SG11202004428RA - System for cleaning semiconductor wafers - Google Patents

System for cleaning semiconductor wafers

Info

Publication number
SG11202004428RA
SG11202004428RA SG11202004428RA SG11202004428RA SG11202004428RA SG 11202004428R A SG11202004428R A SG 11202004428RA SG 11202004428R A SG11202004428R A SG 11202004428RA SG 11202004428R A SG11202004428R A SG 11202004428RA SG 11202004428R A SG11202004428R A SG 11202004428RA
Authority
SG
Singapore
Prior art keywords
semiconductor wafers
cleaning semiconductor
cleaning
wafers
semiconductor
Prior art date
Application number
SG11202004428RA
Other languages
English (en)
Inventor
Hui Wang
Fufa Chen
Fuping Chen
Jian Wang
Xi Wang
Xiaoyan Zhang
Yinuo Jin
Zhaowei Jia
Liangzhi Xie
Jun Wang
Xuejun Li
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Publication of SG11202004428RA publication Critical patent/SG11202004428RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG11202004428RA 2017-11-15 2017-11-15 System for cleaning semiconductor wafers SG11202004428RA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/111016 WO2019095127A1 (fr) 2017-11-15 2017-11-15 Système de nettoyage de tranches semi-conductrices

Publications (1)

Publication Number Publication Date
SG11202004428RA true SG11202004428RA (en) 2020-06-29

Family

ID=66539282

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11202004428RA SG11202004428RA (en) 2017-11-15 2017-11-15 System for cleaning semiconductor wafers

Country Status (5)

Country Link
JP (2) JP7293221B2 (fr)
KR (1) KR102517666B1 (fr)
CN (1) CN111357079A (fr)
SG (1) SG11202004428RA (fr)
WO (1) WO2019095127A1 (fr)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5931173A (en) * 1997-06-09 1999-08-03 Cypress Semiconductor Corporation Monitoring cleaning effectiveness of a cleaning system
US20020157685A1 (en) * 2000-09-11 2002-10-31 Naoya Hayamizu Washing method, method of manufacturing semiconductor device and method of manufacturing active matrix-type display device
JP5019370B2 (ja) * 2007-07-12 2012-09-05 ルネサスエレクトロニクス株式会社 基板の洗浄方法および洗浄装置
CN101879511B (zh) * 2009-05-08 2013-01-02 盛美半导体设备（上海）有限公司 半导体衬底的清洗方法和装置
JP5525765B2 (ja) * 2009-06-15 2014-06-18 株式会社国際電気セミコンダクターサービス 超音波洗浄装置及び超音波洗浄処理方法
JP2012081430A (ja) * 2010-10-13 2012-04-26 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
CN102496591B (zh) * 2011-12-30 2016-04-06 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
CN102430543B (zh) * 2011-12-30 2016-06-01 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
KR102359795B1 (ko) * 2015-05-20 2022-02-08 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법 및 장치
CN205200030U (zh) * 2015-12-10 2016-05-04 北京七星华创电子股份有限公司 具有超声或兆声振荡的二相流雾化清洗装置
CN109075103B (zh) * 2016-04-06 2022-06-10 盛美半导体设备(上海)股份有限公司 清洗半导体衬底的方法和装置
CN106238302B (zh) * 2016-08-26 2018-10-16 北京七星华创电子股份有限公司 一种频率动态变化的超声波/兆声波清洗装置

Also Published As

Publication number Publication date
WO2019095127A1 (fr) 2019-05-23
JP2023018081A (ja) 2023-02-07
CN111357079A (zh) 2020-06-30
JP2021510009A (ja) 2021-04-08
KR20200078657A (ko) 2020-07-01
JP7293221B2 (ja) 2023-06-19
JP7495469B2 (ja) 2024-06-04
KR102517666B1 (ko) 2023-04-05

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