SG11202105360UA - Bevel portion treatment agent composition and method of manufacturing wafer - Google Patents

Bevel portion treatment agent composition and method of manufacturing wafer

Info

Publication number
SG11202105360UA
SG11202105360UA SG11202105360UA SG11202105360UA SG11202105360UA SG 11202105360U A SG11202105360U A SG 11202105360UA SG 11202105360U A SG11202105360U A SG 11202105360UA SG 11202105360U A SG11202105360U A SG 11202105360UA SG 11202105360U A SG11202105360U A SG 11202105360UA
Authority
SG
Singapore
Prior art keywords
treatment agent
agent composition
bevel portion
manufacturing wafer
portion treatment
Prior art date
Application number
SG11202105360UA
Inventor
Yuki Fukui
Yuzo Okumura
Yoshiharu Terui
Soichi Kumon
Original Assignee
Central Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Central Glass Co Ltd filed Critical Central Glass Co Ltd
Publication of SG11202105360UA publication Critical patent/SG11202105360UA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/02—Inorganic compounds
    • C11D7/04—Water-soluble compounds
    • C11D7/08—Acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/28—Organic compounds containing halogen
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0803—Compounds with Si-C or Si-Si linkages
    • C07F7/081—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te
    • C07F7/0812—Compounds with Si-C or Si-Si linkages comprising at least one atom selected from the elements N, O, halogen, S, Se or Te comprising a heterocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/18—Compounds having one or more C—Si linkages as well as one or more C—O—Si linkages
    • C07F7/1804—Compounds having Si-O-C linkages
    • C07F7/1872—Preparation; Treatments not provided for in C07F7/20
    • C07F7/188—Preparation; Treatments not provided for in C07F7/20 by reactions involving the formation of Si-O linkages
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/34—Organic compounds containing sulfur
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02082—Cleaning product to be cleaned
    • H01L21/02087—Cleaning of wafer edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
    • H01L21/02334—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment in-situ cleaning after layer formation, e.g. removing process residues
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/40—Specific cleaning or washing processes
    • C11D2111/44—Multi-step processes

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Wood Science & Technology (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Emergency Medicine (AREA)
  • Inorganic Chemistry (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Weting (AREA)
  • Formation Of Insulating Films (AREA)
SG11202105360UA 2018-11-22 2019-10-21 Bevel portion treatment agent composition and method of manufacturing wafer SG11202105360UA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018218942 2018-11-22
PCT/JP2019/041349 WO2020105340A1 (en) 2018-11-22 2019-10-21 Beveled part treatment agent composition and method for manufacturing wafer

Publications (1)

Publication Number Publication Date
SG11202105360UA true SG11202105360UA (en) 2021-06-29

Family

ID=70774250

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202105360UA SG11202105360UA (en) 2018-11-22 2019-10-21 Bevel portion treatment agent composition and method of manufacturing wafer

Country Status (7)

Country Link
US (1) US11817310B2 (en)
JP (1) JP7328564B2 (en)
KR (1) KR20210092297A (en)
CN (1) CN113169060A (en)
SG (1) SG11202105360UA (en)
TW (1) TW202031668A (en)
WO (1) WO2020105340A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023234370A1 (en) * 2022-06-02 2023-12-07 セントラル硝子株式会社 Substrate processing method, and substrate manufacturing method

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005340554A (en) 2004-05-28 2005-12-08 Hitachi Ltd Manufacturing method for semiconductor memory
JP2008277748A (en) 2007-03-30 2008-11-13 Renesas Technology Corp Method for forming resist pattern, and semiconductor device manufactured by the method
US20080241489A1 (en) 2007-03-30 2008-10-02 Renesas Technology Corp. Method of forming resist pattern and semiconductor device manufactured with the same
JP5136103B2 (en) 2008-02-12 2013-02-06 東京エレクトロン株式会社 Cleaning device and method, coating and developing device and method, and storage medium
EP2246876A4 (en) * 2008-02-22 2012-07-04 Asahi Glass Co Ltd Water-repellant composition for substrate to be exposed, method of forming resist pattern, electronic device produced by the formation method, method of imparting water repellency to substrate to be exposed, water-repellant set for substrate to be exposed, and method of imparting water repellency with the same to substrate to be exposed
JP2009218249A (en) 2008-03-07 2009-09-24 Seiko Epson Corp Wafer cleaning equipment and production process of semiconductor device
KR102189379B1 (en) * 2008-10-21 2020-12-11 도오꾜오까고오교 가부시끼가이샤 Surface treatment liquid, surface treatment method, hydrophobilization method, and hydrophobilized substrate
KR101363441B1 (en) * 2010-06-07 2014-02-21 샌트랄 글래스 컴퍼니 리미티드 Chemical solution for formation of protective film, process for preparing thereof and process for cleaning using the same
JP2012015335A (en) 2010-06-30 2012-01-19 Central Glass Co Ltd Chemical for forming protective film, and cleaning method of wafer surface
JP2013118347A (en) * 2010-12-28 2013-06-13 Central Glass Co Ltd Cleaning method of wafer
JP6098741B2 (en) * 2010-12-28 2017-03-22 セントラル硝子株式会社 Wafer cleaning method
JP5288147B2 (en) * 2011-11-29 2013-09-11 セントラル硝子株式会社 Method for preparing protective film forming chemical
JP6317547B2 (en) 2012-08-28 2018-04-25 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing method
US10093815B2 (en) * 2015-09-24 2018-10-09 Tokyo Ohka Kogyo Co., Ltd. Surface treatment agent and surface treatment method
SG11201908617QA (en) * 2017-03-24 2019-10-30 Fujifilm Electronic Materials Usa Inc Surface treatment methods and compositions therefor
SG11202009171XA (en) * 2018-04-05 2020-10-29 Central Glass Co Ltd Surface treatment method of wafer and composition used for said method

Also Published As

Publication number Publication date
TW202031668A (en) 2020-09-01
CN113169060A (en) 2021-07-23
JPWO2020105340A1 (en) 2021-10-07
US11817310B2 (en) 2023-11-14
WO2020105340A1 (en) 2020-05-28
JP7328564B2 (en) 2023-08-17
KR20210092297A (en) 2021-07-23
US20220020582A1 (en) 2022-01-20

Similar Documents

Publication Publication Date Title
IL288061A (en) Compounds and methods for the treatment of covid-19
IL273959A (en) Methods and compositions for the treatment of rare diseases
IL275626A (en) Surface treatment compositions and methods
SG11202009171XA (en) Surface treatment method of wafer and composition used for said method
SG11202004680UA (en) Cellular compositions and methods of treatment i
SG11202103033WA (en) Compositions and methods for the treatment of presbyopia
IL287796A (en) Compositions and methods for the treatment of atpase-mediated diseases
IL290348B1 (en) Surface treatment compositions and methods
IL279091A (en) Compositions and methods for treatment of dominant retinitis pigmentosa
SG11202000380VA (en) Method of polishing substrate and polishing composition set
IL272121A (en) Composition and methods for the treatment of myopia
IL280348A (en) Surface treatment compositions and methods
IL278978A (en) Compositions and methods for treatment of psoriasis
EP4100029A4 (en) Compositions and methods of use thereof for treatment of mastitis
SG11202105360UA (en) Bevel portion treatment agent composition and method of manufacturing wafer
IL273850A (en) Compositions and methods for treatment of fibrosis
GB201913122D0 (en) Compositions and methods for treatment of cholangiocarcinoma
SG11202109726TA (en) Semiconductor wafer and method of manufacturing semiconductor apparatus
IL289236A (en) Compositions and methods for treatment of fungal infections
GB202217355D0 (en) Methods for the prophylaxis and treatment of Covid and Covid-19
IL287538A (en) Compositions and methods for treatment of cancer
GB201810923D0 (en) Compositions and method of treatment
IL280262A (en) Compositions and methods for the treatment of cancer
EP3987032A4 (en) Methods and compositions for the treatment of cancer
SG11202107355RA (en) Improved method and compositions for surface treatment