SG11202102118TA - Methods for polishing semiconductor substrates that adjust for pad-to-pad variance - Google Patents
Methods for polishing semiconductor substrates that adjust for pad-to-pad varianceInfo
- Publication number
- SG11202102118TA SG11202102118TA SG11202102118TA SG11202102118TA SG11202102118TA SG 11202102118T A SG11202102118T A SG 11202102118TA SG 11202102118T A SG11202102118T A SG 11202102118TA SG 11202102118T A SG11202102118T A SG 11202102118TA SG 11202102118T A SG11202102118T A SG 11202102118TA
- Authority
- SG
- Singapore
- Prior art keywords
- pad
- adjust
- methods
- semiconductor substrates
- variance
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/03—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent according to the final size of the previously ground workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
- B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9503—Wafer edge inspection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02021—Edge treatment, chamfering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02024—Mirror polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/46—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428
- H01L21/461—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/428 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/463—Mechanical treatment, e.g. grinding, ultrasonic treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201862729134P | 2018-09-10 | 2018-09-10 | |
PCT/US2019/047829 WO2020055571A1 (en) | 2018-09-10 | 2019-08-23 | Methods for polishing semiconductor substrates that adjust for pad-to-pad variance |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202102118TA true SG11202102118TA (en) | 2021-04-29 |
Family
ID=67841307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202102118TA SG11202102118TA (en) | 2018-09-10 | 2019-08-23 | Methods for polishing semiconductor substrates that adjust for pad-to-pad variance |
Country Status (8)
Country | Link |
---|---|
US (1) | US11081359B2 (en) |
EP (1) | EP3849742B1 (en) |
JP (1) | JP7341223B2 (en) |
KR (1) | KR102515998B1 (en) |
CN (2) | CN114734373A (en) |
SG (1) | SG11202102118TA (en) |
TW (1) | TWI802747B (en) |
WO (1) | WO2020055571A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6635088B2 (en) * | 2017-04-24 | 2020-01-22 | 信越半導体株式会社 | Polishing method of silicon wafer |
WO2023127601A1 (en) * | 2021-12-27 | 2023-07-06 | 株式会社レゾナック | Waviness prediction device, waviness prediction method, processing method for polishing target article, and program |
CN115752220A (en) * | 2022-12-09 | 2023-03-07 | 上海超硅半导体股份有限公司 | Silicon wafer edge morphology datamation method |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001074532A1 (en) | 2000-03-30 | 2001-10-11 | Memc Electronic Materials, S.P.A. | Method of polishing wafers |
TWI268286B (en) | 2000-04-28 | 2006-12-11 | Kao Corp | Roll-off reducing agent |
JP2002273649A (en) | 2001-03-15 | 2002-09-25 | Oki Electric Ind Co Ltd | Grinder having dresser |
JP3935757B2 (en) * | 2002-03-28 | 2007-06-27 | 信越半導体株式会社 | Wafer double-side polishing apparatus and double-side polishing method |
KR100932741B1 (en) * | 2002-03-28 | 2009-12-21 | 신에쯔 한도타이 가부시키가이샤 | Wafer double side polishing device and double side polishing method |
KR20040056177A (en) | 2002-12-23 | 2004-06-30 | 주식회사 실트론 | A polishing device of silicon wafer |
KR100529434B1 (en) * | 2003-02-04 | 2005-11-17 | 동부아남반도체 주식회사 | Pad conditioner of a polishing apparatus for use in a semiconductor substrate |
DE10324429B4 (en) * | 2003-05-28 | 2010-08-19 | Advanced Micro Devices, Inc., Sunnyvale | Method for operating a chemical-mechanical polishing system by means of a sensor signal of a polishing pad conditioner |
TWI386989B (en) * | 2005-02-25 | 2013-02-21 | Ebara Corp | Polishing apparatus and polishing method |
KR100623189B1 (en) | 2005-05-18 | 2006-09-13 | 삼성전자주식회사 | Apparatus for supplying slurry and apparatus for chemical mechanical polishing having the same |
JP2007053298A (en) | 2005-08-19 | 2007-03-01 | Nitta Haas Inc | Polishing composition |
KR101243423B1 (en) | 2005-11-11 | 2013-03-13 | 히타치가세이가부시끼가이샤 | Polishing agent for silicon oxide, liquid additive, and method of polishing |
KR20080062020A (en) | 2006-12-28 | 2008-07-03 | 주식회사 하이닉스반도체 | Method for fabricating of semiconductor wafer |
JP5057325B2 (en) | 2007-05-11 | 2012-10-24 | ニッタ・ハース株式会社 | Polishing pad |
JP5275595B2 (en) | 2007-08-29 | 2013-08-28 | 日本化学工業株式会社 | Semiconductor wafer polishing composition and polishing method |
JP5450946B2 (en) | 2007-09-27 | 2014-03-26 | Sumco Techxiv株式会社 | Semiconductor wafer double-side polishing method |
US8192248B2 (en) | 2008-05-30 | 2012-06-05 | Memc Electronic Materials, Inc. | Semiconductor wafer polishing apparatus and method of polishing |
JP5415735B2 (en) | 2008-09-26 | 2014-02-12 | 株式会社荏原製作所 | Dressing method, dressing condition determining method, dressing condition determining program, and polishing apparatus |
DE102009030292B4 (en) * | 2009-06-24 | 2011-12-01 | Siltronic Ag | Method for polishing both sides of a semiconductor wafer |
CN102189469B (en) * | 2010-03-11 | 2013-04-10 | 中芯国际集成电路制造(上海)有限公司 | Method for dynamically adjusting time limit of chemically-mechanical polishing |
TWI565559B (en) | 2011-07-19 | 2017-01-11 | 荏原製作所股份有限公司 | Polishing device and method |
CN103733314B (en) | 2011-09-01 | 2016-05-04 | 信越半导体株式会社 | The Ginding process of silicon wafer and grinding agent |
US20140015107A1 (en) * | 2012-07-12 | 2014-01-16 | Macronix International Co., Ltd. | Method to improve within wafer uniformity of cmp process |
DE102013201663B4 (en) | 2012-12-04 | 2020-04-23 | Siltronic Ag | Process for polishing a semiconductor wafer |
US9193025B2 (en) | 2013-03-13 | 2015-11-24 | Sunedison Semiconductor Limited (Uen201334164H) | Single side polishing using shape matching |
CN105081957A (en) * | 2014-05-14 | 2015-11-25 | 和舰科技(苏州)有限公司 | Chemical mechanical polishing method for wafer planarization production |
US9566687B2 (en) | 2014-10-13 | 2017-02-14 | Sunedison Semiconductor Limited (Uen201334164H) | Center flex single side polishing head having recess and cap |
US10128146B2 (en) * | 2015-08-20 | 2018-11-13 | Globalwafers Co., Ltd. | Semiconductor substrate polishing methods and slurries and methods for manufacturing silicon on insulator structures |
JP6406238B2 (en) * | 2015-12-18 | 2018-10-17 | 株式会社Sumco | Wafer polishing method and polishing apparatus |
US10600634B2 (en) * | 2015-12-21 | 2020-03-24 | Globalwafers Co., Ltd. | Semiconductor substrate polishing methods with dynamic control |
JP6794275B2 (en) | 2017-01-17 | 2020-12-02 | 株式会社荏原製作所 | Polishing method |
US11504821B2 (en) * | 2017-11-16 | 2022-11-22 | Applied Materials, Inc. | Predictive filter for polishing pad wear rate monitoring |
-
2019
- 2019-08-22 US US16/548,429 patent/US11081359B2/en active Active
- 2019-08-23 EP EP19762673.2A patent/EP3849742B1/en active Active
- 2019-08-23 CN CN202210527011.XA patent/CN114734373A/en active Pending
- 2019-08-23 CN CN201980068792.7A patent/CN113165137B/en active Active
- 2019-08-23 KR KR1020217010352A patent/KR102515998B1/en active IP Right Grant
- 2019-08-23 JP JP2021513335A patent/JP7341223B2/en active Active
- 2019-08-23 WO PCT/US2019/047829 patent/WO2020055571A1/en unknown
- 2019-08-23 SG SG11202102118TA patent/SG11202102118TA/en unknown
- 2019-09-03 TW TW108131742A patent/TWI802747B/en active
Also Published As
Publication number | Publication date |
---|---|
US11081359B2 (en) | 2021-08-03 |
KR102515998B1 (en) | 2023-03-29 |
TW202023749A (en) | 2020-07-01 |
JP7341223B2 (en) | 2023-09-08 |
CN113165137B (en) | 2022-06-14 |
US20200083057A1 (en) | 2020-03-12 |
CN114734373A (en) | 2022-07-12 |
EP3849742A1 (en) | 2021-07-21 |
CN113165137A (en) | 2021-07-23 |
JP2021536140A (en) | 2021-12-23 |
EP3849742B1 (en) | 2022-10-05 |
KR20210045495A (en) | 2021-04-26 |
WO2020055571A1 (en) | 2020-03-19 |
TWI802747B (en) | 2023-05-21 |
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