SG11202102687RA - Capillary guide device and wire bonding apparatus - Google Patents

Capillary guide device and wire bonding apparatus

Info

Publication number
SG11202102687RA
SG11202102687RA SG11202102687RA SG11202102687RA SG11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA SG 11202102687R A SG11202102687R A SG 11202102687RA
Authority
SG
Singapore
Prior art keywords
guide device
wire bonding
bonding apparatus
capillary guide
capillary
Prior art date
Application number
SG11202102687RA
Other languages
English (en)
Inventor
Yohei Uchida
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of SG11202102687RA publication Critical patent/SG11202102687RA/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106Features related to sonotrodes
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • B23K20/005Capillary welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/10Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of mechanical energy
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004Wire welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/26Auxiliary equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/02Carriages for supporting the welding or cutting element
    • B23K37/0241Attachments between the welding or cutting element and the carriage
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/40Semiconductor devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/42Printed circuits
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • H01L2224/78308Removable capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78347Piezoelectric transducers
    • H01L2224/78349Piezoelectric transducers in the upper part of the bonding apparatus, e.g. in the capillary or wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78353Ultrasonic horns
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/789Means for monitoring the connection process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/789Means for monitoring the connection process
    • H01L2224/78901Means for monitoring the connection process using a computer, e.g. fully- or semi-automatic bonding
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Wire Bonding (AREA)
SG11202102687RA 2019-03-18 2020-03-16 Capillary guide device and wire bonding apparatus SG11202102687RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019049856 2019-03-18
PCT/JP2020/011535 WO2020189642A1 (fr) 2019-03-18 2020-03-16 Dispositif de guide capillaire et dispositif de liaison de fil

Publications (1)

Publication Number Publication Date
SG11202102687RA true SG11202102687RA (en) 2021-04-29

Family

ID=72520152

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202102687RA SG11202102687RA (en) 2019-03-18 2020-03-16 Capillary guide device and wire bonding apparatus

Country Status (7)

Country Link
US (1) US11717912B2 (fr)
JP (1) JP6902304B2 (fr)
KR (1) KR102411257B1 (fr)
CN (1) CN112640069B (fr)
SG (1) SG11202102687RA (fr)
TW (1) TWI735183B (fr)
WO (1) WO2020189642A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11717912B2 (en) * 2019-03-18 2023-08-08 Shinkawa Ltd. Capillary guide device and wire bonding apparatus
JP7537806B1 (ja) 2023-11-08 2024-08-21 株式会社新川 ワイヤボンディング装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07221141A (ja) * 1994-02-03 1995-08-18 Matsushita Electric Ind Co Ltd 超音波ワイヤボンディング装置
JPH09213732A (ja) * 1996-02-07 1997-08-15 Shinkawa Ltd 超音波ホーンのキャピラリ保持構造
JP3765778B2 (ja) * 2002-08-29 2006-04-12 ローム株式会社 ワイヤボンディング用キャピラリ及びこれを用いたワイヤボンディング方法
JP2007173355A (ja) * 2005-12-20 2007-07-05 Fujifilm Corp ワイヤボンディング装置
JP4700595B2 (ja) 2006-12-04 2011-06-15 株式会社新川 ワイヤボンディング装置並びにワイヤボンディング装置のボンディングツール交換方法及びプログラム
JP2008288473A (ja) * 2007-05-21 2008-11-27 Panasonic Corp ワイヤボンディング方法およびワイヤボンディング装置
JP4595020B2 (ja) * 2009-04-02 2010-12-08 株式会社新川 ボンディング装置及びボンディングツール振巾測定方法ならびにボンディングツール振巾較正方法
US8096461B2 (en) * 2009-09-03 2012-01-17 Advanced Semiconductor Engineering, Inc. Wire-bonding machine with cover-gas supply device
US20120132695A1 (en) * 2010-11-30 2012-05-31 Yue Zhang Wire feeding apparatus for wire bonders
JP2014516213A (ja) * 2011-06-22 2014-07-07 イル ウォン カンパニー リミテッド キャピラリー自動取替システム
KR101352586B1 (ko) * 2011-11-10 2014-01-20 주식회사 일원 캐필러리 자동 교체시스템
KR20130098635A (ko) 2012-02-28 2013-09-05 삼성전자주식회사 반도체 와이어 본드 공정의 캐필러리 교체시스템
US8672270B2 (en) 2012-07-06 2014-03-18 The United States Of America As Represented By The Secretary Of The Army Tie down and jack fitting assembly for helicopter
JP5583179B2 (ja) * 2012-08-03 2014-09-03 株式会社カイジョー ボンディング装置
JP5934087B2 (ja) * 2012-12-27 2016-06-15 株式会社新川 ワイヤボンディング装置
JP6427813B2 (ja) * 2015-01-06 2018-11-28 株式会社アドウェルズ ワイヤボンディング装置
JP6093429B1 (ja) * 2015-12-17 2017-03-08 株式会社カイジョー キャピラリ搬送装置、キャピラリ取り付け装置、キャピラリ交換装置、キャピラリ搬送方法、キャピラリ取り付け方法及びキャピラリ交換方法
US10679962B2 (en) * 2016-02-09 2020-06-09 Texas Instruments Incorporated Capillary jig for wire bonding and method of installing a capillary
WO2017149428A1 (fr) 2016-03-04 2017-09-08 Semiconductor Energy Laboratory Co., Ltd. Dispositif à semi-conducteur, son procédé de fabrication et dispositif d'affichage comprenant le dispositif à semi-conducteur
KR102338722B1 (ko) * 2017-04-05 2021-12-15 삼성전자주식회사 캐필러리 교체 방법
CN112203794B (zh) * 2018-11-20 2022-08-09 株式会社Link-Us 超声波接合装置
US11717912B2 (en) * 2019-03-18 2023-08-08 Shinkawa Ltd. Capillary guide device and wire bonding apparatus
CN110734295B (zh) * 2019-09-17 2022-02-18 昆山市柳鑫电子有限公司 一种氮化铝陶瓷覆铜板的制备方法

Also Published As

Publication number Publication date
TW202040709A (zh) 2020-11-01
US20220134468A1 (en) 2022-05-05
KR20200120692A (ko) 2020-10-21
CN112640069A (zh) 2021-04-09
JP6902304B2 (ja) 2021-07-14
JPWO2020189642A1 (ja) 2021-04-30
WO2020189642A1 (fr) 2020-09-24
CN112640069B (zh) 2024-09-06
KR102411257B1 (ko) 2022-06-22
TWI735183B (zh) 2021-08-01
US11717912B2 (en) 2023-08-08

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