SG11202102687RA - Capillary guide device and wire bonding apparatus - Google Patents
Capillary guide device and wire bonding apparatusInfo
- Publication number
- SG11202102687RA SG11202102687RA SG11202102687RA SG11202102687RA SG11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA
- Authority
- SG
- Singapore
- Prior art keywords
- guide device
- wire bonding
- bonding apparatus
- capillary guide
- capillary
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/10—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of mechanical energy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/26—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/02—Carriages for supporting the welding or cutting element
- B23K37/0241—Attachments between the welding or cutting element and the carriage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78347—Piezoelectric transducers
- H01L2224/78349—Piezoelectric transducers in the upper part of the bonding apparatus, e.g. in the capillary or wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78353—Ultrasonic horns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/789—Means for monitoring the connection process
- H01L2224/78901—Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019049856 | 2019-03-18 | ||
PCT/JP2020/011535 WO2020189642A1 (fr) | 2019-03-18 | 2020-03-16 | Dispositif de guide capillaire et dispositif de liaison de fil |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202102687RA true SG11202102687RA (en) | 2021-04-29 |
Family
ID=72520152
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202102687RA SG11202102687RA (en) | 2019-03-18 | 2020-03-16 | Capillary guide device and wire bonding apparatus |
Country Status (7)
Country | Link |
---|---|
US (1) | US11717912B2 (fr) |
JP (1) | JP6902304B2 (fr) |
KR (1) | KR102411257B1 (fr) |
CN (1) | CN112640069B (fr) |
SG (1) | SG11202102687RA (fr) |
TW (1) | TWI735183B (fr) |
WO (1) | WO2020189642A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11717912B2 (en) * | 2019-03-18 | 2023-08-08 | Shinkawa Ltd. | Capillary guide device and wire bonding apparatus |
JP7537806B1 (ja) | 2023-11-08 | 2024-08-21 | 株式会社新川 | ワイヤボンディング装置 |
Family Cites Families (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07221141A (ja) * | 1994-02-03 | 1995-08-18 | Matsushita Electric Ind Co Ltd | 超音波ワイヤボンディング装置 |
JPH09213732A (ja) * | 1996-02-07 | 1997-08-15 | Shinkawa Ltd | 超音波ホーンのキャピラリ保持構造 |
JP3765778B2 (ja) * | 2002-08-29 | 2006-04-12 | ローム株式会社 | ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法 |
JP2007173355A (ja) * | 2005-12-20 | 2007-07-05 | Fujifilm Corp | ワイヤボンディング装置 |
JP4700595B2 (ja) | 2006-12-04 | 2011-06-15 | 株式会社新川 | ワイヤボンディング装置並びにワイヤボンディング装置のボンディングツール交換方法及びプログラム |
JP2008288473A (ja) * | 2007-05-21 | 2008-11-27 | Panasonic Corp | ワイヤボンディング方法およびワイヤボンディング装置 |
JP4595020B2 (ja) * | 2009-04-02 | 2010-12-08 | 株式会社新川 | ボンディング装置及びボンディングツール振巾測定方法ならびにボンディングツール振巾較正方法 |
US8096461B2 (en) * | 2009-09-03 | 2012-01-17 | Advanced Semiconductor Engineering, Inc. | Wire-bonding machine with cover-gas supply device |
US20120132695A1 (en) * | 2010-11-30 | 2012-05-31 | Yue Zhang | Wire feeding apparatus for wire bonders |
JP2014516213A (ja) * | 2011-06-22 | 2014-07-07 | イル ウォン カンパニー リミテッド | キャピラリー自動取替システム |
KR101352586B1 (ko) * | 2011-11-10 | 2014-01-20 | 주식회사 일원 | 캐필러리 자동 교체시스템 |
KR20130098635A (ko) | 2012-02-28 | 2013-09-05 | 삼성전자주식회사 | 반도체 와이어 본드 공정의 캐필러리 교체시스템 |
US8672270B2 (en) | 2012-07-06 | 2014-03-18 | The United States Of America As Represented By The Secretary Of The Army | Tie down and jack fitting assembly for helicopter |
JP5583179B2 (ja) * | 2012-08-03 | 2014-09-03 | 株式会社カイジョー | ボンディング装置 |
JP5934087B2 (ja) * | 2012-12-27 | 2016-06-15 | 株式会社新川 | ワイヤボンディング装置 |
JP6427813B2 (ja) * | 2015-01-06 | 2018-11-28 | 株式会社アドウェルズ | ワイヤボンディング装置 |
JP6093429B1 (ja) * | 2015-12-17 | 2017-03-08 | 株式会社カイジョー | キャピラリ搬送装置、キャピラリ取り付け装置、キャピラリ交換装置、キャピラリ搬送方法、キャピラリ取り付け方法及びキャピラリ交換方法 |
US10679962B2 (en) * | 2016-02-09 | 2020-06-09 | Texas Instruments Incorporated | Capillary jig for wire bonding and method of installing a capillary |
WO2017149428A1 (fr) | 2016-03-04 | 2017-09-08 | Semiconductor Energy Laboratory Co., Ltd. | Dispositif à semi-conducteur, son procédé de fabrication et dispositif d'affichage comprenant le dispositif à semi-conducteur |
KR102338722B1 (ko) * | 2017-04-05 | 2021-12-15 | 삼성전자주식회사 | 캐필러리 교체 방법 |
CN112203794B (zh) * | 2018-11-20 | 2022-08-09 | 株式会社Link-Us | 超声波接合装置 |
US11717912B2 (en) * | 2019-03-18 | 2023-08-08 | Shinkawa Ltd. | Capillary guide device and wire bonding apparatus |
CN110734295B (zh) * | 2019-09-17 | 2022-02-18 | 昆山市柳鑫电子有限公司 | 一种氮化铝陶瓷覆铜板的制备方法 |
-
2020
- 2020-03-16 US US17/431,718 patent/US11717912B2/en active Active
- 2020-03-16 SG SG11202102687RA patent/SG11202102687RA/en unknown
- 2020-03-16 KR KR1020207026163A patent/KR102411257B1/ko active IP Right Grant
- 2020-03-16 CN CN202080004754.8A patent/CN112640069B/zh active Active
- 2020-03-16 JP JP2020540362A patent/JP6902304B2/ja active Active
- 2020-03-16 WO PCT/JP2020/011535 patent/WO2020189642A1/fr active Application Filing
- 2020-03-17 TW TW109108833A patent/TWI735183B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW202040709A (zh) | 2020-11-01 |
US20220134468A1 (en) | 2022-05-05 |
KR20200120692A (ko) | 2020-10-21 |
CN112640069A (zh) | 2021-04-09 |
JP6902304B2 (ja) | 2021-07-14 |
JPWO2020189642A1 (ja) | 2021-04-30 |
WO2020189642A1 (fr) | 2020-09-24 |
CN112640069B (zh) | 2024-09-06 |
KR102411257B1 (ko) | 2022-06-22 |
TWI735183B (zh) | 2021-08-01 |
US11717912B2 (en) | 2023-08-08 |
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