SG11201901050SA - Method and device for aligning substrates - Google Patents

Method and device for aligning substrates

Info

Publication number
SG11201901050SA
SG11201901050SA SG11201901050SA SG11201901050SA SG11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA SG 11201901050S A SG11201901050S A SG 11201901050SA
Authority
SG
Singapore
Prior art keywords
aligning substrates
aligning
substrates
substrate
regard
Prior art date
Application number
SG11201901050SA
Other languages
English (en)
Inventor
Thomas Wagenleitner
Dominik Zinner
Jürgen Markus Süss
Christian Sinn
Jürgen Mallinger
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201901050SA publication Critical patent/SG11201901050SA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Wire Bonding (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Adhesives Or Adhesive Processes (AREA)
SG11201901050SA 2016-08-29 2016-08-29 Method and device for aligning substrates SG11201901050SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/070289 WO2018041326A1 (de) 2016-08-29 2016-08-29 Verfahren und vorrichtung zum ausrichten von substraten

Publications (1)

Publication Number Publication Date
SG11201901050SA true SG11201901050SA (en) 2019-03-28

Family

ID=57044904

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201901050SA SG11201901050SA (en) 2016-08-29 2016-08-29 Method and device for aligning substrates

Country Status (8)

Country Link
US (3) US10692747B2 (zh)
EP (2) EP3734650B1 (zh)
JP (1) JP6801085B2 (zh)
KR (2) KR102386005B1 (zh)
CN (2) CN109643674B (zh)
SG (1) SG11201901050SA (zh)
TW (2) TWI778973B (zh)
WO (1) WO2018041326A1 (zh)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10692747B2 (en) * 2016-08-29 2020-06-23 Ev Group E. Thallner Gmbh Method and device for alignment of substrates
CN114167690A (zh) 2016-12-20 2022-03-11 Ev 集团 E·索尔纳有限责任公司 不同焦点平面
EP3559724B1 (de) 2016-12-20 2020-06-17 EV Group E. Thallner GmbH Vorrichtung und verfahren zur belichtung einer lichtempfindlichen schicht
US10073239B1 (en) * 2017-05-15 2018-09-11 Omnivision Technologies, Inc. Dual photodiode for phase detection autofocus
TWI661518B (zh) * 2018-06-29 2019-06-01 欣興電子股份有限公司 接合電子元件的方法
WO2020226095A1 (ja) * 2019-05-08 2020-11-12 東京エレクトロン株式会社 接合装置、接合システム及び接合方法
WO2020226093A1 (ja) * 2019-05-08 2020-11-12 東京エレクトロン株式会社 接合装置、接合システム及び接合方法
WO2020234850A1 (en) * 2019-05-22 2020-11-26 Vuereal Inc. An alignment process for the transfer setup
CN114144868A (zh) * 2019-08-23 2022-03-04 Ev 集团 E·索尔纳有限责任公司 用于使基板对准的方法和装置
US11136202B2 (en) * 2020-01-06 2021-10-05 Asm Technology Singapore Pte Ltd Direct transfer apparatus for electronic components
KR20220167376A (ko) 2020-06-29 2022-12-20 에베 그룹 에. 탈너 게엠베하 기판 접합 방법 및 장치
KR102472252B1 (ko) * 2020-12-28 2022-11-30 주식회사 테스 기판접합장치의 예비정렬장치 및 예비정렬방법
KR102677190B1 (ko) * 2020-12-31 2024-06-20 주식회사 테스 기판접합장치 및 기판접합방법
TWI792785B (zh) * 2020-12-31 2023-02-11 南韓商Ｔｅｓ股份有限公司 基板接合裝置及基板接合方法
US11756921B2 (en) 2021-03-18 2023-09-12 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for bonding semiconductor devices
CN113594076B (zh) * 2021-07-22 2023-06-20 上海精测半导体技术有限公司 有图形晶圆的对准方法及半导体设备
WO2023110113A1 (de) 2021-12-17 2023-06-22 Ev Group E. Thallner Gmbh Verfahren und vorrichtung zum ausrichten eines substrates
WO2023110114A1 (de) 2021-12-17 2023-06-22 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zur justierung eines erfassungsmittels
JP2023183276A (ja) * 2022-06-15 2023-12-27 キオクシア株式会社 接合装置、接合方法、及び半導体装置の製造方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT405775B (de) 1998-01-13 1999-11-25 Thallner Erich Verfahren und vorrichtung zum ausgerichteten zusammenführen von scheibenförmigen halbleitersubstraten
JP4626160B2 (ja) * 2004-03-04 2011-02-02 株式会社ニコン ウェハ重ね合わせ方法及びウェハ重ね合わせ装置
JP4867373B2 (ja) * 2006-02-02 2012-02-01 株式会社ニコン ウェハホルダ及び半導体装置の製造方法
US7433038B2 (en) * 2006-04-27 2008-10-07 Asml Netherlands B.V. Alignment of substrates for bonding
CN103258762B (zh) * 2007-08-10 2016-08-03 株式会社尼康 基板贴合装置及基板贴合方法
WO2010023935A1 (ja) * 2008-08-29 2010-03-04 株式会社ニコン 基板位置合わせ装置、基板位置合わせ方法および積層型半導体の製造方法
WO2010038454A1 (ja) 2008-10-01 2010-04-08 株式会社ニコン アラインメント装置およびアラインメント方法
EP3731258A1 (de) * 2009-09-22 2020-10-28 EV Group E. Thallner GmbH Vorrichtung zum ausrichten zweier substrate
JP5672715B2 (ja) 2010-02-19 2015-02-18 株式会社ニコン 重ね合わせ方法
JP5454310B2 (ja) * 2010-04-01 2014-03-26 株式会社ニコン 基板貼り合わせ装置および基板貼り合わせ方法
EP2612109B1 (de) 2010-09-03 2014-06-04 Ev Group E. Thallner GmbH Vorrichtung und verfahren zur verringerung eines keilfehlers
EP4290563A3 (de) 2010-12-20 2024-03-20 EV Group E. Thallner GmbH Aufnahmeeinrichtung zur halterung von wafern
TWI625797B (zh) * 2012-10-26 2018-06-01 Nikon Corp Substrate bonding device, substrate position matching device, substrate bonding method, and substrate position matching method
WO2014191033A1 (de) 2013-05-29 2014-12-04 Ev Group E. Thallner Gmbh Vorrichtung und verfahren zum bonden von substraten
CN105283950B (zh) * 2013-06-17 2018-03-13 Ev 集团 E·索尔纳有限责任公司 用于衬底对准的装置及方法
JP6111943B2 (ja) * 2013-09-11 2017-04-12 富士通セミコンダクター株式会社 半導体装置の検査装置、及び半導体装置の製造方法
CN105247670B (zh) * 2013-12-06 2018-06-12 Ev 集团 E·索尔纳有限责任公司 用于对齐衬底的装置和方法
JP6353373B2 (ja) 2015-01-16 2018-07-04 東京エレクトロン株式会社 接合装置、接合システムおよび接合方法
US10692747B2 (en) * 2016-08-29 2020-06-23 Ev Group E. Thallner Gmbh Method and device for alignment of substrates

Also Published As

Publication number Publication date
US20200227299A1 (en) 2020-07-16
CN109643674B (zh) 2023-01-10
TWI825958B (zh) 2023-12-11
WO2018041326A1 (de) 2018-03-08
US20210151339A1 (en) 2021-05-20
TW201812975A (zh) 2018-04-01
US20190198371A1 (en) 2019-06-27
CN115719721A (zh) 2023-02-28
JP2019530206A (ja) 2019-10-17
KR20210024662A (ko) 2021-03-05
KR20190042561A (ko) 2019-04-24
EP3504733B1 (de) 2020-09-23
TW202310146A (zh) 2023-03-01
TWI778973B (zh) 2022-10-01
EP3734650B1 (de) 2023-09-27
CN109643674A (zh) 2019-04-16
EP3504733A1 (de) 2019-07-03
KR102221965B1 (ko) 2021-03-03
US11488851B2 (en) 2022-11-01
EP3734650A1 (de) 2020-11-04
US10943807B2 (en) 2021-03-09
KR102386005B1 (ko) 2022-04-12
US10692747B2 (en) 2020-06-23
JP6801085B2 (ja) 2020-12-16

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