SG141318A1 - Silicon wafer having good intrinsic getterability and method for its production - Google Patents

Silicon wafer having good intrinsic getterability and method for its production

Info

Publication number
SG141318A1
SG141318A1 SG200705969-4A SG2007059694A SG141318A1 SG 141318 A1 SG141318 A1 SG 141318A1 SG 2007059694 A SG2007059694 A SG 2007059694A SG 141318 A1 SG141318 A1 SG 141318A1
Authority
SG
Singapore
Prior art keywords
silicon wafer
bmd
density
production
crystal lattice
Prior art date
Application number
SG200705969-4A
Other languages
English (en)
Inventor
Timo Mueller
Martin Weber
Gudrun Kissinger
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of SG141318A1 publication Critical patent/SG141318A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/02—Heat treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24273—Structurally defined web or sheet [e.g., overall dimension, etc.] including aperture
    • Y10T428/24298—Noncircular aperture [e.g., slit, diamond, rectangular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
SG200705969-4A 2006-10-04 2007-08-15 Silicon wafer having good intrinsic getterability and method for its production SG141318A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006046956 2006-10-04
DE102007027111A DE102007027111B4 (de) 2006-10-04 2007-06-13 Siliciumscheibe mit guter intrinsischer Getterfähigkeit und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
SG141318A1 true SG141318A1 (en) 2008-04-28

Family

ID=39154787

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200705969-4A SG141318A1 (en) 2006-10-04 2007-08-15 Silicon wafer having good intrinsic getterability and method for its production

Country Status (7)

Country Link
US (1) US7964275B2 (zh)
JP (1) JP4942606B2 (zh)
KR (1) KR100918287B1 (zh)
CN (1) CN101187059B (zh)
DE (1) DE102007027111B4 (zh)
SG (1) SG141318A1 (zh)
TW (1) TWI376435B (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4805681B2 (ja) * 2006-01-12 2011-11-02 ジルトロニック アクチエンゲゼルシャフト エピタキシャルウェーハおよびエピタキシャルウェーハの製造方法
DE102007005346B4 (de) * 2007-02-02 2015-09-17 Siltronic Ag Halbleiterscheiben aus Silicium und Verfahren zu deren Herstellung
DE102010034002B4 (de) * 2010-08-11 2013-02-21 Siltronic Ag Siliciumscheibe und Verfahren zu deren Herstellung
US20130192303A1 (en) * 2012-01-27 2013-08-01 Memc Qualitative crystal defect evaluation method
US9499921B2 (en) 2012-07-30 2016-11-22 Rayton Solar Inc. Float zone silicon wafer manufacturing system and related process
CN102969395B (zh) * 2012-10-31 2015-04-15 南昌大学 一种提高硅片抗碎裂性能的方法
US10141413B2 (en) 2013-03-13 2018-11-27 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer strength by control of uniformity of edge bulk micro defects
US9064823B2 (en) * 2013-03-13 2015-06-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method for qualifying a semiconductor wafer for subsequent processing
JP6418085B2 (ja) * 2015-07-03 2018-11-07 株式会社Sumco シリコン単結晶の検査方法および製造方法
CN108691009B (zh) * 2017-03-31 2021-10-08 环球晶圆股份有限公司 单晶硅的制造方法
CN109507559A (zh) * 2017-09-15 2019-03-22 上海新昇半导体科技有限公司 一种硅片少子寿命的测试方法及测试装置
DE102019207433A1 (de) * 2019-05-21 2020-11-26 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben
US11695048B2 (en) 2020-04-09 2023-07-04 Sumco Corporation Silicon wafer and manufacturing method of the same

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770091B2 (ja) * 1991-11-22 1998-06-25 コマツ電子金属株式会社 シリコンウェハの処理方法
US5931662A (en) * 1996-06-28 1999-08-03 Sumitomo Sitix Corporation Silicon single crystal wafer annealing method and equipment and silicon single crystal wafer and manufacturing method related thereto
KR100237829B1 (ko) * 1997-02-06 2000-01-15 윤종용 웨이퍼의 결함 분석방법
US6436846B1 (en) * 1998-09-03 2002-08-20 Siemens Aktiengesellscharft Combined preanneal/oxidation step using rapid thermal processing
US6663708B1 (en) * 2000-09-22 2003-12-16 Mitsubishi Materials Silicon Corporation Silicon wafer, and manufacturing method and heat treatment method of the same
JP4092946B2 (ja) * 2002-05-09 2008-05-28 信越半導体株式会社 シリコン単結晶ウエーハ及びエピタキシャルウエーハ並びにシリコン単結晶の製造方法
JP4699675B2 (ja) * 2002-10-08 2011-06-15 信越半導体株式会社 アニールウェーハの製造方法
JP4231275B2 (ja) * 2002-11-14 2009-02-25 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 シリコンウェーハの製造方法およびその製造装置およびシリコンウェーハ
JP4366956B2 (ja) * 2003-02-19 2009-11-18 株式会社Ｓｕｍｃｏ 高品質ウェーハおよびその製造方法
KR100588425B1 (ko) * 2003-03-27 2006-06-12 실트로닉 아게 실리콘 단결정, 결정된 결함분포를 가진 실리콘 단결정 및 실리콘 반도체 웨이퍼의 제조방법
DE10339792B4 (de) * 2003-03-27 2014-02-27 Siltronic Ag Verfahren und Vorrichtung zur Herstellung eines Einkristalls aus Silicium
JP3781014B2 (ja) * 2003-03-31 2006-05-31 株式会社Ｓｕｍｃｏ シリコンウェーハ熱処理治具およびシリコンウェーハ熱処理方法
DE10336271B4 (de) 2003-08-07 2008-02-07 Siltronic Ag Siliciumscheibe und Verfahren zu deren Herstellung
JP2005060168A (ja) * 2003-08-12 2005-03-10 Shin Etsu Handotai Co Ltd ウエーハの製造方法
DE102005013831B4 (de) * 2005-03-24 2008-10-16 Siltronic Ag Siliciumscheibe und Verfahren zur thermischen Behandlung einer Siliciumscheibe

Also Published As

Publication number Publication date
JP2008133171A (ja) 2008-06-12
DE102007027111B4 (de) 2011-12-08
TW200817541A (en) 2008-04-16
CN101187059A (zh) 2008-05-28
US7964275B2 (en) 2011-06-21
KR100918287B1 (ko) 2009-09-18
KR20080031651A (ko) 2008-04-10
DE102007027111A1 (de) 2008-04-10
US20080311342A1 (en) 2008-12-18
TWI376435B (en) 2012-11-11
CN101187059B (zh) 2011-04-27
JP4942606B2 (ja) 2012-05-30

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