SG137688A1 - Method of surface texturizing - Google Patents

Method of surface texturizing

Info

Publication number
SG137688A1
SG137688A1 SG200403836-0A SG2004038360A SG137688A1 SG 137688 A1 SG137688 A1 SG 137688A1 SG 2004038360 A SG2004038360 A SG 2004038360A SG 137688 A1 SG137688 A1 SG 137688A1
Authority
SG
Singapore
Prior art keywords
surface texturizing
texturizing
Prior art date
Application number
SG200403836-0A
Inventor
Alan R Popiolkowski
Shannon M Hart
Marc O Schweitzer
Alan B Liu
Jennifer L Watia
Brian West
Mark Menzie
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/622,178 external-priority patent/US6812471B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of SG137688A1 publication Critical patent/SG137688A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
    • B24C11/00—Selection of abrasive materials or additives for abrasive blasts
    • B24C11/005—Selection of abrasive materials or additives for abrasive blasts of additives, e.g. anti-corrosive or disinfecting agents in solid, liquid or gaseous form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
SG200403836-0A 2003-07-17 2004-06-30 Method of surface texturizing SG137688A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/622,178 US6812471B2 (en) 2002-03-13 2003-07-17 Method of surface texturizing

Publications (1)

Publication Number Publication Date
SG137688A1 true SG137688A1 (en) 2007-12-28

Family

ID=34216285

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200403836-0A SG137688A1 (en) 2003-07-17 2004-06-30 Method of surface texturizing

Country Status (5)

Country Link
JP (2) JP5575352B2 (en)
KR (1) KR100887218B1 (en)
CN (1) CN100351998C (en)
SG (1) SG137688A1 (en)
TW (1) TWI342582B (en)

Families Citing this family (18)

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WO2007083363A1 (en) * 2006-01-18 2007-07-26 Mitsubishi Denki Kabushiki Kaisha Method for surface treatment with electron beam and apparatus for surface treatment with electron beam
US20080092806A1 (en) * 2006-10-19 2008-04-24 Applied Materials, Inc. Removing residues from substrate processing components
JP5072398B2 (en) * 2007-03-23 2012-11-14 株式会社アルバック Surface treatment method for welded part of metal member
US20100108641A1 (en) * 2008-10-03 2010-05-06 Applied Materials, Inc. Lavacoat pre-clean and pre-heat
DE102010060143A1 (en) * 2009-11-05 2011-06-09 Oerlikon Solar Ag, Trübbach Method for producing vacuum-processing chamber that is utilized in e.g. physical vapor deposition, involves defining volume of vacuum-processing chamber through wall, and smoothing and shot blasting inner surface of wall by grinding
JP4763101B1 (en) * 2010-03-29 2011-08-31 Ｊｘ日鉱日石金属株式会社 Tantalum coil for sputtering and processing method of the coil
CN102791903B (en) * 2010-03-29 2015-04-01 吉坤日矿日石金属株式会社 Tantalum coil for sputtering and method for processing the coil
CN105900210B (en) * 2014-12-15 2021-06-01 应用材料公司 Method for texturing a chamber component and chamber component with textured surface
EP3254305B1 (en) * 2015-02-06 2023-05-10 Applied Materials, Inc. 3d printed chamber components configured for lower film stress and lower operating temperature
US11569069B2 (en) 2015-02-06 2023-01-31 Applied Materials, Inc. 3D printed chamber components configured for lower film stress and lower operating temperature
US9346113B1 (en) * 2015-03-19 2016-05-24 Johnson Technology, Inc. Electrical discharge machining integrated control system
KR102200515B1 (en) * 2017-10-20 2021-01-12 한국생산기술연구원 Cutting Tool and Device for Brazing using Electron Beam and Method for Brazing using Electron Beam
KR102515494B1 (en) * 2018-04-17 2023-03-29 어플라이드 머티어리얼스, 인코포레이티드 Texturizing surfaces without bead blasting
CN110560870A (en) * 2019-10-17 2019-12-13 太仓束捍机电科技有限公司 L-shaped workpiece placing table of vacuum beam welding machine
US11739411B2 (en) 2019-11-04 2023-08-29 Applied Materials, Inc. Lattice coat surface enhancement for chamber components
KR102439455B1 (en) * 2020-11-13 2022-09-02 한국생산기술연구원 Electron Beam Processing Device and Method for Processing using the same
CN117733305B (en) * 2024-02-20 2024-04-26 四川华束科技有限公司 Sealed-off type electron gun and non-vacuum electron beam welding robot
CN118390060A (en) * 2024-06-27 2024-07-26 艾庞半导体科技(四川)有限公司 Surface treatment method of carrier for semiconductor wafer grinding process

Citations (2)

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WO1998031845A1 (en) * 1997-01-16 1998-07-23 Bottomfield, Layne, F. Vapor deposition components and corresponding methods
WO2001040540A1 (en) * 1999-12-02 2001-06-07 Tegal Corporation Improved reactor with heated and textured electrodes and surfaces

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JPS63278682A (en) * 1987-05-06 1988-11-16 Mitsubishi Heavy Ind Ltd Electron beam welding method
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JP2000319728A (en) * 1999-05-07 2000-11-21 Sumitomo Metal Ind Ltd Manufacture of metal sheet for shadow mask
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US6298685B1 (en) * 1999-11-03 2001-10-09 Applied Materials, Inc. Consecutive deposition system
JP2001230165A (en) 1999-12-08 2001-08-24 Toshiba Corp Semiconductor device and its manufacturing method
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
KR20020011274A (en) * 2000-08-01 2002-02-08 김정욱 Surface roughing apparatus and the roughing method of alluminum sheets
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Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031845A1 (en) * 1997-01-16 1998-07-23 Bottomfield, Layne, F. Vapor deposition components and corresponding methods
WO2001040540A1 (en) * 1999-12-02 2001-06-07 Tegal Corporation Improved reactor with heated and textured electrodes and surfaces

Also Published As

Publication number Publication date
JP5703262B2 (en) 2015-04-15
TWI342582B (en) 2011-05-21
CN1577732A (en) 2005-02-09
JP2012245565A (en) 2012-12-13
KR100887218B1 (en) 2009-03-06
JP2005039279A (en) 2005-02-10
CN100351998C (en) 2007-11-28
TW200504793A (en) 2005-02-01
KR20050009221A (en) 2005-01-24
JP5575352B2 (en) 2014-08-20

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