SG11201908962TA - Optical assembly and method of forming the same - Google Patents
Optical assembly and method of forming the sameInfo
- Publication number
- SG11201908962TA SG11201908962TA SG11201908962TA SG11201908962TA SG 11201908962T A SG11201908962T A SG 11201908962TA SG 11201908962T A SG11201908962T A SG 11201908962TA SG 11201908962T A SG11201908962T A SG 11201908962TA
- Authority
- SG
- Singapore
- Prior art keywords
- international
- optical assembly
- integrated circuit
- substrate
- circuit chip
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4206—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
- G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
- G02B6/364—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves inverted grooves, e.g. dovetails
Abstract
100 106 FIG. 1A 110a 108 114a 00 00 O C (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 04 October 2018 (04.10.2018) WI P01 PC T o n °nolo o o!OHIIIIIOilIIII111111 0IIIIII (10) International Publication Number WO 2018/182516 Al (51) International Patent Classification: GO2B 6/42 (2006.01) GO2B 6/36 (2006.01) (21) International Application Number: PCT/SG2018/050144 (22) International Filing Date: 28 March 2018 (28.03.2018) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 10201702567P 29 March 2017 (29.03.2017) SG (71) Applicant: AGENCY FOR SCIENCE, TECHNOLO- GY AND RESEARCH [SG/SG]; 1 Fusionopolis Way, #20-10 Connexis North Tower, Singapore 138632 (SG). (72) Inventor: LIM, Teck Guan; c/o Industry Development, Institute of Microelectronics, 2 Fusionopolis Way, Innovis Tower, #08-02, Singapore 138634 (SG). (74) Agent: VIERING, JENTSCHURA & PARTNER LLP; P.O. Box 1088, Rochor Post Office, Rochor Road, Singa- pore 911833 (SG). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JO, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, (54) Title: OPTICAL ASSEMBLY AND METHOD OF FORMING THE SAME 102 104a (57) : Various embodiments may provide an optical assembly. The optical assembly may include a substrate with a first and a second grooves, and a photonic integrated circuit chip with a coupling waveguide, a first and a second grooves. The optical assembly may further include a first and a second cylindrical rods held by the respective grooves of the substrate and the photonic integrated circuit chip. A portion of the first rod and a portion of the second rod define a vertical offset between the photonic integrated circuit chip and the substrate to align the coupling waveguide with an optical fiber. [Continued on next page] WO 2018/182516 Al MIDEDIM011111 1111E111 IIDI0ME10111011111111101111111111111111111 TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). Published: with international search report (Art. 21(3)) in black and white; the international application as filed contained color or greyscale and is available for download from PATENTSCOPE
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG10201702567P | 2017-03-29 | ||
PCT/SG2018/050144 WO2018182516A1 (en) | 2017-03-29 | 2018-03-28 | Optical assembly and method of forming the same |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201908962TA true SG11201908962TA (en) | 2019-10-30 |
Family
ID=63676441
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201908962T SG11201908962TA (en) | 2017-03-29 | 2018-03-28 | Optical assembly and method of forming the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US11105989B2 (en) |
SG (1) | SG11201908962TA (en) |
WO (1) | WO2018182516A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11557541B2 (en) * | 2018-12-28 | 2023-01-17 | Intel Corporation | Interconnect architecture with silicon interposer and EMIB |
US11934025B2 (en) | 2020-04-30 | 2024-03-19 | Corning Research & Development Corporation | FAUs including passive alignment adhesive profiles and related methods |
US11726383B2 (en) * | 2020-10-14 | 2023-08-15 | California Institute Of Technology | Modular hybrid optical phased arrays |
WO2022177854A1 (en) * | 2021-02-22 | 2022-08-25 | Luminous Computing, Inc. | Photonic integrated circuit system and method of fabrication |
US20230130467A1 (en) * | 2021-10-25 | 2023-04-27 | Globalfoundries U.S. Inc. | Pic die and package with multiple level and multiple depth connections of fibers to on-chip optical components |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9014639D0 (en) * | 1990-07-02 | 1990-08-22 | British Telecomm | Optical component packaging |
JPH05333231A (en) * | 1992-05-29 | 1993-12-17 | Furukawa Electric Co Ltd:The | Method for connecting optical waveguide and optical fiber |
US5257336A (en) | 1992-08-21 | 1993-10-26 | At&T Bell Laboratories | Optical subassembly with passive optical alignment |
JPH06167634A (en) | 1992-11-30 | 1994-06-14 | Sumitomo Electric Ind Ltd | Connection structure of optical waveguide component |
US5432878A (en) | 1994-03-03 | 1995-07-11 | Cts Corporation | Silicon carrier for testing and alignment of optoelectronic devices and method of assembling same |
US5613024A (en) * | 1995-12-21 | 1997-03-18 | Lucent Technologies Inc. | Alignment of optical fiber arrays to optical integrated circuits |
CA2258398A1 (en) * | 1999-01-07 | 2000-07-07 | Victor Benham | An adhesive-free lens-attached optical fibers to optical waveguide packaging system |
KR100349597B1 (en) * | 1999-01-12 | 2002-08-22 | 삼성전자 주식회사 | Optical wave-guide device and manufacturing method thereof |
KR20000050765A (en) * | 1999-01-14 | 2000-08-05 | 윤종용 | Optical fiber array connector and manufacturing method thereof |
US6665487B2 (en) * | 2001-05-24 | 2003-12-16 | Axsun Technologies, Inc. | Precision alignment feature using a rod with controlled diameter in a silicon V-groove array |
GB2379748B (en) * | 2001-06-22 | 2003-09-10 | Bookham Technology Plc | An optical chip with an optically conductive element |
US6826347B2 (en) * | 2001-07-12 | 2004-11-30 | Ngk Insulators, Ltd. | Two-dimensional optical element array and two-dimensional waveguide apparatus |
US7303339B2 (en) * | 2002-08-28 | 2007-12-04 | Phosistor Technologies, Inc. | Optical beam transformer module for light coupling between a fiber array and a photonic chip and the method of making the same |
CN201508424U (en) | 2009-09-01 | 2010-06-16 | 浙江同星光电科技有限公司 | Lock pin for two-sided inserting suitable for multi-fiber connection |
US8373259B2 (en) * | 2010-07-27 | 2013-02-12 | Intel Corporation | Optical connection through single assembly overhang flip chip optics die with micro structure alignment |
US8818144B2 (en) * | 2011-01-25 | 2014-08-26 | Tyco Electronics Corporation | Process for preparing an optical interposer for waveguides |
US9529155B2 (en) * | 2012-11-28 | 2016-12-27 | Corning Optical Communications LLC | Gradient index (GRIN) lens chips and associated small form factor optical arrays for optical connections, related fiber optic connectors |
US9134490B2 (en) * | 2012-12-06 | 2015-09-15 | Laxense Inc. | Passive alignment multichannel parallel optical system |
EP3593186A1 (en) * | 2017-03-07 | 2020-01-15 | Corning Optical Communications LLC | Universal photonic adaptor for coupling an optical connector to an optoelectronic substrate |
-
2018
- 2018-03-28 US US16/498,891 patent/US11105989B2/en active Active
- 2018-03-28 WO PCT/SG2018/050144 patent/WO2018182516A1/en active Application Filing
- 2018-03-28 SG SG11201908962T patent/SG11201908962TA/en unknown
Also Published As
Publication number | Publication date |
---|---|
US20210109302A1 (en) | 2021-04-15 |
WO2018182516A1 (en) | 2018-10-04 |
US11105989B2 (en) | 2021-08-31 |
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