SG118367A1 - Device for inspecting micro structure method for inspecting micro structure and program for inspecting micro structure - Google Patents

Device for inspecting micro structure method for inspecting micro structure and program for inspecting micro structure

Info

Publication number
SG118367A1
SG118367A1 SG200503730A SG200503730A SG118367A1 SG 118367 A1 SG118367 A1 SG 118367A1 SG 200503730 A SG200503730 A SG 200503730A SG 200503730 A SG200503730 A SG 200503730A SG 118367 A1 SG118367 A1 SG 118367A1
Authority
SG
Singapore
Prior art keywords
micro structure
inspecting micro
inspecting
program
structure method
Prior art date
Application number
SG200503730A
Other languages
English (en)
Inventor
Okumura Katsuya
Matsumoto Toshiyuki
Ikeuchi Naoki
Yakabe Masami
Original Assignee
Octec Inc
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Octec Inc, Tokyo Electron Ltd filed Critical Octec Inc
Publication of SG118367A1 publication Critical patent/SG118367A1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C25/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass
    • G01C25/005—Manufacturing, calibrating, cleaning, or repairing instruments or devices referred to in the other groups of this subclass initial alignment, calibration or starting-up of inertial devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/30—Arrangements for calibrating or comparing, e.g. with standard objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/42—Detecting the response signal, e.g. electronic circuits specially adapted therefor by frequency filtering or by tuning to resonant frequency
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/46—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by spectral analysis, e.g. Fourier analysis or wavelet analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2695—Bottles, containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Signal Processing (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
SG200503730A 2004-06-11 2005-06-10 Device for inspecting micro structure method for inspecting micro structure and program for inspecting micro structure SG118367A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004174423 2004-06-11
JP2005064876 2005-03-09
JP2005160701A JP4387987B2 (ja) 2004-06-11 2005-05-31 微小構造体の検査装置、微小構造体の検査方法および微小構造体の検査プログラム

Publications (1)

Publication Number Publication Date
SG118367A1 true SG118367A1 (en) 2006-01-27

Family

ID=35005669

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200503730A SG118367A1 (en) 2004-06-11 2005-06-10 Device for inspecting micro structure method for inspecting micro structure and program for inspecting micro structure

Country Status (6)

Country Link
US (1) US7383732B2 (ja)
EP (1) EP1605258A3 (ja)
JP (1) JP4387987B2 (ja)
KR (1) KR20060046415A (ja)
SG (1) SG118367A1 (ja)
TW (1) TW200609508A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG126130A1 (en) * 2005-03-31 2006-10-30 Tokyo Electron Ltd Probing card and inspection apparatus for microstructure

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JP4750132B2 (ja) * 2005-01-03 2011-08-17 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 光音響検出器のバックグラウンド音響信号抑制
US7726190B2 (en) * 2005-03-03 2010-06-01 Tokyo Electron Limited Device, method and program for inspecting microstructure
JP2007040896A (ja) * 2005-08-04 2007-02-15 Tokyo Electron Ltd 微小構造体の検査装置、検査方法および検査プログラム
US9933394B2 (en) 2007-03-10 2018-04-03 Sergei Ostapenko Method and apparatus for detecting cracks and delamination in composite materials
AU2008226491B2 (en) * 2007-03-10 2012-09-13 Sergei Ostapenko A method and apparatus for in-line quality control of wafers
JPWO2009069670A1 (ja) * 2007-11-26 2011-04-14 東京エレクトロン株式会社 微小構造体検査装置および微小構造体検査方法
JP5470724B2 (ja) * 2008-03-13 2014-04-16 トヨタ自動車株式会社 振動試験装置
EP2316018B1 (en) * 2008-04-10 2017-10-18 Brookhaven Science Associates LLC. Nondestructive testing apparatus and method
US8076921B1 (en) * 2008-09-18 2011-12-13 The United States Of America As Represented By The Secretary Of The Navy Self-regulating power supply for micro electronic mechanical systems thermal actuators
JP5676315B2 (ja) * 2011-03-07 2015-02-25 大阪瓦斯株式会社 流体識別装置及び流体識別方法
JP5929138B2 (ja) * 2011-12-06 2016-06-01 セイコーエプソン株式会社 圧電モーターおよびロボット
JP5996343B2 (ja) * 2012-09-14 2016-09-21 東芝メディカルシステムズ株式会社 超音波診断装置
EP2747075A3 (en) * 2012-12-21 2016-06-22 Intermec IP Corp. Closed-loop active noise reduction system, such as for a thermal printer
EP3147258A1 (en) 2015-09-22 2017-03-29 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Connection panel for electronic components
EP3654041B1 (en) * 2018-11-16 2022-10-19 Siemens Industry Software NV Volume acceleration sensor calibration
CN113055889B (zh) * 2021-02-01 2022-06-14 浙江大学 一种基于惯性测量单元共振特征的手机牧场检测与标定方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG126130A1 (en) * 2005-03-31 2006-10-30 Tokyo Electron Ltd Probing card and inspection apparatus for microstructure

Also Published As

Publication number Publication date
JP2006313137A (ja) 2006-11-16
US20050279170A1 (en) 2005-12-22
TW200609508A (en) 2006-03-16
EP1605258A3 (en) 2007-05-30
EP1605258A2 (en) 2005-12-14
TWI370899B (ja) 2012-08-21
KR20060046415A (ko) 2006-05-17
US7383732B2 (en) 2008-06-10
JP4387987B2 (ja) 2009-12-24

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