SG11202107216XA - Chemical-mechanical polishing particle and polishing slurry composition comprising same - Google Patents

Chemical-mechanical polishing particle and polishing slurry composition comprising same

Info

Publication number
SG11202107216XA
SG11202107216XA SG11202107216XA SG11202107216XA SG11202107216XA SG 11202107216X A SG11202107216X A SG 11202107216XA SG 11202107216X A SG11202107216X A SG 11202107216XA SG 11202107216X A SG11202107216X A SG 11202107216XA SG 11202107216X A SG11202107216X A SG 11202107216XA
Authority
SG
Singapore
Prior art keywords
chemical
same
slurry composition
polishing
particle
Prior art date
Application number
SG11202107216XA
Inventor
Weoun Gyuen Moon
Jae Hyun Kim
Kyu Soon Shin
Jong Dai Park
Min Gun Lee
Sung Hoon Jin
Goo Hwa Lee
Gyeong Sook Cho
Jae Hong Yoo
Original Assignee
Dongjin Semichem Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dongjin Semichem Co Ltd filed Critical Dongjin Semichem Co Ltd
Publication of SG11202107216XA publication Critical patent/SG11202107216XA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/04—Aqueous dispersions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/10—Production of cement, e.g. improving or optimising the production methods; Cement grinding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Dispersion Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Silicon Compounds (AREA)
  • Catalysts (AREA)
SG11202107216XA 2018-12-31 2019-12-27 Chemical-mechanical polishing particle and polishing slurry composition comprising same SG11202107216XA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020180173796A KR20200082827A (en) 2018-12-31 2018-12-31 CMP particle and CMP slurry composition
PCT/KR2019/018546 WO2020141804A1 (en) 2018-12-31 2019-12-27 Chemical-mechanical polishing particle and polishing slurry composition comprising same

Publications (1)

Publication Number Publication Date
SG11202107216XA true SG11202107216XA (en) 2021-08-30

Family

ID=71406916

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202107216XA SG11202107216XA (en) 2018-12-31 2019-12-27 Chemical-mechanical polishing particle and polishing slurry composition comprising same

Country Status (7)

Country Link
US (1) US11787974B2 (en)
JP (1) JP7404393B2 (en)
KR (1) KR20200082827A (en)
CN (1) CN113302256B (en)
SG (1) SG11202107216XA (en)
TW (1) TW202101560A (en)
WO (1) WO2020141804A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113138203B (en) * 2021-05-31 2022-08-30 中南大学 Preparation method of 4D printed CuAl-based alloy EBSD sample

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4346712B2 (en) * 1998-11-20 2009-10-21 スピードファム株式会社 Wafer edge polishing method
US7077880B2 (en) * 2004-01-16 2006-07-18 Dupont Air Products Nanomaterials Llc Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
US7071105B2 (en) * 2003-02-03 2006-07-04 Cabot Microelectronics Corporation Method of polishing a silicon-containing dielectric
JP2006231436A (en) * 2005-02-23 2006-09-07 Tokyo Seimitsu Co Ltd Polishing slurry and polishing method
WO2006103092A1 (en) * 2005-03-31 2006-10-05 Unilever Plc Process of preparing aluminium species
JP2007299942A (en) * 2006-04-28 2007-11-15 Fujifilm Corp Metal polishing composition, and chemical-mechanical polishing method using it
US20070298611A1 (en) * 2006-06-27 2007-12-27 Jinru Bian Selective barrier slurry for chemical mechanical polishing
JP5327427B2 (en) * 2007-06-19 2013-10-30 Ｊｓｒ株式会社 Chemical mechanical polishing aqueous dispersion preparation set, chemical mechanical polishing aqueous dispersion preparation method, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
KR100928456B1 (en) * 2009-06-01 2009-11-25 주식회사 동진쎄미켐 Chemical mechanical polishing slurry composition including non-ionized, heat activated nano catalyst and polishing method using the same
JP7032327B2 (en) * 2016-05-19 2022-03-08 ドンジン セミケム カンパニー リミテッド Slurry composition for chemical-mechanical polishing
JP6878783B2 (en) * 2016-07-19 2021-06-02 昭和電工マテリアルズ株式会社 Abrasives, storage solutions for abrasives and polishing methods
WO2018102555A1 (en) * 2016-12-02 2018-06-07 Ecolab USA, Inc. Polyaluminum salts and their uses in preparation of high-purity colloidal aluminum-silica composite particles and zeolites

Also Published As

Publication number Publication date
US20210340405A1 (en) 2021-11-04
WO2020141804A1 (en) 2020-07-09
CN113302256A (en) 2021-08-24
KR20200082827A (en) 2020-07-08
JP2022517875A (en) 2022-03-10
US11787974B2 (en) 2023-10-17
TW202101560A (en) 2021-01-01
JP7404393B2 (en) 2023-12-25
CN113302256B (en) 2023-07-28

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