SG11202109744RA - Crosslinkable siloxane compounds for the preparation of dielectric materials - Google Patents
Crosslinkable siloxane compounds for the preparation of dielectric materialsInfo
- Publication number
- SG11202109744RA SG11202109744RA SG11202109744RA SG11202109744RA SG 11202109744R A SG11202109744R A SG 11202109744RA SG 11202109744R A SG11202109744R A SG 11202109744RA SG 11202109744R A SG11202109744R A SG 11202109744RA
- Authority
- SG
- Singapore
- Prior art keywords
- preparation
- dielectric materials
- siloxane compounds
- crosslinkable siloxane
- crosslinkable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19161650 | 2019-03-08 | ||
PCT/EP2020/055952 WO2020182636A1 (en) | 2019-03-08 | 2020-03-06 | Crosslinkable siloxane compounds for the preparation of dielectric materials |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202109744RA true SG11202109744RA (en) | 2021-10-28 |
Family
ID=65729237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202109744R SG11202109744RA (en) | 2019-03-08 | 2020-03-06 | Crosslinkable siloxane compounds for the preparation of dielectric materials |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220177651A1 (ko) |
JP (1) | JP2022523249A (ko) |
KR (1) | KR20210139310A (ko) |
CN (1) | CN113508152B (ko) |
SG (1) | SG11202109744RA (ko) |
WO (1) | WO2020182636A1 (ko) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023077454A (ja) * | 2021-11-25 | 2023-06-06 | 信越化学工業株式会社 | イミド結合及び重合性不飽和結合含有環状オルガノシロキサン、及びそれを含む硬化性樹脂組成物 |
CN117467353A (zh) * | 2022-07-18 | 2024-01-30 | 康宁股份有限公司 | 组合物、介电材料、电子装置及其形成方法 |
GB2623090A (en) | 2022-10-04 | 2024-04-10 | Sublino Ltd | Method of colouring |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51125277A (en) * | 1974-12-28 | 1976-11-01 | Shin Etsu Chem Co Ltd | Aprocess for preparing organosilane compounds |
CH649772A5 (de) * | 1981-10-01 | 1985-06-14 | Ciba Geigy Ag | Lichtvernetzbare polysiloxane, verfahren zu deren herstellung und deren verwendung. |
DE4014882A1 (de) | 1990-05-09 | 1991-11-14 | Siemens Ag | Polyfunktionelle polyorganosiloxane |
US20060009578A1 (en) | 2004-07-07 | 2006-01-12 | Dershem Stephen M | Compositions containing maleimide-substituted silsesquioxanes and methods for use thereof |
US7777064B2 (en) | 2006-03-02 | 2010-08-17 | Designer Molecules, Inc. | Adhesive compositions containing cyclic siloxanes and methods for use thereof |
JP4967687B2 (ja) * | 2007-01-29 | 2012-07-04 | 東レ株式会社 | 感光性シロキサン組成物、それから形成された硬化膜、および硬化膜を有する素子 |
JP5375094B2 (ja) * | 2008-01-28 | 2013-12-25 | 東レ株式会社 | シロキサン系樹脂組成物 |
CN102245662B (zh) | 2008-12-12 | 2014-01-22 | 东亚合成株式会社 | 包含用马来酰亚胺基进行了表面修饰的无机氧化物微粒的固化型组合物 |
KR20180011862A (ko) | 2010-09-02 | 2018-02-02 | 메르크 파텐트 게엠베하 | 전자 디바이스용 중간층 |
JP2012149196A (ja) * | 2011-01-21 | 2012-08-09 | Jnc Corp | 熱硬化性組成物、硬化膜、及び表示素子 |
KR101686024B1 (ko) * | 2011-04-27 | 2016-12-13 | 후지필름 가부시키가이샤 | 임프린트용 경화성 조성물, 패턴 형성 방법 및 패턴 |
KR20130042867A (ko) | 2011-10-19 | 2013-04-29 | 삼성디스플레이 주식회사 | 보호막 용액 조성물, 박막 트랜지스터 표시판 및 박막 트랜지스터 표시판 제조 방법 |
CN104447849A (zh) | 2014-12-26 | 2015-03-25 | 上海爱默金山药业有限公司 | 烷基硅氧烷取代的马来酰亚胺的合成方法 |
JP2017151209A (ja) | 2016-02-23 | 2017-08-31 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | ポジ型感光性シロキサン組成物 |
-
2020
- 2020-03-06 JP JP2021553011A patent/JP2022523249A/ja active Pending
- 2020-03-06 US US17/436,746 patent/US20220177651A1/en active Pending
- 2020-03-06 WO PCT/EP2020/055952 patent/WO2020182636A1/en active Application Filing
- 2020-03-06 KR KR1020217032003A patent/KR20210139310A/ko unknown
- 2020-03-06 CN CN202080018528.5A patent/CN113508152B/zh active Active
- 2020-03-06 SG SG11202109744R patent/SG11202109744RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2022523249A (ja) | 2022-04-21 |
TW202104380A (zh) | 2021-02-01 |
WO2020182636A1 (en) | 2020-09-17 |
KR20210139310A (ko) | 2021-11-22 |
US20220177651A1 (en) | 2022-06-09 |
CN113508152B (zh) | 2023-08-08 |
CN113508152A (zh) | 2021-10-15 |
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