SG173068A1 - Methods for examining a bonding structure of a substrate and bonding structure inspection devices - Google Patents
Methods for examining a bonding structure of a substrate and bonding structure inspection devices Download PDFInfo
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- SG173068A1 SG173068A1 SG2011052479A SG2011052479A SG173068A1 SG 173068 A1 SG173068 A1 SG 173068A1 SG 2011052479 A SG2011052479 A SG 2011052479A SG 2011052479 A SG2011052479 A SG 2011052479A SG 173068 A1 SG173068 A1 SG 173068A1
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- light
- wire
- die
- bonding structure
- camera
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- H01L2924/102—Material of the semiconductor or solid state bodies
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- General Physics & Mathematics (AREA)
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- Pathology (AREA)
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US15068609P | 2009-02-06 | 2009-02-06 | |
PCT/SG2010/000042 WO2010090605A1 (fr) | 2009-02-06 | 2010-02-08 | Procédés d'examen d'une structure de liaison d'un substrat et dispositifs d'inspection de structure de liaison |
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SG173068A1 true SG173068A1 (en) | 2011-08-29 |
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SG2011052479A SG173068A1 (en) | 2009-02-06 | 2010-02-08 | Methods for examining a bonding structure of a substrate and bonding structure inspection devices |
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CN (1) | CN102439708B (fr) |
MY (1) | MY169616A (fr) |
SG (1) | SG173068A1 (fr) |
WO (1) | WO2010090605A1 (fr) |
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KR101614061B1 (ko) * | 2012-03-29 | 2016-04-20 | 주식회사 고영테크놀러지 | 조인트 검사 장치 |
SG2013084975A (en) * | 2013-11-11 | 2015-06-29 | Saedge Vision Solutions Pte Ltd | An apparatus and method for inspecting asemiconductor package |
WO2015088658A2 (fr) | 2013-12-11 | 2015-06-18 | Fairchild Semiconductor Corporation | Ponteuse intégrée et système de mesurage 3d avec rejet de défauts |
JP6267366B2 (ja) | 2014-05-05 | 2018-01-24 | アーコニック インコーポレイテッドArconic Inc. | 溶接測定装置及び方法 |
US9759547B2 (en) * | 2014-08-19 | 2017-09-12 | The Boeing Company | Systems and methods for fiber placement inspection during fabrication of fiber-reinforced composite components |
CN104483331A (zh) * | 2014-12-03 | 2015-04-01 | 东莞市神州视觉科技有限公司 | 一种连接器插针三维检测方法、装置及系统 |
CN104504386B (zh) * | 2014-12-08 | 2017-12-01 | 深圳市浦洛电子科技有限公司 | 一种模块化aoi定位方法、系统及烧录ic设备 |
CN104538336A (zh) * | 2015-01-07 | 2015-04-22 | 海太半导体(无锡)有限公司 | 一种用于半导体封装的设备的报警识别与处理系统及方法 |
DE102015109431A1 (de) * | 2015-06-12 | 2016-12-15 | Witrins S.R.O. | Inspektionssystem und Verfahren zur Fehleranalyse von Drahtverbindungen |
CN105374700B (zh) * | 2015-11-26 | 2018-01-16 | 北京时代民芯科技有限公司 | 一种高密度集成电路键合精度控制方法 |
WO2017117566A1 (fr) * | 2015-12-31 | 2017-07-06 | Industrial Dynamics Company, Ltd. | Système et procédé d'inspection de récipients à l'aide de multiples images de ceux-ci |
WO2017155470A1 (fr) | 2016-03-09 | 2017-09-14 | Agency For Science, Technology And Research | Procédé d'inspection à autodétermination pour inspection de connexion de fil optique automatisée |
JP6673268B2 (ja) * | 2017-03-14 | 2020-03-25 | オムロン株式会社 | 管理装置、管理装置の制御方法、情報処理プログラム、および記録媒体 |
CN110030923B (zh) * | 2018-01-12 | 2021-09-28 | 联合汽车电子有限公司 | 连接器Pin针检测系统及其检测方法 |
CN109003911B (zh) * | 2018-08-02 | 2021-07-20 | 安徽大华半导体科技有限公司 | 一种半导体芯片引脚成型缺陷检测的方法 |
CN111192233B (zh) * | 2018-11-14 | 2022-04-12 | 长鑫存储技术有限公司 | 半导体结构的制备方法及其制备装置 |
CN110346381B (zh) * | 2019-08-12 | 2022-03-08 | 衡阳师范学院 | 一种光学元件损伤测试方法及装置 |
JP6996699B2 (ja) * | 2020-01-14 | 2022-01-17 | トヨタ自動車株式会社 | バルブ当たり面の検査方法及び検査装置 |
JP7373436B2 (ja) * | 2020-03-09 | 2023-11-02 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
US11721571B2 (en) * | 2020-10-14 | 2023-08-08 | Emage Vision Pte. Ltd. | Loop height measurement of overlapping bond wires |
CN112308073B (zh) * | 2020-11-06 | 2023-08-25 | 中冶赛迪信息技术(重庆)有限公司 | 废钢火车装卸料转载状态识别方法、系统、设备及介质 |
CN113611036B (zh) * | 2021-07-15 | 2022-12-06 | 珠海市运泰利自动化设备有限公司 | 一种精密测试自动校准方法 |
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US5243406A (en) * | 1990-07-04 | 1993-09-07 | Fujitsu Limited | Method and apparatus for measuring three-dimensional configuration of wire-shaped object in a short time |
US6072898A (en) * | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
GB2347741A (en) * | 1998-11-05 | 2000-09-13 | Cyberoptics Corp | Electronics assembly apparatus with improved imaging system |
SG73563A1 (en) * | 1998-11-30 | 2000-06-20 | Rahmonic Resources Pte Ltd | Apparatus and method to measure three-dimensional data |
US6724489B2 (en) * | 2000-09-22 | 2004-04-20 | Daniel Freifeld | Three dimensional scanning camera |
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- 2010-02-08 CN CN201080015400.XA patent/CN102439708B/zh active Active
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CN102439708A (zh) | 2012-05-02 |
MY169616A (en) | 2019-04-23 |
WO2010090605A1 (fr) | 2010-08-12 |
CN102439708B (zh) | 2016-03-02 |
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