
Test _ i numbe !
Evaiuati i r on i i: Exist i
Ultrason i . ence ic Non- Non- Non-— . Non- . . , . of . . . Exis . Exls Exis Exis
Cleaning | Exis Exis Exis Exig
Fibril Ltenc Lenc tenc tenc
Test . tenc ! tenc | tenc tenc i i a e a a
Evaluati e e e © !
Gener i on ation
[0073]
Ls is evident from Table 1, it has been clarified that surface peeling does not easily occur in the injection molded article obtained by the manufacturing method of present invention, as is evident from the peeling number in the cross- cut adhesion test evaluation. Since surface peeling does not easily occur in the injection molded article obtained according to the manufacturing method of the present invention in this way, it is possible toc maintain a clean appearance.
P-2121(PSTF-033)
In addition, as is evident from Table 1, a result of fibril generation entirely nc occurring was obtained from the ultrasonic cleaning test evaluation for Examples 1 to 3 and 5.
It has been confirmed for Examples 1 to 3 and & that a boundary between the outer layer and skin layer does not exist in the injection molded article surface. In addition, although fibril generation of the surface occurred in Example 4, the generated area thereof is extremely small when compared with the generated area of fibrillation occurring in the molded article surface of the Comparative Examples. Therefore, it has been confirmed that a boundary between the outer layer and skin layer exists in a part of Example 4.
It has been confirmed that the manufacturing method of the present invention can manufacture a high-quality injection molded article even under conditions of a mold temperature no higher than 100°C.
As is evident from the results of Examples 1 to 3 and 5 and the result of Example 4, it has been confirmed that a superior injection molded article is obtained for which a boundary between the outer layer and skin layer does not exist, by performing manufacturing of the injection molded article under conditions satisfying the above formula (II).
P-2121(PSTF-035)
Claims (5)
1. A method of manufacturing an injection-molded article by injection molding of a liquid crystal resin composition, wherein injection molding is performed using a mold having a heat-insulating layer formed on a meld inner surface, and under molding conditions that satisfy the following formula (I), wherein tl is thickness of the heat-insulating layer (pmj, 8 is injection molding speed (mm/sec), t2 is thickness of the injection-molded article (mm), and T is meld temperature (°C). (11 x8) Jr 2+T21000 + « -{1)
2. The method of manufacturing an injection-molded article according to claim 1, wherein injection molding is performed under molding conditions that satisfy the following formula (II). (1 1X8) Jt 2+1T22000- +011)
3. The method of manufacturing an injection-molded article according to claim 1 or 2, wherein the heat-insulating layer has a thermal conductivity of no more than 5 W/ (mK).
4, The method of manufacturing an injection-molded article according to any cne of claims 1 tc 3, wherein the heat- insulating layer includes a peclyimide resin.
5. The method of manufacturing an injection-molded article P-2121(PSTF-035)
according to any one of claims 1 to 4, wherein the mold temperature T is no greater than 100°C.
P-2121{PSTF-035)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009155631A JP5642947B2 (en) | 2009-06-30 | 2009-06-30 | Manufacturing method of injection molded products |
PCT/JP2010/061021 WO2011001959A1 (en) | 2009-06-30 | 2010-06-29 | Method for producing injection-molded article |
Publications (1)
Publication Number | Publication Date |
---|---|
SG177391A1 true SG177391A1 (en) | 2012-02-28 |
Family
ID=43411032
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG2011096617A SG177391A1 (en) | 2009-06-30 | 2010-06-29 | Method of manufacturing an injection-molded article |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP5642947B2 (en) |
KR (1) | KR20120111943A (en) |
CN (1) | CN102470564A (en) |
SG (1) | SG177391A1 (en) |
TW (1) | TW201103732A (en) |
WO (1) | WO2011001959A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5869874B2 (en) * | 2011-12-27 | 2016-02-24 | Hoya株式会社 | Manufacturing method of plastic lens |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06198667A (en) * | 1992-12-28 | 1994-07-19 | Asahi Chem Ind Co Ltd | Injection molding method of synthetic resin |
JP2001287244A (en) * | 2000-04-05 | 2001-10-16 | Asahi Kasei Corp | Two-layer molding and its molding method |
JP5332188B2 (en) * | 2007-02-26 | 2013-11-06 | 住友化学株式会社 | Resin molded body and method for producing the same |
-
2009
- 2009-06-30 JP JP2009155631A patent/JP5642947B2/en active Active
-
2010
- 2010-06-29 CN CN2010800291596A patent/CN102470564A/en active Pending
- 2010-06-29 KR KR1020117030882A patent/KR20120111943A/en not_active Application Discontinuation
- 2010-06-29 SG SG2011096617A patent/SG177391A1/en unknown
- 2010-06-29 WO PCT/JP2010/061021 patent/WO2011001959A1/en active Application Filing
- 2010-06-29 TW TW099121173A patent/TW201103732A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW201103732A (en) | 2011-02-01 |
JP5642947B2 (en) | 2014-12-17 |
WO2011001959A1 (en) | 2011-01-06 |
KR20120111943A (en) | 2012-10-11 |
JP2011011380A (en) | 2011-01-20 |
CN102470564A (en) | 2012-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5332188B2 (en) | Resin molded body and method for producing the same | |
KR101848934B1 (en) | Liquid crystal polyester resin composition | |
KR101986075B1 (en) | Liquid crystal polyester composition, method for producing liquid crystal polyester composition, and molded product | |
JP5556223B2 (en) | Liquid crystal polymer composition, method for producing the same, and molded article | |
WO2010050327A1 (en) | Liquid-crystalline resin composition for injection molding, molded object obtained by molding the resin composition, and camera module comprising the molded object | |
TW202128857A (en) | LCP resin composition for circuit boards, LCP film for circuit boards and method for producing same | |
JP5197553B2 (en) | Liquid crystalline resin composition and molded product thereof | |
US20120175816A1 (en) | Method for manufacturing an injection-molded article | |
JP2011104789A (en) | Method of manufacturing metallic composite laminated component | |
JP2011202062A (en) | Thermoplastic resin composition for sliding, method for producing thermoplastic resin composition for sliding, and sliding part | |
JP6476844B2 (en) | Biaxially oriented polypropylene film | |
SG177391A1 (en) | Method of manufacturing an injection-molded article | |
JP5806025B2 (en) | High insulation film | |
SG186310A1 (en) | Method for manufacturing a mold | |
JP5407988B2 (en) | Liquid crystalline resin composition and molded product thereof | |
JP2012031396A (en) | Adhesive tape and electric/electronic instrument device | |
JP5520311B2 (en) | Plating resin molded body, method for producing plated resin molded body, plated resin molded body and molded circuit board | |
KR102507218B1 (en) | Thermotropic liquid crystal polyester resin composition and manufacturing method thereof. | |
JPH02263849A (en) | Polyolefin molded product | |
JP3223053U (en) | Injection molded body | |
KR20130056179A (en) | Material for fiber manufacturing and fiber | |
WO2012121075A1 (en) | Production method for injection-molded article | |
KR20120010134A (en) | Solution composition and method for producing copper-clad laminate using the same | |
JPH01165647A (en) | Polyvinylidene fluoride molding | |
JPH0881618A (en) | Liquid crystal polyester resin composition |