SG11202001659PA - Plating apparatus - Google Patents
Plating apparatusInfo
- Publication number
- SG11202001659PA SG11202001659PA SG11202001659PA SG11202001659PA SG11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA SG 11202001659P A SG11202001659P A SG 11202001659PA
- Authority
- SG
- Singapore
- Prior art keywords
- plating apparatus
- plating
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D13/00—Electrophoretic coating characterised by the process
- C25D13/22—Servicing or operating apparatus or multistep processes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/008—Current shielding devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Automation & Control Theory (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2017/099572 WO2019041154A1 (en) | 2017-08-30 | 2017-08-30 | METALLIZATION APPARATUS |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11202001659PA true SG11202001659PA (en) | 2020-03-30 |
Family
ID=65524711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11202001659PA SG11202001659PA (en) | 2017-08-30 | 2017-08-30 | Plating apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US11859303B2 (zh) |
JP (1) | JP6999195B2 (zh) |
KR (1) | KR102420759B1 (zh) |
CN (1) | CN111032923B (zh) |
SG (1) | SG11202001659PA (zh) |
WO (1) | WO2019041154A1 (zh) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112410851A (zh) * | 2019-08-23 | 2021-02-26 | 盛美半导体设备(上海)股份有限公司 | 阴极腔 |
KR20220053669A (ko) * | 2019-09-03 | 2022-04-29 | 램 리써치 코포레이션 | 전기 도금 셀을 위한 저각도 멤브레인 프레임 |
CN111560638B (zh) * | 2020-07-06 | 2021-06-29 | 苏州清飙科技有限公司 | 晶圆电镀设备 |
WO2022102119A1 (ja) * | 2020-11-16 | 2022-05-19 | 株式会社荏原製作所 | プレート、めっき装置、及びプレートの製造方法 |
CN114645311A (zh) * | 2020-12-18 | 2022-06-21 | 盛美半导体设备(上海)股份有限公司 | 基板保持装置的杯形夹盘及基板保持装置 |
CN113151881A (zh) * | 2021-04-27 | 2021-07-23 | 中国工程物理研究院核物理与化学研究所 | 一种适用于小面积放射源制备的电镀装置 |
KR102475318B1 (ko) * | 2021-10-28 | 2022-12-08 | 가부시키가이샤 에바라 세이사꾸쇼 | 도금 장치 |
CN116265621A (zh) * | 2021-12-17 | 2023-06-20 | 盛美半导体设备(上海)股份有限公司 | 清洗电镀装置的方法 |
CN116926649A (zh) * | 2022-03-31 | 2023-10-24 | 盛美半导体设备(上海)股份有限公司 | 电镀设备 |
CN115142104B (zh) * | 2022-07-28 | 2024-04-26 | 福州一策仪器有限公司 | 电镀装置、多通道电镀装置组和电镀反应系统 |
CN115896904B (zh) * | 2023-03-09 | 2023-05-30 | 苏州智程半导体科技股份有限公司 | 一种晶圆电镀腔室结构 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3112119B2 (ja) * | 1992-04-30 | 2000-11-27 | 沖電気工業株式会社 | 半導体ウエハのメッキ装置 |
US6921467B2 (en) * | 1996-07-15 | 2005-07-26 | Semitool, Inc. | Processing tools, components of processing tools, and method of making and using same for electrochemical processing of microelectronic workpieces |
US6261426B1 (en) * | 1999-01-22 | 2001-07-17 | International Business Machines Corporation | Method and apparatus for enhancing the uniformity of electrodeposition or electroetching |
JP3980809B2 (ja) * | 2000-05-01 | 2007-09-26 | 株式会社荏原製作所 | 電解処理装置 |
KR100773165B1 (ko) * | 1999-12-24 | 2007-11-02 | 가부시키가이샤 에바라 세이사꾸쇼 | 반도체기판처리장치 및 처리방법 |
US6632335B2 (en) * | 1999-12-24 | 2003-10-14 | Ebara Corporation | Plating apparatus |
JP2001234394A (ja) | 2000-02-28 | 2001-08-31 | Tokyo Electron Ltd | ウェハーめっき装置 |
US20020027080A1 (en) | 2000-03-17 | 2002-03-07 | Junichiro Yoshioka | Plating apparatus and method |
US6517698B1 (en) * | 2000-10-06 | 2003-02-11 | Motorola, Inc. | System and method for providing rotation to plating flow |
US7150816B2 (en) * | 2001-08-31 | 2006-12-19 | Semitool, Inc. | Apparatus and method for deposition of an electrophoretic emulsion |
TWI274393B (en) * | 2002-04-08 | 2007-02-21 | Acm Res Inc | Electropolishing and/or electroplating apparatus and methods |
US20040217005A1 (en) * | 2002-07-24 | 2004-11-04 | Aron Rosenfeld | Method for electroplating bath chemistry control |
EP1644557B1 (en) * | 2003-07-08 | 2010-11-10 | Applied Materials, Inc. | Electrochemical processing cell |
KR101424623B1 (ko) * | 2007-11-02 | 2014-08-01 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 반도체 워크피스 상의 메탈리제이션을 위한 도금 장치 |
CN101457379B (zh) * | 2007-12-14 | 2012-05-30 | 盛美半导体设备(上海)有限公司 | 在半导体工件上电镀金属的电镀装置 |
US8795480B2 (en) | 2010-07-02 | 2014-08-05 | Novellus Systems, Inc. | Control of electrolyte hydrodynamics for efficient mass transfer during electroplating |
KR20120011939A (ko) * | 2010-07-28 | 2012-02-09 | 주식회사 케이씨텍 | 기판 도금 장치 |
US8496789B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
EP2746432A1 (en) * | 2012-12-20 | 2014-06-25 | Atotech Deutschland GmbH | Device for vertical galvanic metal deposition on a substrate |
WO2015002942A1 (en) * | 2013-07-03 | 2015-01-08 | Tel Nexx, Inc. | Electrochemical deposition apparatus and methods for controlling the chemistry therein |
US9677190B2 (en) * | 2013-11-01 | 2017-06-13 | Lam Research Corporation | Membrane design for reducing defects in electroplating systems |
US9816194B2 (en) * | 2015-03-19 | 2017-11-14 | Lam Research Corporation | Control of electrolyte flow dynamics for uniform electroplating |
US9765443B2 (en) | 2015-09-02 | 2017-09-19 | Applied Materials, Inc. | Electroplating processor with current thief electrode |
US9920448B2 (en) | 2015-11-18 | 2018-03-20 | Applied Materials, Inc. | Inert anode electroplating processor and replenisher with anionic membranes |
-
2017
- 2017-08-30 SG SG11202001659PA patent/SG11202001659PA/en unknown
- 2017-08-30 CN CN201780094345.XA patent/CN111032923B/zh active Active
- 2017-08-30 US US16/643,349 patent/US11859303B2/en active Active
- 2017-08-30 JP JP2020512478A patent/JP6999195B2/ja active Active
- 2017-08-30 KR KR1020207007784A patent/KR102420759B1/ko active IP Right Grant
- 2017-08-30 WO PCT/CN2017/099572 patent/WO2019041154A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
JP2020531696A (ja) | 2020-11-05 |
JP6999195B2 (ja) | 2022-01-18 |
WO2019041154A1 (en) | 2019-03-07 |
US20200354851A1 (en) | 2020-11-12 |
CN111032923B (zh) | 2021-12-28 |
US11859303B2 (en) | 2024-01-02 |
KR102420759B1 (ko) | 2022-07-14 |
KR20200045510A (ko) | 2020-05-04 |
CN111032923A (zh) | 2020-04-17 |
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