SG11201909268PA - Positive type photosensitive siloxane composition and cured film formed by using the same - Google Patents
Positive type photosensitive siloxane composition and cured film formed by using the sameInfo
- Publication number
- SG11201909268PA SG11201909268PA SG11201909268PA SG11201909268PA SG 11201909268P A SG11201909268P A SG 11201909268PA SG 11201909268P A SG11201909268P A SG 11201909268PA SG 11201909268P A SG11201909268P A SG 11201909268PA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- type photosensitive
- cured film
- positive type
- go3f
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Silicon Polymers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 01 November 2018 (01.11.2018) WIPO I PCT oimiolo VIII °nolo VIII ID Imio oimIE (10) International Publication Number WO 2018/197535 Al (51) International Patent Classification: GO3F 7/022 (2006.01) G03F 7/031 (2006.01) GO3F 7/023 (2006.01) GO3F 7/075 (2006.01) (21) International Application Number: PCT/EP2018/060540 (22) International Filing Date: 25 April 2018 (25.04.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 2017-090311 28 April 2017 (28.04.2017) JP (71) Applicant: MERCK PATENT GMBH [DE/DE]; Frank- furter Strasse 250, 64293 Darmstadt (DE). (72) Inventors: YOSHIDA, Naofumi; c/o Merck Performance Materials Ltd., 3330, Chihama, Kakegawa-shi, Shizuoka 437-1412 (JP). TAKAHASHI, Megumi; c/o Merck Per- formance Materials Ltd., 3330, Chihama, Kakegawa-shi, Shizuoka 437-1412 (JP). TANIGUCHI, Katsuto; c/o Mer- ck Performance Materials Ltd., 3330, Chihama, Kakegawa- shi, Shizuoka 437-1412 (JP). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: — with international search report (Art. 21(3)) — before the expiration of the time limit for amending the claims and to be republished in the event of receipt of amendments (Rule 48.2(h)) 1-1 N 0\ 1-1 00 O 1-1 N C (54) Title: POSITIVE TYPE PHOTOSENSITIVE SILOXANE COMPOSITION AND CURED FILM FORMED BY USING THE SAME (57) : [] To provide a positive type photosensitive composition capable of forming a cured film having high transparency [Means] The present invention provides apositive type photosensitive siloxane composition comprising: a polysiloxane, a diazonaph- thoquinone derivative, an additive having a quaternaryammonium structureandthecapability of interacting with the polysiloxane, and a solvent. The polysiloxane and the additive interact with each other before exposure, but they lose the interaction after exposure.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017090311A JP2018189732A (en) | 2017-04-28 | 2017-04-28 | Positive type photosensitive siloxane composition and cured film formed by using the same |
PCT/EP2018/060540 WO2018197535A1 (en) | 2017-04-28 | 2018-04-25 | Positive type photosensitive siloxane composition and cured film formed by using the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201909268PA true SG11201909268PA (en) | 2019-11-28 |
Family
ID=62134150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201909268P SG11201909268PA (en) | 2017-04-28 | 2018-04-25 | Positive type photosensitive siloxane composition and cured film formed by using the same |
Country Status (7)
Country | Link |
---|---|
US (1) | US11392032B2 (en) |
JP (2) | JP2018189732A (en) |
KR (1) | KR102610345B1 (en) |
CN (1) | CN110709773B (en) |
SG (1) | SG11201909268PA (en) |
TW (1) | TWI772411B (en) |
WO (1) | WO2018197535A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7282667B2 (en) * | 2019-01-22 | 2023-05-29 | 信越化学工業株式会社 | Composition for forming silicon-containing resist underlayer film and pattern forming method |
JP6639724B1 (en) * | 2019-03-15 | 2020-02-05 | メルク、パテント、ゲゼルシャフト、ミット、ベシュレンクテル、ハフツングMerck Patent GmbH | Positive photosensitive polysiloxane composition |
Family Cites Families (21)
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US3695886A (en) | 1970-09-29 | 1972-10-03 | Ibm | High speed azide resists |
DE60137398D1 (en) * | 2000-11-30 | 2009-03-05 | Fujifilm Corp | Lithographic printing plate precursors |
US7358032B2 (en) * | 2002-11-08 | 2008-04-15 | Fujifilm Corporation | Planographic printing plate precursor |
US7585613B2 (en) | 2006-01-25 | 2009-09-08 | Shin-Etsu Chemical Co., Ltd. | Antireflection film composition, substrate, and patterning process |
JP5233526B2 (en) * | 2008-09-05 | 2013-07-10 | 東レ株式会社 | Photosensitive composition, cured film formed therefrom, and device having cured film |
JP2010117696A (en) * | 2008-10-17 | 2010-05-27 | Hitachi Chem Co Ltd | Photosensitive resin composition, method for forming silica-based film, and device and member including silica-based film |
KR101799260B1 (en) | 2010-08-24 | 2017-11-20 | 메르크 파텐트 게엠베하 | Positive photosensitive siloxane composition |
JP5726632B2 (en) * | 2011-05-19 | 2015-06-03 | メルクパフォーマンスマテリアルズIp合同会社 | Photosensitive siloxane resin composition |
JP6043716B2 (en) * | 2011-05-20 | 2016-12-14 | メルク パテント ゲーエムベーハー | Positive photosensitive siloxane composition |
JP2013114238A (en) | 2011-12-01 | 2013-06-10 | Toray Ind Inc | Positive photosensitive composition, cured film formed of the positive photosensitive composition and element having the cured film |
US9704724B2 (en) | 2011-12-26 | 2017-07-11 | Toray Industries, Inc. | Photosensitive resin composition and method for producing semiconductor device |
TWI567498B (en) * | 2012-04-06 | 2017-01-21 | Az電子材料盧森堡有限公司 | Negative-type photosensitive siloxane composition |
JP6013150B2 (en) * | 2012-11-22 | 2016-10-25 | メルクパフォーマンスマテリアルズマニュファクチャリング合同会社 | Method for producing positive photosensitive siloxane composition |
TWI479269B (en) * | 2012-12-25 | 2015-04-01 | Chi Mei Corp | Photosensitive polysiloxane composition and uses thereof |
JP6466087B2 (en) * | 2013-06-14 | 2019-02-06 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | Negative photosensitive composition that can be cured at low temperature |
TWI518460B (en) | 2013-08-13 | 2016-01-21 | Chi Mei Corp | Photosensitive polysiloxane compositions and their use |
JP6323225B2 (en) * | 2013-11-01 | 2018-05-16 | セントラル硝子株式会社 | Positive photosensitive resin composition, film production method using the same, and electronic component |
KR102369818B1 (en) * | 2015-01-13 | 2022-03-04 | 주식회사 동진쎄미켐 | Positive photosensitive siloxane resin composition |
JP2017151209A (en) | 2016-02-23 | 2017-08-31 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | Positive photosensitive siloxane composition |
KR102472280B1 (en) * | 2016-08-19 | 2022-12-01 | 롬엔드하스전자재료코리아유한회사 | Photosensitive resin composition and cured film prepared therefrom |
WO2018034460A1 (en) | 2016-08-19 | 2018-02-22 | Rohm And Haas Electronic Materials Korea Ltd. | Photosensitive resin composition and cured film prepared therefrom |
-
2017
- 2017-04-28 JP JP2017090311A patent/JP2018189732A/en active Pending
-
2018
- 2018-04-25 SG SG11201909268P patent/SG11201909268PA/en unknown
- 2018-04-25 CN CN201880027487.9A patent/CN110709773B/en active Active
- 2018-04-25 KR KR1020197035153A patent/KR102610345B1/en active IP Right Grant
- 2018-04-25 US US16/607,949 patent/US11392032B2/en active Active
- 2018-04-25 WO PCT/EP2018/060540 patent/WO2018197535A1/en active Application Filing
- 2018-04-25 JP JP2019556306A patent/JP7149958B2/en active Active
- 2018-04-26 TW TW107114171A patent/TWI772411B/en active
Also Published As
Publication number | Publication date |
---|---|
JP7149958B2 (en) | 2022-10-07 |
US20200073241A1 (en) | 2020-03-05 |
TWI772411B (en) | 2022-08-01 |
CN110709773B (en) | 2024-02-09 |
TW201901296A (en) | 2019-01-01 |
US11392032B2 (en) | 2022-07-19 |
WO2018197535A1 (en) | 2018-11-01 |
JP2020517983A (en) | 2020-06-18 |
KR20190137928A (en) | 2019-12-11 |
CN110709773A (en) | 2020-01-17 |
JP2018189732A (en) | 2018-11-29 |
KR102610345B1 (en) | 2023-12-07 |
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