SG11202109744RA - Crosslinkable siloxane compounds for the preparation of dielectric materials - Google Patents
Crosslinkable siloxane compounds for the preparation of dielectric materialsInfo
- Publication number
- SG11202109744RA SG11202109744RA SG11202109744RA SG11202109744RA SG 11202109744R A SG11202109744R A SG 11202109744RA SG 11202109744R A SG11202109744R A SG 11202109744RA SG 11202109744R A SG11202109744R A SG 11202109744RA
- Authority
- SG
- Singapore
- Prior art keywords
- preparation
- dielectric materials
- siloxane compounds
- crosslinkable siloxane
- crosslinkable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
- C08G77/26—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen nitrogen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Silicon Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19161650 | 2019-03-08 | ||
PCT/EP2020/055952 WO2020182636A1 (en) | 2019-03-08 | 2020-03-06 | Crosslinkable siloxane compounds for the preparation of dielectric materials |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202109744RA true SG11202109744RA (en) | 2021-10-28 |
Family
ID=65729237
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202109744R SG11202109744RA (en) | 2019-03-08 | 2020-03-06 | Crosslinkable siloxane compounds for the preparation of dielectric materials |
Country Status (6)
Country | Link |
---|---|
US (1) | US20220177651A1 (en) |
JP (1) | JP2022523249A (en) |
KR (1) | KR20210139310A (en) |
CN (1) | CN113508152B (en) |
SG (1) | SG11202109744RA (en) |
WO (1) | WO2020182636A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2023077454A (en) * | 2021-11-25 | 2023-06-06 | 信越化学工業株式会社 | Cyclic organosiloxane containing imide bonds and polymerizable unsaturated bonds, and curable resin composition comprising the same |
CN117467353A (en) * | 2022-07-18 | 2024-01-30 | 康宁股份有限公司 | Composition, dielectric material, electronic device and forming method thereof |
GB2623090A (en) | 2022-10-04 | 2024-04-10 | Sublino Ltd | Method of colouring |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51125277A (en) * | 1974-12-28 | 1976-11-01 | Shin Etsu Chem Co Ltd | Aprocess for preparing organosilane compounds |
CH649772A5 (en) * | 1981-10-01 | 1985-06-14 | Ciba Geigy Ag | LIGHT CROSSLINKABLE POLYSILOXANES, METHOD FOR THE PRODUCTION AND THEIR USE. |
DE4014882A1 (en) | 1990-05-09 | 1991-11-14 | Siemens Ag | Polyfunctional poly-organo-siloxane(s) - by low-temp. nitration of poly-methyl-phenyl-siloxane(s), and conversion of nitro gps. into other functional gp(s) |
US20060009578A1 (en) * | 2004-07-07 | 2006-01-12 | Dershem Stephen M | Compositions containing maleimide-substituted silsesquioxanes and methods for use thereof |
US7777064B2 (en) | 2006-03-02 | 2010-08-17 | Designer Molecules, Inc. | Adhesive compositions containing cyclic siloxanes and methods for use thereof |
JP4967687B2 (en) * | 2007-01-29 | 2012-07-04 | 東レ株式会社 | Photosensitive siloxane composition, cured film formed therefrom, and device having cured film |
EP2239301B1 (en) * | 2008-01-28 | 2016-04-27 | Toray Industries, Inc. | Siloxane resin compositions |
US8530546B2 (en) | 2008-12-12 | 2013-09-10 | Toagosei Co., Ltd. | Curable composition comprising inorganic oxide microparticles that are surface-modified with maleimide groups |
CN103097420B (en) | 2010-09-02 | 2016-06-22 | 默克专利股份有限公司 | Interlayer for electronic device |
JP2012149196A (en) * | 2011-01-21 | 2012-08-09 | Jnc Corp | Thermosetting composition, cured film, and display element |
WO2012147828A1 (en) * | 2011-04-27 | 2012-11-01 | 富士フイルム株式会社 | Curable composition for imprinting, pattern formation method, and pattern |
KR20130042867A (en) | 2011-10-19 | 2013-04-29 | 삼성디스플레이 주식회사 | Solution composition for passivation layer, thin film transistor array panel and manufacturing method for thin film transistor array panel |
CN104447849A (en) | 2014-12-26 | 2015-03-25 | 上海爱默金山药业有限公司 | Synthesis method of siloxane-substituted maleimide |
JP2017151209A (en) | 2016-02-23 | 2017-08-31 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | Positive photosensitive siloxane composition |
-
2020
- 2020-03-06 KR KR1020217032003A patent/KR20210139310A/en unknown
- 2020-03-06 JP JP2021553011A patent/JP2022523249A/en active Pending
- 2020-03-06 SG SG11202109744R patent/SG11202109744RA/en unknown
- 2020-03-06 WO PCT/EP2020/055952 patent/WO2020182636A1/en active Application Filing
- 2020-03-06 CN CN202080018528.5A patent/CN113508152B/en active Active
- 2020-03-06 US US17/436,746 patent/US20220177651A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN113508152A (en) | 2021-10-15 |
KR20210139310A (en) | 2021-11-22 |
JP2022523249A (en) | 2022-04-21 |
TW202104380A (en) | 2021-02-01 |
WO2020182636A1 (en) | 2020-09-17 |
CN113508152B (en) | 2023-08-08 |
US20220177651A1 (en) | 2022-06-09 |
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