JP6484823B2 - Component transfer mechanism and component mounting device - Google Patents

Description

  The present invention relates to a component transfer mechanism that transfers a component from a first position to a second position, and a component mounting apparatus that includes the component transfer mechanism and mounts a component on a substrate.

  Conventionally, as a component mounting apparatus for mounting components on a substrate, a component (die) cut out from a semiconductor wafer is picked up by a component transfer mechanism and transferred to a relay stage, and then transferred from the relay stage to the substrate by a mounting head. A configuration in which parts are mounted is known. In this case, the component transfer mechanism recognizes the component positioned at the first position (pickup position) by the camera provided above, then picks up the component with the nozzle, moves the nozzle, and moves the component to the first position. It becomes the structure which transfers to the position (relay stage) of 2 (for example, refer the following patent document 1).

Japanese Patent No. 5385794

  However, in the above-described conventional component mounting apparatus, the nozzle moving mechanism for moving the nozzle between the first position and the second position is an orthogonal coordinate mechanism, so that a two-axis moving mechanism is required. Incurred cost increase. Further, since the camera needs to be installed while avoiding the movable range of the Cartesian coordinate mechanism, the installation position of the camera has to be a high position that is considerably away from the semiconductor wafer. For this reason, when it occurs in a component mounting apparatus, there is a problem that imaging blur of the camera becomes large due to the influence of the vibration, and a good image of the component may not be obtained.

  Accordingly, an object of the present invention is to provide a component transfer mechanism capable of reducing the imaging blur of a camera due to the reduction in manufacturing cost and the influence of vibration, and a component mounting apparatus including the component transfer mechanism.

  The component transfer mechanism of the present invention is a component transfer mechanism that transfers a component from the first position to the second position by moving a nozzle between a first position and a second position. And a drive shaft extending in the horizontal direction, one end of which is fixed to the drive shaft, and oscillates within a certain oscillating range around the drive shaft as the drive shaft rotates. A swing member, a nozzle holding portion that is provided on the other end side of the swing member and holds the nozzle, and a posture maintaining mechanism that maintains the posture of the nozzle holding portion regardless of the swing position of the swing member And a guide portion for guiding the nozzle holding portion so that the nozzle moves up and down in the vertical direction at the end of the swing range of the swing member.

  The component mounting apparatus of the present invention includes a substrate holding unit that holds a substrate, a component transfer mechanism of the present invention, and the component transferred to the second position by the component transfer mechanism in the substrate holding unit. And a mounting head mounted on the held substrate.

  According to the present invention, it is possible to reduce the manufacturing cost and the camera shake due to the influence of vibration.

The perspective view of the component mounting apparatus in one embodiment of this invention The perspective view of the component transfer mechanism with which the component mounting apparatus in one embodiment of this invention is provided. The disassembled perspective view of a part of component transfer mechanism with which the component mounting apparatus in one embodiment of this invention is provided The disassembled perspective view of a part of component transfer mechanism with which the component mounting apparatus in one embodiment of this invention is provided (A) Perspective view (b) Side view for explaining the operation of the component transfer mechanism in one embodiment of the present invention (A) Perspective view (b) Side view for explaining the operation of the component transfer mechanism in one embodiment of the present invention (A) Perspective view (b) Side view for explaining the operation of the component transfer mechanism in one embodiment of the present invention (A) Perspective view (b) Side view for explaining the operation of the component transfer mechanism in one embodiment of the present invention (A) (b) (c) The partial side view of the component transfer mechanism which shows a mode that the nozzle holding part with which the component transfer mechanism in one embodiment of this invention is equipped is guided by the downward guide part. (A) (b) (c) The partial side view of the component transfer mechanism which shows a mode that the nozzle holding part with which the component transfer mechanism in one embodiment of this invention is provided is guided by an upper guide part.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a component mounting apparatus 1 according to an embodiment of the present invention. The component mounting apparatus 1 is a device that mounts the component 3 on the substrate 2, and includes a component supply unit 11, a relay stage 12, a substrate holding unit 13, a component transfer mechanism 14, and a mounting head 15. In the present embodiment, the left-right direction viewed from the operator OP is the X-axis direction. Further, the front-rear direction viewed from the operator OP is the Y-axis direction, and the vertical direction is the Z-axis direction.

  In FIG. 1, the component supply unit 11 includes a component supply table 11A, a table moving mechanism 11B, and a push-up pin 11C. The component supply table 11A holds a plurality of components (dies) 3 formed by cutting the semiconductor wafer W. The table moving mechanism 11B moves the component supply table 11A so that an arbitrary component 3 of the plurality of components 3 held by the component supply table 11A is picked up at a pickup position P1 (first Position). The push-up pin 11C is provided below the component supply table 11A and pushes up the component 3 located at the pickup position P1 from below.

  In FIG. 1, the relay stage 12 is provided above the component supply unit 11, and is moved in the XY plane by a relay stage moving mechanism (not shown). The relay stage moving mechanism moves the relay stage 12 to position an arbitrary position on the relay stage 12 at a placement position P2 (second position) set in space. Since the relay stage 12 is provided above the component supply unit 11, the placement position P2 is located above the pickup position P1.

  In FIG. 1, the substrate holder 13 is provided on the left side of the relay stage 12. The substrate holding unit 13 holds the substrate 2 in a horizontal posture and is moved in the XY plane by a substrate holding unit moving mechanism (not shown). The substrate holding unit moving mechanism moves the substrate holding unit 13 to position an arbitrary position on the substrate holding unit 13 at the mounting position P3 set in the space.

  The component transfer mechanism 14 is provided on the right side of the component supply unit 11 and transfers the component 3 picked up at the pickup position P1 to the mounting position P2. The detailed configuration of the component transfer mechanism 14 will be described later.

  In FIG. 1, the mounting head 15 is located to the left of the relay stage 12, and is moved in the X-axis direction by the mounting head moving mechanism 15M. The mounting head 15 includes a mounting nozzle 15N extending downward. The mounting head 15 can move the mounting nozzle 15N up and down in the Z-axis direction and rotate around the Z-axis. The lower end of the mounting nozzle 15N is a suction port for the component 3. When vacuum pressure is supplied to the suction port through a vacuum pressure supply line (not shown), suction force is generated for the component 3 at the suction port.

  In FIG. 1, a wafer camera C <b> 1 is provided above the component supply unit 11, and a component camera C <b> 2 is provided above the relay stage 12. A substrate camera C3 is provided above the substrate holder 13. Wafer camera C1 has its imaging field of view directed downward, and its optical axis passes through pickup position P1. The component camera C2 has its imaging field of view directed downward, and its optical axis passes through the mounting position P2. The substrate camera C3 has its imaging field of view directed downward, and its optical axis passes through the mounting position P3.

  Next, the configuration of the component transfer mechanism 14 will be described. FIG. 2 shows the component transfer mechanism 14. The component transfer mechanism 14 includes a base portion 21, a drive motor 22, a swing member 23, a posture maintaining mechanism 24, a nozzle holding portion 25, a nozzle 26, a lower guide portion 27, and an upper guide portion 28.

  In FIG. 2, the base portion 21 includes a bottom surface portion 21a, a right side surface portion 21b, a left side surface portion 21c, and a top surface portion 21d. The drive motor 22 is attached to the right side surface portion 21b. The drive shaft 22a of the drive motor 22 extends to the left through the right side surface portion 21b, and further extends to the left through the left side surface portion 21c.

  2 and 3, the swing member 23 is provided on the left side of the left side surface portion 21c. A drive shaft 22a of the drive motor 22 protruding to the left surface side of the left side surface portion 21c is fixed to one end side of the swing member 23.

  In FIG. 3, the posture maintaining mechanism 24 is provided on the right surface side of the swing member 23, and includes a fixed pulley 31, a driven pulley 32, a tension pulley 33, and a timing belt 34. The fixed pulley 31 is a toothed pulley and is fixed to the left surface of the left side surface portion 21 c of the base portion 21. A shaft through hole (not shown) is provided at the center of the fixed pulley 31 so as to extend in the X-axis direction. The drive shaft 22a of the drive motor 22 that penetrates the left side surface portion 21c is provided in the shaft through hole. It extends through from the right to the left.

  In FIG. 3, the driven pulley 32 is a toothed pulley having the same diameter and the same number of teeth as the fixed pulley 31, and is provided on the other end side of the swing member 23. A driven pulley support shaft 32a extending in the X-axis direction (left side) is attached to the driven pulley 32, and the driven pulley support shaft 32a passes through the other end side of the swing member 23 from right to left. It extends. The driven pulley support shaft 32 a is supported on the other end side of the swing member 23 so as to be rotatable relative to the swing member 23.

  In FIG. 3, a tension pulley support shaft 23a extending in the X-axis direction (rightward) is provided between one end side and the other end side of the swing member. The tension pulley 33 is also a toothed pulley, and is attached so as to be rotatable relative to the tension pulley support shaft 23a. The timing belt 34 is a toothed belt and is stretched between the fixed pulley 31 and the driven pulley 32. The tension pulley 33 is in contact with the timing belt 34 and applies an appropriate tension to the timing belt 34.

  When the drive shaft 22a is rotated around the X axis by the drive motor 22 (rotating in the forward and reverse directions within a certain angle range), the swinging member 23 moves along the rotation of the drive shaft 22a. Around the axis (that is, in the YZ plane), reciprocating rocking is performed within a certain rocking range around the drive shaft 22a. At this time, the driven pulley 32 moves (revolves around the drive shaft 22a) on the first circular arc path SR1 (FIG. 2) around the drive shaft 22a.

  When the driven pulley 32 moves on the first circular arc path SR <b> 1, the timing belt 34 moves relative to the fixed pulley 31 fixed to the base portion 21 to rotate the driven pulley 32 relative to the swing member 23. Here, since the fixed pulley 31 and the driven pulley 32 are configured to have the same diameter and the same number of teeth, the relative rotation angle of the driven pulley 32 with respect to the swing member 23 is equal to the swing angle of the swing member 23 with respect to the base 21. Will be equal. For this reason, even if the swing member 23 swings, the posture of the driven pulley 32 (the posture with respect to the base 21 or the fixed pulley 31) does not change. Therefore, when the swing member 23 swings, the driven pulley support shaft 32a also moves on the first circular arc path SR1 without changing its posture (rotation posture around the axis of the driven pulley support shaft 32a) (drive shaft). Revolve around 22a).

  3 and 4, the nozzle holding portion 25 includes a moving base 41, an arm base 42, an arm 43, a return spring 44, a roller member support portion 45, and two upper and lower roller members 46. In FIG. 4, the moving base 41 has a vertical portion 41a having a shape extending in the YZ plane and a horizontal portion 41b having a shape extending in the XY plane from the lower end of the vertical portion 41a. The left end of the driven pulley support shaft 32a that protrudes and extends to the left of the swing member 23 is fixed to the vertical portion 41a. For this reason, the movement base 41 maintains a constant posture (horizontal posture) regardless of the swing position of the swing member 23.

  In FIG. 4, the arm base 42 is provided on the left side of the vertical portion 41 a of the moving base 41 so as to face the vertical portion 41 a. A slider 42 s is provided on the right surface of the arm base 42, and the slider 42 s is engaged with a slide guide 41 g provided by extending the left surface of the vertical portion 41 a of the moving base 41 in the Y-axis direction. The arm base 42 moves relative to the moving base 41 in the horizontal direction (Y-axis direction) by sliding the slider 42s with respect to the slide guide 41g.

  In FIG. 4, a base side protrusion 41 </ b> T protrudes leftward from the left surface of the vertical portion 41 a of the moving base 41, and an arm base side protrusion 42 </ b> T protrudes rightward from the right surface of the arm base 42. Is provided. The return spring 44, which is a tension spring, has both ends in the Y-axis direction engaged with the base-side protrusion 41T and the arm base-side protrusion 42T, and extends between the vertical part 41a and the arm base 42 in the Y-axis direction. .

  In a state where the arm base 42 does not receive a forward pressing force, the arm base 42 comes into contact with a stopper (not shown) provided on the moving base 41 from the front to contact a predetermined position (hereinafter referred to as a reference position) with respect to the moving base 41. Called). When a forward pressing force acts on the arm base 42, the arm base 42 moves forward from the reference position, and the return spring 42 is pulled in the Y-axis direction, and the arm base 42 returns to the reference position. Give the power of.

  The arm 43 extends in a crank shape (leftward and then rearward) in the horizontal plane from the rear end of the arm base 42. A nozzle 26 is held at the tip of the arm 43. The lower end of the nozzle 26 is a suction port for the component 3. When vacuum pressure is supplied to the suction port through a vacuum pressure supply line (not shown), suction force is generated for the component 3 at the suction port.

  As described above, the moving base 41 is maintained in the horizontal posture by the posture maintaining mechanism 24 regardless of the swinging position of the swinging member 23. Therefore, the arm base 42 and the arm 43 connected to the moving base 41 are also horizontal. Posture is maintained. That is, in the present embodiment, the posture maintaining mechanism 24 allows the entire nozzle holding unit 25 to maintain the nozzle holding unit 25 in a horizontal posture regardless of the swinging position of the swinging member 23. ing. As a result, the nozzle 26 held by the nozzle holding unit 25 is also maintained in a vertical posture with the suction port of the component 3 facing downward regardless of the swing position of the swing member 23.

  When the oscillating member 23 rotates about the axis of the drive shaft 22a, the nozzle holding portion 25 moves on the second arcuate track SR2 (FIG. 2). Further, when the swinging member 23 rotates around the axis of the drive shaft 22a, the nozzle 26 moves on the third arc track SR3 (FIGS. 1 and 2). Here, both the second arc trajectory SR2 and the third arc trajectory SR3 are in a positional relationship obtained by translating the first arc trajectory SR1 in the Y-axis direction.

  In FIG. 4, the roller member support portion 45 is provided extending upward from the arm base 42. On the right surface of the arm base 42, two upper and lower roller shafts 45a protruding rightward are provided. The two upper and lower roller members 46 are respectively attached to a roller shaft 45a, and each roller member 46 is rotatable about the axis of the roller shaft 45a to which the roller member 46 is attached.

  In FIG. 2, the lower guide portion 27 is supported by a lower guide portion support member 21 e provided to extend leftward from the left side surface portion 21 c of the base portion 21. The lower guide portion 27 is located in the vicinity of the lower end portion of the swing range of the swing member 23, and has a lower guide surface 27m (FIG. 3) facing the front and extending vertically in the vertical direction. Yes. The lower guide surface 27m guides the nozzle holding portion 25 (specifically, the two upper and lower roller members 46) so that the nozzle 26 moves up and down in the vertical direction at the lower end of the swing range of the swing member 23. It is a cam surface.

  In FIG. 2, the upper guide portion 28 is supported by an upper guide portion support member 21 f provided to extend from the top surface portion 21 d of the base portion 21 to the upper left. The upper guide portion 28 is located in the vicinity of the upper end of the swing range of the swing member 23, and has an upper guide surface 28m (FIG. 2) facing the front and extending vertically in the vertical direction. Yes. The upper guide surface 28m guides the nozzle holding portion 25 (specifically, the two upper and lower roller members 46) so that the nozzle 26 moves up and down in the vertical direction at the upper end of the swing range of the swing member 23. It is a cam surface.

  A wafer camera C1, which is a camera that images the part 3 located at the pickup position P1 (first position) from above, has an arc trajectory (third arc trajectory) of the nozzle 26 that moves as the swing member 23 swings. SR3). Specifically, at a height intermediate between the height of the pickup position P1 and the placement position P2 (second position), the position does not interfere with the swing member 23 that swings within a certain swing range. Is provided.

  The lower end (suction port) of the nozzle 26 is positioned at the pickup position P1 when the swinging member 23 is positioned at the lower end of the swinging range, and the swinging member 23 is positioned at the upper end of the swinging range. In the state, it is located at the mounting position P2. When moving the nozzle 26 positioned at the pickup position P1 to the mounting position P2, the component transfer mechanism 14 drives the drive shaft 22a from the drive motor 22 to rotate the swing member 23 in the forward direction. Here, the forward direction refers to a direction in which the swing member 23 is swung counterclockwise when the swing member 23 is viewed from the left.

  When the swinging member 23 is rotated in the forward direction, the swinging member 23 is moved forward by moving the other end side (the driven pulley support shaft 32a side) from the lower end of the swinging range to be in a horizontal posture. After (FIGS. 5 (a), (b) → FIGS. 6 (a), (b)), the other end side is moved upward while moving back to a vertical position (FIGS. 6 (a), (b) → FIG. 7 (a), (b)). Finally, the other end is moved downward while moving downward (FIGS. 7A and 7B to FIGS. 8A and 8B). When the swing member 23 is thus rotated in the forward direction, the nozzle 26 moves on the third circular arc track SR3 in the same forward direction as the drive shaft 22a.

  On the other hand, when moving the nozzle 26 positioned at the mounting position P2 to the pickup position P1, the component transfer mechanism 14 drives the drive shaft 22a from the drive motor 22 to rotate the swing member 23 in the reverse direction. . Here, the reverse direction refers to a direction in which the swing member 23 is swung clockwise when the swing member 23 is viewed from the left.

  When the rocking member 23 is rotated in the reverse direction, the rocking member 23 is moved forward while the other end is lifted from the upper end portion, and is in a vertical posture (FIGS. 8A and 8B). 7 (a) and 7 (b)), the other end is lowered and moved forward to become a horizontal posture (FIGS. 7 (a) and (b) → FIGS. 6 (a) and (b)). Finally, the other end is moved downward while being lowered (FIGS. 6A and 6B to FIGS. 5A and 5B). When the swing member 23 is rotated in the reverse direction in this way, the nozzle 26 moves on the third circular arc track SR3 in the same reverse direction as the drive shaft 22a.

  When the swinging member 23 rotates in the opposite direction and the lower end of the nozzle 26 is moved downward and is located at the pickup position P1, the upper and lower two roller members 46 are sequentially brought into contact with the lower guide surface 27m and guided vertically downward. . At this time, since the nozzle holding unit 25 moves vertically downward while maintaining the horizontal posture, the nozzle 26 moves vertically downward to reach the pickup position P1, and contacts the component 3 held on the component supply table 11A ( FIG. 9 (a) → FIG. 9 (b) → FIG. 9 (c)). In the process of moving the nozzle 26 vertically downward as described above, the arm base 42 moves forward from the reference position with respect to the moving base 41, and the return spring 44 is pulled.

  On the contrary, when the swinging member 23 rotates in the forward direction and the lower end of the nozzle 26 moves upward from the pickup position P1, the upper and lower two roller members 46 are in contact with the lower guide surface 27m. Is guided upward. At this time, since the nozzle holding unit 25 moves vertically upward while maintaining the horizontal posture, the nozzle 26 moves vertically upward to lift the component 3 from the pickup position P1 (FIG. 9 (c) → FIG. 9 (b) → FIG. 9A). After the nozzle 26 moves vertically upward as described above, the two roller members 46 are sequentially separated from the lower guide surface 27m, and the arm base 42 is returned to the reference position by the return spring 44.

  When the swinging member 23 rotates in the forward direction and the lower end of the nozzle 26 is positioned at the placement position P2 by the lowering operation, the upper and lower two roller members 46 are sequentially brought into contact with the upper guide surface 28m and moved vertically downward. Guided. At this time, the nozzle holding unit 25 moves vertically downward while maintaining the horizontal posture, so the nozzle 26 moves vertically downward to place the component 3 on the relay stage 12 (FIG. 10A → FIG. 10B). → FIG. 10 (c)). In the process of moving the nozzle 26 vertically downward as described above, the arm base 42 moves forward from the aforementioned reference position with respect to the moving base 41, and the return spring 44 is pulled.

  On the contrary, when the swing member 23 rotates in the reverse direction and the lower end of the nozzle 26 moves away from the placement position P2 by the ascending operation, the upper and lower roller members 46 contact the upper guide surface 28m. It is guided upward in the state. At this time, since the nozzle holding part 25 moves vertically upward while maintaining the horizontal posture, the nozzle 26 moves vertically upward and is separated from the component 3 positioned at the mounting position P2 (FIG. 10C). 10 (b) → FIG. 10 (a)). After the nozzle 26 moves vertically upward as described above, the two roller members 46 are sequentially separated from the upper guide surface 28m, and the arm base 42 is returned to the reference position by the return spring 44.

  As described above, in the present embodiment, the nozzle holding portion 25 has the roller member 46, and the two guide portions (the lower guide portion 27 and the upper guide portion 28) each swing the swing member 23. The nozzle holding part 25 is guided so that the nozzle 26 moves up and down in the vertical direction at the end of the range. In the present embodiment, two roller members 46 are arranged side by side in the vertical direction, and these two roller members 46 are guided in a state where they are simultaneously in contact with each other by a guide surface (lower guide surface 27m or upper guide surface 28m). Thus, the nozzle holding portion 25 (and hence the nozzle 26) can be moved in a stable posture in a direction along the guide surface (here, the vertical direction).

  When the component mounting apparatus 1 having the above configuration mounts the component 3 on the substrate 2, first, the component supply table 11A is moved from the table moving mechanism 11B, and the component 3 to be mounted on the substrate 2 is moved to the pickup position P1. Position. When the part 3 is located at the pickup position P1, the part 3 is imaged by the wafer camera C1, and the part 3 is recognized.

  When the component mounting apparatus 1 recognizes the component 3 by the wafer camera C1, the component transfer mechanism 14 picks up the component 3 from the pickup position P1, transfers it to the mounting position P2, and mounts the component 3 on the relay stage 12. Put. After the component 3 is placed on the relay stage 12, the component mounting apparatus 1 recognizes the component 3 by the component camera C2, and also the region on the substrate 2 located at the mounting position P3 by the substrate camera C3 (component mounting target region). Recognize

  When the component mounting apparatus 1 recognizes the component 3 by the component camera C2 and recognizes the region on the substrate 2 located at the mounting position P3 by the substrate camera C3, the component 3 on the relay stage 12 is sucked by the mounting head 15. Then, the mounting head 15 is moved above the substrate 2 to mount the component 3 on the component mounting target area on the substrate 2. Thereby, a component mounting board in which the component 3 is mounted on the substrate 2 is manufactured.

  As described above, in the component transfer mechanism 14 (component mounting device 1) according to the present embodiment, the nozzle holding portion is provided on the other end side of the swing member 23 whose one end side is fixed to the drive shaft 22a extending in the horizontal direction. The nozzle 26 is held via 25, and the posture of the nozzle holding portion 25 is maintained by the posture maintaining mechanism 24 regardless of the swing position of the swing member 23. In addition, at the end of the swing range of the swing member 23, a guide portion (a lower guide portion 27 and an upper guide portion 28) for guiding the nozzle holding portion 25 is provided so that the nozzle 26 moves up and down in the vertical direction. It has a configuration. In the present embodiment, by adopting these configurations, the nozzle 26 is moved along an arc path (third arc path SR3), and a pickup position P1 (first position) and a placement position P2 (second position) ) Can be transferred, and the following effects can be obtained.

  First, since the axis for moving the nozzle 26 is only one axis of rotation (rotation) of the drive shaft 22a, compared to the case of the orthogonal coordinate mechanism that requires two axes for the movement of the nozzle 26, Manufacturing costs can be reduced. Next, since the wafer camera C1 for imaging the part 3 located at the pickup position P1 (first position) from above can be arranged inside the arc trajectory (third arc trajectory SR3) of the nozzle 26, the wafer camera C1 is It can be installed at a position close to the upper side of the semiconductor wafer W. For this reason, it is possible to reduce the imaging blur of the wafer camera C1 due to the influence of vibration, and it is possible to prevent the degradation of imaging accuracy and improve the mounting accuracy of the component 3 on the substrate 2.

  As mentioned above, although embodiment of this invention has been described, this invention is not limited to what was shown in the above-mentioned embodiment. For example, the configuration of the component mounting apparatus 1 shown in the above-described embodiment is an example, and the substrate holding unit 13 that holds the substrate 2 and the nozzle 26 is moved between the first position and the second position. A component transfer mechanism 14 that transfers the component 3 from the first position to the second position, a camera (wafer camera C1) that images the component 3 positioned at the first position from above, and the component transfer mechanism 14 As long as the configuration includes the mounting head 15 for mounting the component 3 placed at the position 2 on the substrate 2 held by the substrate holding unit 13, the component 3 may have another configuration.

  Provided are a component transfer mechanism capable of reducing the imaging blur of a camera due to the reduction in manufacturing cost and the influence of vibration, and a component mounting apparatus including the component transfer mechanism.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Component 13 Board | substrate holding | maintenance part 14 Component transfer mechanism 15 Mounting head 22a Drive shaft 23 Oscillating member 24 Posture maintenance mechanism 25 Nozzle holding part 26 Nozzle 27 Lower guide part (guide part)
27m downward guide surface (guide surface)
28 Upper guide (guide)
28m upward guide surface (guide surface)
46 Roller member C1 Wafer camera (camera)
P1 Pickup position (first position)
P2 placement position (second position)
SR1 First arc trajectory SR2 Second arc trajectory SR3 Third arc trajectory (arc trajectory)

Claims (5)

A component transfer mechanism that moves a nozzle between a first position and a second position to transfer a component from the first position to the second position;
A drive shaft provided extending in the horizontal direction;
A swing member fixed at one end to the drive shaft and swinging within a fixed swing range about the drive shaft as the drive shaft rotates;
A nozzle holding part that is provided on the other end side of the rocking member and holds the nozzle;
A posture maintaining mechanism for maintaining the posture of the nozzle holding portion regardless of the swing position of the swing member;
A component transfer mechanism comprising: a guide portion that guides the nozzle holding portion so that the nozzle moves up and down in a vertical direction at an end portion of the swing range of the swing member.   The nozzle holding portion includes a roller member, and the guide portion includes a guide surface that guides the roller member so that the nozzle moves up and down in a vertical direction at an end of the swing range. The component transfer mechanism according to claim 1.   3. The component transfer mechanism according to claim 2, wherein two roller members are arranged vertically on the nozzle holding portion. A substrate holder for holding the substrate;
The component transfer mechanism according to any one of claims 1 to 3,
A component mounting apparatus comprising: a mounting head for mounting the component transferred to the second position by the component transfer mechanism on the substrate held by the substrate holding unit.   A camera for imaging the component located at the first position from above is provided, and the camera is disposed inside an arc orbit of the nozzle that moves as the swinging member swings. The component mounting apparatus according to claim 4.

Images