SG11202101124SA - Inspection when transferring electronic components from a first substrate to a second substrate - Google Patents
Inspection when transferring electronic components from a first substrate to a second substrateInfo
- Publication number
- SG11202101124SA SG11202101124SA SG11202101124SA SG11202101124SA SG11202101124SA SG 11202101124S A SG11202101124S A SG 11202101124SA SG 11202101124S A SG11202101124S A SG 11202101124SA SG 11202101124S A SG11202101124S A SG 11202101124SA SG 11202101124S A SG11202101124S A SG 11202101124SA
- Authority
- SG
- Singapore
- Prior art keywords
- substrate
- inspection
- electronic components
- transferring electronic
- transferring
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0417—Feeding with belts or tapes
- H05K13/0419—Feeding with belts or tapes tape feeders
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102018006760.3A DE102018006760A1 (en) | 2018-08-27 | 2018-08-27 | Inspection when transferring electronic components from a first to a second carrier |
| PCT/EP2019/072577 WO2020043612A1 (en) | 2018-08-27 | 2019-08-23 | Inspection when transferring electronic components from a first substrate to a second substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11202101124SA true SG11202101124SA (en) | 2021-03-30 |
Family
ID=67810585
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11202101124SA SG11202101124SA (en) | 2018-08-27 | 2019-08-23 | Inspection when transferring electronic components from a first substrate to a second substrate |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20210313206A1 (en) |
| EP (1) | EP3844803B1 (en) |
| CN (1) | CN112655080A (en) |
| DE (1) | DE102018006760A1 (en) |
| FI (1) | FI3844803T3 (en) |
| PL (1) | PL3844803T3 (en) |
| SG (1) | SG11202101124SA (en) |
| TW (1) | TWI732277B (en) |
| WO (1) | WO2020043612A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018006760A1 (en) * | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspection when transferring electronic components from a first to a second carrier |
| DE102020001439B3 (en) * | 2020-02-21 | 2021-06-10 | Mühlbauer Gmbh & Co. Kg | Apparatus and method for transferring electronic components from a first to a second carrier |
Family Cites Families (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5834701B2 (en) | 1975-12-02 | 1983-07-28 | トヨタ自動車株式会社 | Jido Hensoku Kiyou Gear Train |
| JPS53100765A (en) | 1977-02-15 | 1978-09-02 | Toshiba Corp | Production of semiconductor device |
| JPS596058B2 (en) | 1978-11-21 | 1984-02-08 | 株式会社東芝 | Semiconductor device manufacturing equipment |
| DE3336606A1 (en) | 1983-10-07 | 1985-04-25 | Siemens AG, 1000 Berlin und 8000 München | METHOD FOR PRODUCING MICROPACK |
| US4990051A (en) | 1987-09-28 | 1991-02-05 | Kulicke And Soffa Industries, Inc. | Pre-peel die ejector apparatus |
| US4850780A (en) | 1987-09-28 | 1989-07-25 | Kulicke And Soffa Industries Inc. | Pre-peel die ejector apparatus |
| EP0565781B1 (en) | 1992-04-13 | 1995-11-29 | Tresky Dr.Ing. Miroslav | Ejecting device for separating a chip from an adhesive tape |
| JP3498877B2 (en) | 1995-12-05 | 2004-02-23 | 株式会社東芝 | Semiconductor manufacturing apparatus and semiconductor device manufacturing method |
| EP0898163B1 (en) * | 1997-08-22 | 2000-11-08 | Fraunhofer-Gesellschaft Zur Förderung Der Angewandten Forschung E.V. | Method and apparatus for automatic inspection of moving surfaces |
| EP0949662A3 (en) | 1998-03-27 | 2001-08-01 | Supersensor (Proprietary) Limited | Die transfer method and system |
| DE19822512A1 (en) | 1998-05-19 | 1999-10-21 | Siemens Ag | Semiconductor element separation and positioning method |
| DE19840226B4 (en) | 1998-09-03 | 2006-02-23 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Method of applying a circuit chip to a carrier |
| US7042580B1 (en) * | 1999-02-01 | 2006-05-09 | Tokyo Electron Limited | Apparatus for imaging metrology |
| JP2002050670A (en) | 2000-08-04 | 2002-02-15 | Toshiba Corp | Pick-up device and pick-up method |
| KR100353905B1 (en) * | 2000-12-29 | 2002-09-28 | 주식회사옌트 | Lighting system used in apparatus for inspecting surface mounted chip |
| JP3719182B2 (en) | 2001-09-28 | 2005-11-24 | 松下電器産業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
| JP2003124700A (en) * | 2001-10-15 | 2003-04-25 | Nidec Copal Corp | Imaging apparatus |
| DE10203601A1 (en) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chip removal device, chip removal system, placement system and method for removing chips from a wafer |
| DE10349847B3 (en) | 2003-10-25 | 2005-05-25 | Mühlbauer Ag | Positioning device and method for the transmission of electronic components |
| US20060013680A1 (en) | 2004-07-16 | 2006-01-19 | Tessera, Inc. | Chip handling methods and apparatus |
| US7238258B2 (en) | 2005-04-22 | 2007-07-03 | Stats Chippac Ltd. | System for peeling semiconductor chips from tape |
| WO2007118511A1 (en) * | 2006-04-12 | 2007-10-25 | Alphasem Gmbh | Method and device for placing electronic components, especially semiconductor chips, on a substrate |
| DE102006025361A1 (en) | 2006-05-31 | 2007-12-06 | Siemens Ag | Ejection unit for separating components from a substantially planar arrangement of components |
| KR20070120319A (en) | 2006-06-19 | 2007-12-24 | 삼성전자주식회사 | Apparatus having a pair of ejectors for detaching semiconductor chips and method of detaching semiconductor chips using the apparatus |
| US7665204B2 (en) | 2006-10-16 | 2010-02-23 | Asm Assembly Automation Ltd. | Die detachment apparatus comprising pre-peeling structure |
| JP5241245B2 (en) * | 2008-01-11 | 2013-07-17 | 株式会社日立ハイテクノロジーズ | Inspection apparatus and inspection method |
| JP4985513B2 (en) | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | Method and apparatus for peeling electronic parts |
| DE102008018586A1 (en) * | 2008-04-12 | 2009-11-05 | Mühlbauer Ag | Optical detection device and method for detecting surfaces of components |
| JP5792063B2 (en) * | 2008-07-10 | 2015-10-07 | ノードソン コーポレーションＮｏｒｄｓｏｎ Ｃｏｒｐｏｒａｔｉｏｎ | Method for controlling fillet dimensions of underfill material |
| JP2010161155A (en) | 2009-01-07 | 2010-07-22 | Canon Machinery Inc | Chip transfer method and chip transfer apparatus |
| EP2491583B1 (en) | 2009-10-19 | 2017-11-22 | M-Solv Ltd | Apparatus for processing continuous lengths of flexible foil |
| DE102010053912B4 (en) * | 2010-12-09 | 2013-01-31 | Mühlbauer Ag | Optical examination device and optical examination method |
| DE102011017218B4 (en) | 2011-04-15 | 2018-10-31 | Mühlbauer Gmbh & Co. Kg | Apparatus and method for transferring electronic components from a first carrier to a second carrier |
| DE102011104225B4 (en) * | 2011-06-15 | 2017-08-24 | Mühlbauer Gmbh & Co. Kg | Apparatus and method for positioning an electronic component and / or a carrier relative to an ejector |
| US9386984B2 (en) | 2013-02-08 | 2016-07-12 | Ethicon Endo-Surgery, Llc | Staple cartridge comprising a releasable cover |
| TWI528472B (en) * | 2013-08-29 | 2016-04-01 | 均華精密工業股份有限公司 | Apparatus for mounting semiconductor dies |
| WO2015085064A1 (en) | 2013-12-05 | 2015-06-11 | Uniqarta, Inc. | Electronic device incorporated into a sheet |
| JP5662603B1 (en) * | 2014-02-27 | 2015-02-04 | 株式会社新川 | Bonding apparatus and bonding method |
| DE102015013495B4 (en) * | 2015-10-16 | 2018-04-26 | Mühlbauer Gmbh & Co. Kg | Receiving device for components and methods for removing defective components from this |
| DE102015013494B3 (en) * | 2015-10-16 | 2017-04-06 | Mühlbauer Gmbh & Co. Kg | Component handling device and method for removing components from a structured component supply and for depositing at a receiving device |
| US10104784B2 (en) | 2015-11-06 | 2018-10-16 | Nxp B.V. | Method for making an electronic product with flexible substrate |
| KR20180083557A (en) * | 2017-01-13 | 2018-07-23 | (주)제이티 | Device handler |
| DE102018006760A1 (en) * | 2018-08-27 | 2020-02-27 | Mühlbauer Gmbh & Co. Kg | Inspection when transferring electronic components from a first to a second carrier |
-
2018
- 2018-08-27 DE DE102018006760.3A patent/DE102018006760A1/en active Pending
-
2019
- 2019-08-23 EP EP19762106.3A patent/EP3844803B1/en active Active
- 2019-08-23 US US17/264,106 patent/US20210313206A1/en active Pending
- 2019-08-23 CN CN201980055925.7A patent/CN112655080A/en active Pending
- 2019-08-23 SG SG11202101124SA patent/SG11202101124SA/en unknown
- 2019-08-23 FI FIEP19762106.3T patent/FI3844803T3/en active
- 2019-08-23 PL PL19762106.3T patent/PL3844803T3/en unknown
- 2019-08-23 WO PCT/EP2019/072577 patent/WO2020043612A1/en active Search and Examination
- 2019-08-26 TW TW108130445A patent/TWI732277B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202027193A (en) | 2020-07-16 |
| CN112655080A (en) | 2021-04-13 |
| EP3844803B1 (en) | 2022-10-26 |
| DE102018006760A1 (en) | 2020-02-27 |
| TWI732277B (en) | 2021-07-01 |
| FI3844803T3 (en) | 2023-01-31 |
| EP3844803A1 (en) | 2021-07-07 |
| WO2020043612A1 (en) | 2020-03-05 |
| PL3844803T3 (en) | 2023-02-27 |
| US20210313206A1 (en) | 2021-10-07 |
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