SG139569A1 - A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same - Google Patents

A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same

Info

Publication number
SG139569A1
SG139569A1 SG200604730-2A SG2006047302A SG139569A1 SG 139569 A1 SG139569 A1 SG 139569A1 SG 2006047302 A SG2006047302 A SG 2006047302A SG 139569 A1 SG139569 A1 SG 139569A1
Authority
SG
Singapore
Prior art keywords
light
composite assembly
different wavelengths
assembly
multiple devices
Prior art date
Application number
SG200604730-2A
Other languages
English (en)
Inventor
Pak Hong Yee
Jing Zhang
Wee Sin Tan
Original Assignee
Avago Technologies General Ip
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avago Technologies General Ip filed Critical Avago Technologies General Ip
Priority to SG200604730-2A priority Critical patent/SG139569A1/en
Priority to US11/552,026 priority patent/US7514666B2/en
Priority to DE102007032275A priority patent/DE102007032275B4/de
Priority to CNB2007101358165A priority patent/CN100541792C/zh
Publication of SG139569A1 publication Critical patent/SG139569A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B44/00—Circuit arrangements for operating electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/175—Controlling the light source by remote control
    • H05B47/19—Controlling the light source by remote control via wireless transmission
    • H05B47/195—Controlling the light source by remote control via wireless transmission the transmission using visible or infrared light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B47/00—Circuit arrangements for operating light sources in general, i.e. where the type of light source is not relevant
    • H05B47/10—Controlling the light source
    • H05B47/105—Controlling the light source in response to determined parameters
    • H05B47/11—Controlling the light source in response to determined parameters by determining the brightness or colour temperature of ambient light
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Light Receiving Elements (AREA)
  • Led Device Packages (AREA)
  • Optical Head (AREA)
SG200604730-2A 2006-07-13 2006-07-13 A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same SG139569A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
SG200604730-2A SG139569A1 (en) 2006-07-13 2006-07-13 A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same
US11/552,026 US7514666B2 (en) 2006-07-13 2006-10-23 Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted
DE102007032275A DE102007032275B4 (de) 2006-07-13 2007-07-11 Verbundanordnung, die mehrere Vorrichtungen eingliedert, die unterschiedliche Lichtwellenlängen verwenden, und Verfahren zum Herstellen derselben
CNB2007101358165A CN100541792C (zh) 2006-07-13 2007-07-13 集成使用不同波长光的多个装置的复合组件及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200604730-2A SG139569A1 (en) 2006-07-13 2006-07-13 A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same

Publications (1)

Publication Number Publication Date
SG139569A1 true SG139569A1 (en) 2008-02-29

Family

ID=38830897

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200604730-2A SG139569A1 (en) 2006-07-13 2006-07-13 A composite assembly that incorporate multiple devices that use different wavelengths of light and method for making same

Country Status (4)

Country Link
US (1) US7514666B2 (de)
CN (1) CN100541792C (de)
DE (1) DE102007032275B4 (de)
SG (1) SG139569A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8217482B2 (en) * 2007-12-21 2012-07-10 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with reduced crosstalk
US8587415B1 (en) * 2009-03-20 2013-11-19 Ixys Ch Gmbh Receiving an IR control signal through a Fresnel lens of a motion sensor
US8420999B2 (en) * 2009-05-08 2013-04-16 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Metal shield and housing for optical proximity sensor with increased resistance to mechanical deformation
US8957380B2 (en) * 2009-06-30 2015-02-17 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
US9525093B2 (en) 2009-06-30 2016-12-20 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared attenuating or blocking layer in optical proximity sensor
US8779361B2 (en) * 2009-06-30 2014-07-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Optical proximity sensor package with molded infrared light rejection barrier and infrared pass components
US8350216B2 (en) * 2009-09-10 2013-01-08 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Miniaturized optical proximity sensor
US8143608B2 (en) * 2009-09-10 2012-03-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Package-on-package (POP) optical proximity sensor
US8716665B2 (en) * 2009-09-10 2014-05-06 Avago Technologies General Ip (Singapore) Pte. Ltd. Compact optical proximity sensor with ball grid array and windowed substrate
US8097852B2 (en) * 2009-09-10 2012-01-17 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multiple transfer molded optical proximity sensor and corresponding method
US9733357B2 (en) * 2009-11-23 2017-08-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Infrared proximity sensor package with improved crosstalk isolation
DE102010007605B4 (de) * 2010-02-11 2015-04-16 Epcos Ag Miniaturisiertes Bauelement mit zwei Chips und Verfahren zu dessen Herstellung
US8841597B2 (en) 2010-12-27 2014-09-23 Avago Technologies Ip (Singapore) Pte. Ltd. Housing for optical proximity sensor
CN103400836B (zh) * 2013-08-12 2016-06-01 日月光半导体制造股份有限公司 近接传感器封装构造及其制作方法
US9632209B2 (en) 2015-03-25 2017-04-25 Hana Microelectronics, Inc. Proximity sensor with light blocking compound
WO2017104635A1 (ja) * 2015-12-14 2017-06-22 ローム株式会社 光学装置
US20170366965A1 (en) * 2016-06-21 2017-12-21 Chiun Mai Communication Systems, Inc. Communication device, communication system and method therefor
EP3528287B1 (de) * 2017-05-15 2020-10-14 Hytronik Electronics Co., Ltd. Lichtempfindliches detektionselement mit fähigkeit zur gleichzeitigen detektion von spektren in verschiedenen wellenlängen
US11143551B2 (en) 2018-05-18 2021-10-12 Hana Microelectronics, Inc. Proximity sensor with infrared ink coating
US11520074B2 (en) 2018-09-14 2022-12-06 Hana Microelectronics, Inc. Proximity sensor with light blocking barrier comprising a gap having a cross-section with parallel walls between emitter and detector
US11567198B2 (en) 2019-03-25 2023-01-31 Hana Microelectronics Inc. Proximity sensor with light inhibiting barrier comprising a gap having a cross-section with parallel walls substantially perpendicular to the top surface of an optically transmissive material

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US4977619A (en) 1986-10-01 1990-12-11 Crimmins James W Distributed infrared communication system
US5280220A (en) 1988-10-05 1994-01-18 Gary Carter Remote controlled, solar and battery powered lights
EP0472963A3 (en) 1990-08-27 1992-07-08 Sumitomo Electric Industries, Limited Light emitting diode for photosensor and photosensor using such light emitting diode
JPH0558226A (ja) 1991-08-30 1993-03-09 Pioneer Electron Corp イルミネーシヨンコントロール回路
EP0609821B1 (de) * 1993-02-03 1998-11-25 Oerlikon Contraves Ag Fernsteuerungsempfänger
US5623358A (en) 1995-06-30 1997-04-22 Madey; Julius M. J. Discriminating infrared signal detector and systems utilizing the same
US5977882A (en) * 1995-08-22 1999-11-02 Moore; Clayton K. Infrared remote controlled in-line power switch
US6169295B1 (en) * 1998-05-29 2001-01-02 Maxim Integrated Products, Inc. Infrared transceiver module and method for making same
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KR101025234B1 (ko) * 2003-02-28 2011-04-01 오스람 옵토 세미컨덕터스 게엠베하 구조화 방식으로 금속화된 하우징 바디를 갖는 광전자소자,상기 광전자소자의 제조 방법 및 플라스틱을 포함하는하우징 바디를 구조화 방식으로 금속화하기 위한 방법
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JP2006053662A (ja) 2004-08-10 2006-02-23 Matsushita Electric Ind Co Ltd 多重プロセッサ
US20070194212A1 (en) * 2006-02-23 2007-08-23 National Taiwan University Ambient light photodetector
SG139570A1 (en) * 2006-07-13 2008-02-29 Avago Technologies General Ip A miniature composite assembly that incorporates multiple devices that use different wavelengths of light and a method for making the composite assembly
SG139568A1 (en) * 2006-07-13 2008-02-29 Avago Technologies General Ip Remote control receiver device and ambient light photosensor device incoporated into a single composite assembly

Also Published As

Publication number Publication date
CN100541792C (zh) 2009-09-16
CN101110412A (zh) 2008-01-23
US20080011939A1 (en) 2008-01-17
DE102007032275A1 (de) 2008-01-24
DE102007032275B4 (de) 2010-03-18
US7514666B2 (en) 2009-04-07

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