SG11202009412QA - Method for producing a monocrystalline layer of an lno material and substrate for epitaxial growth of a monocrystalline layer of an lno material - Google Patents
Method for producing a monocrystalline layer of an lno material and substrate for epitaxial growth of a monocrystalline layer of an lno materialInfo
- Publication number
- SG11202009412QA SG11202009412QA SG11202009412QA SG11202009412QA SG11202009412QA SG 11202009412Q A SG11202009412Q A SG 11202009412QA SG 11202009412Q A SG11202009412Q A SG 11202009412QA SG 11202009412Q A SG11202009412Q A SG 11202009412QA SG 11202009412Q A SG11202009412Q A SG 11202009412QA
- Authority
- SG
- Singapore
- Prior art keywords
- monocrystalline layer
- lno material
- producing
- substrate
- epitaxial growth
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
- C30B23/025—Epitaxial-layer growth characterised by the substrate
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
- C30B29/30—Niobates; Vanadates; Tantalates
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/06—Joining of crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76251—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques
- H01L21/76254—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using bonding techniques with separation/delamination along an ion implanted layer, e.g. Smart-cut, Unibond
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1800256A FR3079533B1 (fr) | 2018-03-28 | 2018-03-28 | Procede de fabrication d'une couche monocristalline de materiau lno et substrat pour croissance par epitaxie d'une couche monocristalline de materiau lno |
PCT/IB2019/000200 WO2019186263A1 (fr) | 2018-03-28 | 2019-03-26 | Procédé de fabrication d'une couche monocristalline de matériau lno et substrat pour croissance par épitaxie d'une couche monocristalline de matériau lno |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202009412QA true SG11202009412QA (en) | 2020-10-29 |
Family
ID=63834054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202009412QA SG11202009412QA (en) | 2018-03-28 | 2019-03-26 | Method for producing a monocrystalline layer of an lno material and substrate for epitaxial growth of a monocrystalline layer of an lno material |
Country Status (8)
Country | Link |
---|---|
US (2) | US11828000B2 (ko) |
EP (1) | EP3775331A1 (ko) |
JP (1) | JP7355289B2 (ko) |
KR (1) | KR102636118B1 (ko) |
CN (1) | CN111902572A (ko) |
FR (1) | FR3079533B1 (ko) |
SG (1) | SG11202009412QA (ko) |
WO (1) | WO2019186263A1 (ko) |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH082998A (ja) * | 1994-06-15 | 1996-01-09 | Sumitomo Electric Ind Ltd | 酸化物誘電体薄膜及びその製造方法 |
EP1482549B1 (en) * | 2003-05-27 | 2011-03-30 | S.O.I. Tec Silicon on Insulator Technologies S.A. | Method of fabrication of a heteroepitaxial microstructure |
US8507361B2 (en) * | 2000-11-27 | 2013-08-13 | Soitec | Fabrication of substrates with a useful layer of monocrystalline semiconductor material |
US7407869B2 (en) * | 2000-11-27 | 2008-08-05 | S.O.I.Tec Silicon On Insulator Technologies | Method for manufacturing a free-standing substrate made of monocrystalline semiconductor material |
FR2817395B1 (fr) * | 2000-11-27 | 2003-10-31 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede |
KR100476901B1 (ko) * | 2002-05-22 | 2005-03-17 | 삼성전자주식회사 | 소이 반도체기판의 형성방법 |
US9564320B2 (en) * | 2010-06-18 | 2017-02-07 | Soraa, Inc. | Large area nitride crystal and method for making it |
US8860005B1 (en) * | 2013-08-08 | 2014-10-14 | International Business Machines Corporation | Thin light emitting diode and fabrication method |
FR3034569B1 (fr) | 2015-04-02 | 2021-10-22 | Soitec Silicon On Insulator | Electrolyte solide avance et sa methode de fabrication |
FR3041364B1 (fr) | 2015-09-18 | 2017-10-06 | Soitec Silicon On Insulator | Procede de transfert de paves monocristallins |
-
2018
- 2018-03-28 FR FR1800256A patent/FR3079533B1/fr active Active
-
2019
- 2019-03-26 US US17/042,737 patent/US11828000B2/en active Active
- 2019-03-26 CN CN201980021529.2A patent/CN111902572A/zh active Pending
- 2019-03-26 KR KR1020207030190A patent/KR102636118B1/ko active IP Right Grant
- 2019-03-26 JP JP2020549801A patent/JP7355289B2/ja active Active
- 2019-03-26 WO PCT/IB2019/000200 patent/WO2019186263A1/fr unknown
- 2019-03-26 EP EP19721697.1A patent/EP3775331A1/fr active Pending
- 2019-03-26 SG SG11202009412QA patent/SG11202009412QA/en unknown
-
2023
- 2023-10-18 US US18/489,345 patent/US20240044043A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR102636118B1 (ko) | 2024-02-13 |
JP2021518323A (ja) | 2021-08-02 |
FR3079533A1 (fr) | 2019-10-04 |
US11828000B2 (en) | 2023-11-28 |
CN111902572A (zh) | 2020-11-06 |
EP3775331A1 (fr) | 2021-02-17 |
FR3079533B1 (fr) | 2021-04-09 |
WO2019186263A1 (fr) | 2019-10-03 |
US20210095391A1 (en) | 2021-04-01 |
KR20200136431A (ko) | 2020-12-07 |
JP7355289B2 (ja) | 2023-10-03 |
US20240044043A1 (en) | 2024-02-08 |
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