SG11202108023SA - Filmy adhesive, adhesive sheet, semiconductor device, and method for manufacturing same - Google Patents
Filmy adhesive, adhesive sheet, semiconductor device, and method for manufacturing sameInfo
- Publication number
- SG11202108023SA SG11202108023SA SG11202108023SA SG11202108023SA SG11202108023SA SG 11202108023S A SG11202108023S A SG 11202108023SA SG 11202108023S A SG11202108023S A SG 11202108023SA SG 11202108023S A SG11202108023S A SG 11202108023SA SG 11202108023S A SG11202108023S A SG 11202108023SA
- Authority
- SG
- Singapore
- Prior art keywords
- adhesive
- semiconductor device
- manufacturing same
- filmy
- adhesive sheet
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title 2
- 230000001070 adhesive effect Effects 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/35—Heat-activated
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Organic Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019012270A JP7251167B2 (en) | 2019-01-28 | 2019-01-28 | FILM ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF |
| PCT/JP2020/001788 WO2020158490A1 (en) | 2019-01-28 | 2020-01-20 | Filmy adhesive, adhesive sheet, semiconductor device, and method for manufacturing same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202108023SA true SG11202108023SA (en) | 2021-08-30 |
Family
ID=71842082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202108023SA SG11202108023SA (en) | 2019-01-28 | 2020-01-20 | Filmy adhesive, adhesive sheet, semiconductor device, and method for manufacturing same |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP7251167B2 (en) |
| KR (1) | KR102693643B1 (en) |
| CN (1) | CN113348539A (en) |
| SG (1) | SG11202108023SA (en) |
| TW (1) | TWI830861B (en) |
| WO (1) | WO2020158490A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102466644B1 (en) * | 2021-03-23 | 2022-11-16 | 주식회사 엘엠에스 | Resin composition and optically clear adhesive |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005307037A (en) | 2004-04-22 | 2005-11-04 | Nagase Chemtex Corp | Film-shaped epoxy resin composition |
| JP5087910B2 (en) | 2005-12-13 | 2012-12-05 | 東レ株式会社 | Adhesive composition for electronic device, adhesive sheet for electronic device, and electronic component using the same |
| JP2009111340A (en) | 2007-10-11 | 2009-05-21 | Hitachi Chem Co Ltd | Wafer with adhesive, adhesive composition, and method for manufacturing wafer with adhesive |
| JP5454018B2 (en) | 2009-09-01 | 2014-03-26 | 日立化成株式会社 | Film adhesive, adhesive sheet and semiconductor device |
| JP5278457B2 (en) * | 2011-01-31 | 2013-09-04 | 信越化学工業株式会社 | Epoxy resin composition, die attach method using the same, and semiconductor device having cured product of the composition |
| JP5804820B2 (en) | 2011-07-25 | 2015-11-04 | 日東電工株式会社 | Adhesive sheet for manufacturing semiconductor device, semiconductor device having adhesive sheet for manufacturing semiconductor device, and method for manufacturing semiconductor device |
| JPWO2014065136A1 (en) * | 2012-10-22 | 2016-09-08 | 三菱レイヨン株式会社 | Laminated structure, method for manufacturing the same, and article |
| JP6098470B2 (en) | 2013-10-21 | 2017-03-22 | 信越化学工業株式会社 | Conductive epoxy resin composition for screen printing, die attach method using the same, and semiconductor device having cured product of the composition |
| WO2016113998A1 (en) | 2015-01-14 | 2016-07-21 | リンテック株式会社 | Resin film-forming sheet, resin film-forming composite sheet, and silicon wafer regeneration method |
| JP2016190964A (en) * | 2015-03-31 | 2016-11-10 | 日立化成株式会社 | Adhesive film |
| TW201722723A (en) * | 2015-09-01 | 2017-07-01 | Lintec Corp | Adhesive sheet |
| JP6521823B2 (en) | 2015-10-01 | 2019-05-29 | リンテック株式会社 | Dicing die bonding sheet |
| JP2017105883A (en) | 2015-12-07 | 2017-06-15 | 信越化学工業株式会社 | Liquid resin composition, die attach method using the composition, and semiconductor device having cured product of the composition |
| JP6973411B2 (en) * | 2016-12-22 | 2021-11-24 | 東亞合成株式会社 | Adhesive composition and coverlay film using it, bonding sheet, copper-clad laminate and electromagnetic wave shielding material |
-
2019
- 2019-01-28 JP JP2019012270A patent/JP7251167B2/en active Active
-
2020
- 2020-01-20 SG SG11202108023SA patent/SG11202108023SA/en unknown
- 2020-01-20 CN CN202080011016.6A patent/CN113348539A/en active Pending
- 2020-01-20 KR KR1020217024426A patent/KR102693643B1/en active IP Right Grant
- 2020-01-20 WO PCT/JP2020/001788 patent/WO2020158490A1/en active Application Filing
- 2020-01-21 TW TW109102299A patent/TWI830861B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020158490A1 (en) | 2020-08-06 |
| KR102693643B1 (en) | 2024-08-09 |
| TWI830861B (en) | 2024-02-01 |
| JP7251167B2 (en) | 2023-04-04 |
| KR20210114010A (en) | 2021-09-17 |
| CN113348539A (en) | 2021-09-03 |
| JP2020120073A (en) | 2020-08-06 |
| TW202037696A (en) | 2020-10-16 |
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