SG11201808283RA - Substrate processing apparatus, device management controller and recording medium - Google Patents
Substrate processing apparatus, device management controller and recording mediumInfo
- Publication number
- SG11201808283RA SG11201808283RA SG11201808283RA SG11201808283RA SG11201808283RA SG 11201808283R A SG11201808283R A SG 11201808283RA SG 11201808283R A SG11201808283R A SG 11201808283RA SG 11201808283R A SG11201808283R A SG 11201808283RA SG 11201808283R A SG11201808283R A SG 11201808283RA
- Authority
- SG
- Singapore
- Prior art keywords
- information
- device data
- recording medium
- processing apparatus
- substrate processing
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title abstract 2
- 230000002159 abnormal effect Effects 0.000 abstract 2
- 230000005856 abnormality Effects 0.000 abstract 2
- 238000012544 monitoring process Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B23/00—Testing or monitoring of control systems or parts thereof
- G05B23/02—Electric testing or monitoring
- G05B23/0205—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults
- G05B23/0218—Electric testing or monitoring by means of a monitoring system capable of detecting and responding to faults characterised by the fault detection method dealing with either existing or incipient faults
- G05B23/0224—Process history based detection method, e.g. whereby history implies the availability of large amounts of data
- G05B23/0227—Qualitative history assessment, whereby the type of data acted upon, e.g. waveforms, images or patterns, is not relevant, e.g. rule based assessment; if-then decisions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32184—Compare time, quality, state of operators with threshold value
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32191—Real time statistical process monitoring
Landscapes
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Testing And Monitoring For Control Systems (AREA)
- General Factory Administration (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2016/060653 WO2017168676A1 (ja) | 2016-03-31 | 2016-03-31 | 基板処理装置、装置管理コントローラ及び記録媒体 |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201808283RA true SG11201808283RA (en) | 2018-10-30 |
Family
ID=59963707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201808283RA SG11201808283RA (en) | 2016-03-31 | 2016-03-31 | Substrate processing apparatus, device management controller and recording medium |
Country Status (6)
Country | Link |
---|---|
US (1) | US10937676B2 (ja) |
JP (1) | JP6768058B2 (ja) |
KR (1) | KR102192094B1 (ja) |
CN (1) | CN108885970B (ja) |
SG (1) | SG11201808283RA (ja) |
WO (1) | WO2017168676A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111326445A (zh) * | 2018-12-13 | 2020-06-23 | 东京毅力科创株式会社 | 基片处理方法和基片处理装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6745673B2 (ja) * | 2016-08-05 | 2020-08-26 | 東京エレクトロン株式会社 | 半導体システム |
CN111727499A (zh) * | 2018-01-15 | 2020-09-29 | 应用材料公司 | 先进温度监测系统和用于半导体制造生产力的方法 |
KR102512456B1 (ko) | 2018-09-18 | 2023-03-20 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 반도체 장치의 제조 방법 및 프로그램 |
JP7082630B2 (ja) | 2020-03-19 | 2022-06-08 | 株式会社Kokusai Electric | 基板処理装置、半導体装置の表示方法、半導体装置の製造方法、及びプログラム |
US11860607B2 (en) * | 2020-08-18 | 2024-01-02 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor manufacturing system, behavior recognition device and semiconductor manufacturing method |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH586052A5 (ja) | 1975-10-07 | 1977-03-31 | Schwarz Guenter | |
JPS5855841B2 (ja) | 1978-06-19 | 1983-12-12 | チエルヤビンスキ− ポリテクニチエスキ− インスチテユ−ト イメニ レニンスコゴ コムソモラ | 金属棒圧延方法とそのための圧延ロ−ル |
WO2000014790A1 (fr) * | 1998-09-03 | 2000-03-16 | Hitachi, Ltd. | Systeme d'inspection et procede de production d'un dispositif electronique l'utilisant |
JP4207915B2 (ja) * | 2005-01-24 | 2009-01-14 | オムロン株式会社 | 品質変動表示装置、品質変動表示方法、品質変動表示プログラム及び該プログラムを記録した記録媒体 |
JP4796888B2 (ja) * | 2006-05-08 | 2011-10-19 | 東京エレクトロン株式会社 | 群管理システム、プロセス情報管理装置およびプログラム |
JP5567307B2 (ja) * | 2009-09-24 | 2014-08-06 | 株式会社日立国際電気 | 基板処理装置の異常検知システム、群管理装置、基板処理装置の異常検知方法及び基板処理システム。 |
JP5546197B2 (ja) | 2009-10-05 | 2014-07-09 | 株式会社日立国際電気 | 基板処理システム、群管理装置および基板処理装置の情報解析方法 |
JP5774331B2 (ja) * | 2011-03-03 | 2015-09-09 | 株式会社日立国際電気 | 基板処理システム、管理装置、データ解析方法、及びデータ解析プログラム |
JP5855841B2 (ja) | 2011-04-01 | 2016-02-09 | 株式会社日立国際電気 | 管理装置 |
JP5992706B2 (ja) * | 2012-03-26 | 2016-09-14 | 東京エレクトロン株式会社 | 半導体製造装置の障害監視システム及び障害監視方法 |
US10042357B2 (en) * | 2012-10-23 | 2018-08-07 | Applied Materials, Inc. | Portable, adaptable equipment health user interface |
US10514685B2 (en) * | 2014-06-13 | 2019-12-24 | KLA—Tencor Corp. | Automatic recipe stability monitoring and reporting |
-
2016
- 2016-03-31 SG SG11201808283RA patent/SG11201808283RA/en unknown
- 2016-03-31 WO PCT/JP2016/060653 patent/WO2017168676A1/ja active Application Filing
- 2016-03-31 CN CN201680083860.3A patent/CN108885970B/zh active Active
- 2016-03-31 JP JP2018508272A patent/JP6768058B2/ja active Active
- 2016-03-31 KR KR1020187027739A patent/KR102192094B1/ko active IP Right Grant
-
2018
- 2018-09-28 US US16/146,411 patent/US10937676B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111326445A (zh) * | 2018-12-13 | 2020-06-23 | 东京毅力科创株式会社 | 基片处理方法和基片处理装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2017168676A1 (ja) | 2019-01-10 |
KR102192094B1 (ko) | 2020-12-16 |
CN108885970B (zh) | 2024-02-02 |
KR20180121931A (ko) | 2018-11-09 |
WO2017168676A1 (ja) | 2017-10-05 |
US20190035657A1 (en) | 2019-01-31 |
US10937676B2 (en) | 2021-03-02 |
CN108885970A (zh) | 2018-11-23 |
JP6768058B2 (ja) | 2020-10-14 |
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