JP7293221B2 - 半導体ウェハの洗浄システム - Google Patents

半導体ウェハの洗浄システム Download PDF

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Publication number
JP7293221B2
JP7293221B2 JP2020526910A JP2020526910A JP7293221B2 JP 7293221 B2 JP7293221 B2 JP 7293221B2 JP 2020526910 A JP2020526910 A JP 2020526910A JP 2020526910 A JP2020526910 A JP 2020526910A JP 7293221 B2 JP7293221 B2 JP 7293221B2
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Japanese (ja)
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JP2021510009A (ja
Inventor
フゥイ ワン
フーファ チェン
フーピン チェン
ジェン ワン
シー ワン
シャオイェン ヂャン
イーヌォ ジン
ヂャオウェイ ジャ
リァンヂー シェ
ジュン ワン
シュエジュン リー
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エーシーエム リサーチ （シャンハイ） インコーポレーテッド
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Publication of JP2021510009A publication Critical patent/JP2021510009A/ja
Priority to JP2022187162A priority Critical patent/JP7495469B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP2020526910A 2017-11-15 2017-11-15 半導体ウェハの洗浄システム Active JP7293221B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022187162A JP7495469B2 (ja) 2017-11-15 2022-11-24 半導体ウェハの洗浄システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2017/111016 WO2019095127A1 (fr) 2017-11-15 2017-11-15 Système de nettoyage de tranches semi-conductrices

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022187162A Division JP7495469B2 (ja) 2017-11-15 2022-11-24 半導体ウェハの洗浄システム

Publications (2)

Publication Number Publication Date
JP2021510009A JP2021510009A (ja) 2021-04-08
JP7293221B2 true JP7293221B2 (ja) 2023-06-19

Family

ID=66539282

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020526910A Active JP7293221B2 (ja) 2017-11-15 2017-11-15 半導体ウェハの洗浄システム
JP2022187162A Active JP7495469B2 (ja) 2017-11-15 2022-11-24 半導体ウェハの洗浄システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022187162A Active JP7495469B2 (ja) 2017-11-15 2022-11-24 半導体ウェハの洗浄システム

Country Status (5)

Country Link
JP (2) JP7293221B2 (fr)
KR (1) KR102517666B1 (fr)
CN (1) CN111357079A (fr)
SG (1) SG11202004428RA (fr)
WO (1) WO2019095127A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287841A (ja) 2009-06-15 2010-12-24 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
JP2012081430A (ja) 2010-10-13 2012-04-26 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
WO2017173588A1 (fr) 2016-04-06 2017-10-12 Acm Research (Shanghai) Inc. Procédés et appareil de nettoyage de tranches semi-conductrices

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5931173A (en) * 1997-06-09 1999-08-03 Cypress Semiconductor Corporation Monitoring cleaning effectiveness of a cleaning system
US20020157685A1 (en) * 2000-09-11 2002-10-31 Naoya Hayamizu Washing method, method of manufacturing semiconductor device and method of manufacturing active matrix-type display device
JP5019370B2 (ja) * 2007-07-12 2012-09-05 ルネサスエレクトロニクス株式会社 基板の洗浄方法および洗浄装置
CN101879511B (zh) * 2009-05-08 2013-01-02 盛美半导体设备（上海）有限公司 半导体衬底的清洗方法和装置
CN102496591B (zh) * 2011-12-30 2016-04-06 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
CN102430543B (zh) * 2011-12-30 2016-06-01 上海集成电路研发中心有限公司 晶圆的清洗装置及清洗方法
KR102359795B1 (ko) * 2015-05-20 2022-02-08 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼를 세정하는 방법 및 장치
CN205200030U (zh) * 2015-12-10 2016-05-04 北京七星华创电子股份有限公司 具有超声或兆声振荡的二相流雾化清洗装置
CN106238302B (zh) * 2016-08-26 2018-10-16 北京七星华创电子股份有限公司 一种频率动态变化的超声波/兆声波清洗装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010287841A (ja) 2009-06-15 2010-12-24 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
JP2012081430A (ja) 2010-10-13 2012-04-26 Hitachi Kokusai Denki Engineering:Kk 超音波洗浄装置
WO2017173588A1 (fr) 2016-04-06 2017-10-12 Acm Research (Shanghai) Inc. Procédés et appareil de nettoyage de tranches semi-conductrices

Also Published As

Publication number Publication date
SG11202004428RA (en) 2020-06-29
WO2019095127A1 (fr) 2019-05-23
JP2023018081A (ja) 2023-02-07
CN111357079A (zh) 2020-06-30
JP2021510009A (ja) 2021-04-08
KR20200078657A (ko) 2020-07-01
JP7495469B2 (ja) 2024-06-04
KR102517666B1 (ko) 2023-04-05

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