SG11202109533QA - A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization - Google Patents
A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallizationInfo
- Publication number
- SG11202109533QA SG11202109533QA SG11202109533QA SG11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA SG 11202109533Q A SG11202109533Q A SG 11202109533QA
- Authority
- SG
- Singapore
- Prior art keywords
- metallization
- activating
- conductive
- carbon
- containing substrate
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP19167282 | 2019-04-04 | ||
PCT/EP2020/059313 WO2020201387A1 (en) | 2019-04-04 | 2020-04-01 | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202109533QA true SG11202109533QA (en) | 2021-10-28 |
Family
ID=66092168
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202109533Q SG11202109533QA (en) | 2019-04-04 | 2020-04-01 | A method for activating a surface of a non-conductive or carbon-fibres containing substrate for metallization |
Country Status (11)
Country | Link |
---|---|
US (1) | US20220154343A1 (ko) |
EP (1) | EP3947772A1 (ko) |
JP (1) | JP7455859B2 (ko) |
KR (1) | KR20210143882A (ko) |
CN (1) | CN113614283A (ko) |
BR (1) | BR112021016763A2 (ko) |
CA (1) | CA3135816A1 (ko) |
MX (1) | MX2021012121A (ko) |
SG (1) | SG11202109533QA (ko) |
TW (1) | TWI764121B (ko) |
WO (1) | WO2020201387A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN116137875A (zh) | 2020-08-27 | 2023-05-19 | 德国艾托特克有限两合公司 | 活化用于金属化的非导电或含碳纤维衬底的表面的方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4278712A (en) * | 1978-08-31 | 1981-07-14 | Surface Technology, Inc. | Method for activating non-noble metal colloidal dispersion by controlled oxidation for electroless plating |
US4600699A (en) * | 1983-02-14 | 1986-07-15 | Enthone, Incorporated | Reclamation of a palladium-tin based electroless plating catalyst from the exhausted catalyst solution and accompanying rinse waters |
US4820547A (en) * | 1987-04-24 | 1989-04-11 | Surface Technology, Inc. | Activators for colloidal catalysts in electroless plating processes |
US5421989A (en) * | 1993-08-31 | 1995-06-06 | Atotech Deutschland Gmbh | Process for the metallization of nonconductive substrates with elimination of electroless metallization |
ES2622411T3 (es) * | 2005-06-10 | 2017-07-06 | Enthone, Inc. | Procedimiento para la metalización directa de sustratos no conductores |
US20080245184A1 (en) * | 2006-06-15 | 2008-10-09 | Woo Ram Lee | Preparation method of metal nano particle using micro mixer |
TW200813255A (en) | 2006-07-07 | 2008-03-16 | Rohm & Haas Elect Mat | Environmentally friendly electroless copper compositions |
FR2958944B1 (fr) * | 2010-04-19 | 2014-11-28 | Pegastech | Procede de revetement d'une surface d'un substrat en materiau non metallique par une couche metallique |
US20140242264A1 (en) | 2011-10-05 | 2014-08-28 | Atotech Deutschland Gmbh | Formaldehyde-free electroless copper plating solution |
JP6145681B2 (ja) * | 2014-02-07 | 2017-06-14 | 石原ケミカル株式会社 | 無電解銅メッキ用の水系銅コロイド触媒液並びに無電解銅メッキ方法 |
EP3181724A3 (en) * | 2015-12-14 | 2017-08-16 | Rohm and Haas Electronic Materials LLC | Environmentally friendly stable catalysts for electroless metallization of printed circuit boards and through-holes |
US10151035B2 (en) * | 2016-05-26 | 2018-12-11 | Rohm And Haas Electronic Materials Llc | Electroless metallization of through-holes and vias of substrates with tin-free ionic silver containing catalysts |
CN107460459A (zh) * | 2017-06-29 | 2017-12-12 | 深圳安德万斯新材料科技有限公司 | 一种纳米铜活化液及其制备方法 |
-
2020
- 2020-04-01 BR BR112021016763-3A patent/BR112021016763A2/pt unknown
- 2020-04-01 EP EP20713937.9A patent/EP3947772A1/en active Pending
- 2020-04-01 SG SG11202109533Q patent/SG11202109533QA/en unknown
- 2020-04-01 KR KR1020217034886A patent/KR20210143882A/ko not_active Application Discontinuation
- 2020-04-01 WO PCT/EP2020/059313 patent/WO2020201387A1/en unknown
- 2020-04-01 MX MX2021012121A patent/MX2021012121A/es unknown
- 2020-04-01 CN CN202080023050.5A patent/CN113614283A/zh active Pending
- 2020-04-01 CA CA3135816A patent/CA3135816A1/en active Pending
- 2020-04-01 JP JP2021558929A patent/JP7455859B2/ja active Active
- 2020-04-01 TW TW109111142A patent/TWI764121B/zh active
- 2020-04-01 US US17/433,065 patent/US20220154343A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20210143882A (ko) | 2021-11-29 |
JP7455859B2 (ja) | 2024-03-26 |
WO2020201387A1 (en) | 2020-10-08 |
TWI764121B (zh) | 2022-05-11 |
CA3135816A1 (en) | 2020-10-08 |
JP2022527973A (ja) | 2022-06-07 |
EP3947772A1 (en) | 2022-02-09 |
MX2021012121A (es) | 2021-11-03 |
TW202041712A (zh) | 2020-11-16 |
BR112021016763A2 (pt) | 2021-10-13 |
CN113614283A (zh) | 2021-11-05 |
US20220154343A1 (en) | 2022-05-19 |
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