SG165400A1 - Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium - Google Patents

Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium

Info

Publication number
SG165400A1
SG165400A1 SG201006813-8A SG2010068138A SG165400A1 SG 165400 A1 SG165400 A1 SG 165400A1 SG 2010068138 A SG2010068138 A SG 2010068138A SG 165400 A1 SG165400 A1 SG 165400A1
Authority
SG
Singapore
Prior art keywords
cleaning
substrate cleaning
program
cleaning device
substrate
Prior art date
Application number
SG201006813-8A
Other languages
English (en)
Inventor
Yuji Takimoto
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of SG165400A1 publication Critical patent/SG165400A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Liquid Crystal (AREA)
  • Cleaning By Liquid Or Steam (AREA)
SG201006813-8A 2005-10-05 2006-09-20 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium SG165400A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005292991A JP2007103741A (ja) 2005-10-05 2005-10-05 基板洗浄装置及び基板洗浄方法並びに基板洗浄プログラム

Publications (1)

Publication Number Publication Date
SG165400A1 true SG165400A1 (en) 2010-10-28

Family

ID=37906092

Family Applications (1)

Application Number Title Priority Date Filing Date
SG201006813-8A SG165400A1 (en) 2005-10-05 2006-09-20 Substrate cleaning apparatus, substrate cleaning method, substrate cleaning program and program recording medium

Country Status (8)

Country Link
US (1) US8043436B2 (ja)
EP (1) EP1933374B1 (ja)
JP (1) JP2007103741A (ja)
KR (1) KR100928879B1 (ja)
CN (1) CN100543942C (ja)
SG (1) SG165400A1 (ja)
TW (1) TW200717630A (ja)
WO (1) WO2007040049A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100131970A (ko) * 2007-12-21 2010-12-16 아빌라 테라퓨틱스, 인크. Ｈｃｖ 프로테아제 억제제 및 이의 용도
JP5199792B2 (ja) * 2008-08-28 2013-05-15 株式会社Ｓｏｋｕｄｏ 基板処理ユニット、基板処理装置および基板処理方法
JP5620530B2 (ja) * 2013-02-15 2014-11-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板処理ユニットおよび基板処理装置
TWI636518B (zh) * 2013-04-23 2018-09-21 荏原製作所股份有限公司 基板處理裝置及處理基板之製造方法
JP6370084B2 (ja) * 2014-04-10 2018-08-08 株式会社荏原製作所 基板処理装置
JP6928797B2 (ja) 2015-11-14 2021-09-01 東京エレクトロン株式会社 希ｔｍａｈを使用してマイクロエレクトロニック基板を処理する方法
JP6868991B2 (ja) * 2016-09-26 2021-05-12 東京エレクトロン株式会社 基板処理装置および基板処理方法
CN106449488A (zh) * 2016-11-23 2017-02-22 上海华力微电子有限公司 槽式湿法清洗设备的控制方法
CN110134027B (zh) * 2018-02-09 2021-12-10 富泰华精密电子（郑州）有限公司 表面处理控制系统、表面处理方法及存储设备
JP7494746B2 (ja) * 2021-01-28 2024-06-04 トヨタ自動車株式会社 自律移動システム、自律移動方法及び自律移動プログラム
CN113731907B (zh) * 2021-08-13 2022-05-31 江苏吉星新材料有限公司 蓝宝石产品清洗方法及清洗装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088324A (ja) * 1994-06-23 1996-01-12 Hitachi Ltd 自動搬送装置
JP3572113B2 (ja) 1995-03-24 2004-09-29 シチズン時計株式会社 Ｎｃ工作機械の制御方法
US6951221B2 (en) * 2000-09-22 2005-10-04 Dainippon Screen Mfg. Co., Ltd. Substrate processing apparatus
JP3782298B2 (ja) * 2000-10-25 2006-06-07 東京エレクトロン株式会社 洗浄処理装置
KR100877044B1 (ko) * 2000-10-02 2008-12-31 도쿄엘렉트론가부시키가이샤 세정처리장치
ITBO20010161A1 (it) 2001-03-21 2002-09-21 Azionaria Costruzioni Automati Apparecchiatura per riempire contenitori con materiali, preferibilmente liquidi
US7094440B2 (en) * 2002-01-22 2006-08-22 Tokyo Electron Limited Substrate treatment method and substrate treatment apparatus
JP2005228961A (ja) 2004-02-13 2005-08-25 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP4514224B2 (ja) * 2005-09-28 2010-07-28 東京エレクトロン株式会社 リンス処理方法、現像処理方法及び現像装置

Also Published As

Publication number Publication date
EP1933374A1 (en) 2008-06-18
TWI314756B (ja) 2009-09-11
EP1933374B1 (en) 2012-04-11
US20090260655A1 (en) 2009-10-22
CN101283440A (zh) 2008-10-08
JP2007103741A (ja) 2007-04-19
CN100543942C (zh) 2009-09-23
US8043436B2 (en) 2011-10-25
KR20070088772A (ko) 2007-08-29
EP1933374A4 (en) 2011-01-05
TW200717630A (en) 2007-05-01
KR100928879B1 (ko) 2009-11-30
WO2007040049A1 (ja) 2007-04-12

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