SG146570A1 - Image sensor module having build-in package cavity and the method of the same - Google Patents

Image sensor module having build-in package cavity and the method of the same

Info

Publication number
SG146570A1
SG146570A1 SG200802178-4A SG2008021784A SG146570A1 SG 146570 A1 SG146570 A1 SG 146570A1 SG 2008021784 A SG2008021784 A SG 2008021784A SG 146570 A1 SG146570 A1 SG 146570A1
Authority
SG
Singapore
Prior art keywords
substrate
package
image sensor
sensor module
lens
Prior art date
Application number
SG200802178-4A
Other languages
English (en)
Inventor
Wen-Kun Yang
Diann-Fang Lin
Jui-Hsien Chang
Tung-Chuan Wang
Original Assignee
Advanced Chip Eng Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Chip Eng Tech Inc filed Critical Advanced Chip Eng Tech Inc
Publication of SG146570A1 publication Critical patent/SG146570A1/en

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    • H—ELECTRICITY
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    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
SG200802178-4A 2007-03-15 2008-03-14 Image sensor module having build-in package cavity and the method of the same SG146570A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/725,041 US7498556B2 (en) 2007-03-15 2007-03-15 Image sensor module having build-in package cavity and the method of the same

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SG146570A1 true SG146570A1 (en) 2008-10-30

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CN101266990A (zh) 2008-09-17
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US20080224248A1 (en) 2008-09-18
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KR20080084759A (ko) 2008-09-19
TW200837902A (en) 2008-09-16

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