SG152128A1 - Chip transporting method and the device thereof - Google Patents

Chip transporting method and the device thereof

Info

Publication number
SG152128A1
SG152128A1 SG200806633-4A SG2008066334A SG152128A1 SG 152128 A1 SG152128 A1 SG 152128A1 SG 2008066334 A SG2008066334 A SG 2008066334A SG 152128 A1 SG152128 A1 SG 152128A1
Authority
SG
Singapore
Prior art keywords
chip
collet portion
decrease
pick
placing position
Prior art date
Application number
SG200806633-4A
Inventor
Shigeo Kawabe
Original Assignee
Emutech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Emutech Co Ltd filed Critical Emutech Co Ltd
Priority to SG200806633-4A priority Critical patent/SG152128A1/en
Publication of SG152128A1 publication Critical patent/SG152128A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Die Bonding (AREA)

Abstract

The invention has been made to provide a chip transporting method and the device thereof that is provided with a collet portion for adsorbing at a chip a chip pick-up position and transport the chip to a chip placing position, wherein the collet portion is moved with parallel motion between the chip pick-up position and the chip placing position, thereby to decrease substantially three (3) steps of operation of the collet portion as compared with the prior art, remarkably enhance the chip transporting efficiency, decrease the number of components of the device, decrease the operation rate , that is the rotation number of drive motors, thereby to decrease the motor rotation number to avoid the consumption of drive motors and thereby to remarkably decrease the production cost of the device. The invention substantially comprises a collet portion 12, for picking up a chip 4 from a semiconductor wafer 1, a Z axis drive mechanism 13, for reciprocatingly moving the collet portion slightly to and away from the wafer 1, in Z axis direction, a axis rotating mechanism 14 for reciprocatingly rotating an arm 45 to move the collet portion with parallel motion so as to enable the collet portion to pick up and transport the chip from the chip pick-up position 6 to the chip placing position 9.
SG200806633-4A 2007-10-23 2008-09-10 Chip transporting method and the device thereof SG152128A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200806633-4A SG152128A1 (en) 2007-10-23 2008-09-10 Chip transporting method and the device thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007300990A JP2009105357A (en) 2007-10-23 2007-10-23 Conveying method and device for chip
SG200804818-3A SG152115A1 (en) 2007-10-23 2008-06-25 Chip transporting method and the device thereof
SG200806633-4A SG152128A1 (en) 2007-10-23 2008-09-10 Chip transporting method and the device thereof

Publications (1)

Publication Number Publication Date
SG152128A1 true SG152128A1 (en) 2009-05-29

Family

ID=40630655

Family Applications (2)

Application Number Title Priority Date Filing Date
SG200804818-3A SG152115A1 (en) 2007-10-23 2008-06-25 Chip transporting method and the device thereof
SG200806633-4A SG152128A1 (en) 2007-10-23 2008-09-10 Chip transporting method and the device thereof

Family Applications Before (1)

Application Number Title Priority Date Filing Date
SG200804818-3A SG152115A1 (en) 2007-10-23 2008-06-25 Chip transporting method and the device thereof

Country Status (5)

Country Link
JP (1) JP2009105357A (en)
KR (1) KR20090041308A (en)
CN (1) CN101419927A (en)
SG (2) SG152115A1 (en)
TW (1) TW200919627A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6306927B2 (en) * 2014-04-15 2018-04-04 株式会社荏原製作所 Inversion machine, substrate processing apparatus, and tilt adjustment method of inversion machine
JP6484823B2 (en) * 2016-09-02 2019-03-20 パナソニックＩｐマネジメント株式会社 Component transfer mechanism and component mounting device
CN108565234B (en) * 2018-05-29 2024-06-21 上海科发电子产品有限公司 Substrate finishing device for flip-chip assembly of semiconductor device
KR102145848B1 (en) * 2018-11-02 2020-08-19 세메스 주식회사 Die transfer module and die bonding apparatus having the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189228A (en) * 1984-03-08 1985-09-26 Shinkawa Ltd Chip taping apparatus
US4778332A (en) * 1987-02-09 1988-10-18 The Perkin-Elmer Corporation Wafer flip apparatus
US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6164899A (en) * 1999-04-22 2000-12-26 Automated Concepts, Inc. Disk transfer apparatus
US20070137031A1 (en) * 2003-01-16 2007-06-21 Bosch Johannes Wilhelmus D Chip transfer method and apparatus

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60189228A (en) * 1984-03-08 1985-09-26 Shinkawa Ltd Chip taping apparatus
US4778332A (en) * 1987-02-09 1988-10-18 The Perkin-Elmer Corporation Wafer flip apparatus
US5135349A (en) * 1990-05-17 1992-08-04 Cybeq Systems, Inc. Robotic handling system
US5915910A (en) * 1997-08-29 1999-06-29 Daitron, Inc. Semiconductor wafer transfer method and apparatus
US6164899A (en) * 1999-04-22 2000-12-26 Automated Concepts, Inc. Disk transfer apparatus
US20070137031A1 (en) * 2003-01-16 2007-06-21 Bosch Johannes Wilhelmus D Chip transfer method and apparatus

Also Published As

Publication number Publication date
KR20090041308A (en) 2009-04-28
JP2009105357A (en) 2009-05-14
CN101419927A (en) 2009-04-29
TW200919627A (en) 2009-05-01
SG152115A1 (en) 2009-05-29

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