SG11201806779YA - Thermal treatment for preconditioning or restoration of a solder joint - Google Patents

Thermal treatment for preconditioning or restoration of a solder joint

Info

Publication number
SG11201806779YA
SG11201806779YA SG11201806779YA SG11201806779YA SG11201806779YA SG 11201806779Y A SG11201806779Y A SG 11201806779YA SG 11201806779Y A SG11201806779Y A SG 11201806779YA SG 11201806779Y A SG11201806779Y A SG 11201806779YA SG 11201806779Y A SG11201806779Y A SG 11201806779YA
Authority
SG
Singapore
Prior art keywords
toronto
ontario
international
street
thermal treatment
Prior art date
Application number
SG11201806779YA
Inventor
Polina Snugovsky
Eva Kosiba
Jeffrey K Kennedy
David Hillman
David Adams
Stephan Meschter
Doug D Perovic
Michael O Robinson
Joseph Juarez
Ivan Straznicky
Leonid Snugovsky
Marianne Romansky
Original Assignee
Celestica Int Inc
Dy 4 Systems Inc
Governing Council Univ Toronto
Bae Sys Controls Inc
Honeywell Aerospace
Rockwell Collins Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celestica Int Inc, Dy 4 Systems Inc, Governing Council Univ Toronto, Bae Sys Controls Inc, Honeywell Aerospace, Rockwell Collins Inc filed Critical Celestica Int Inc
Publication of SG11201806779YA publication Critical patent/SG11201806779YA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/19—Soldering, e.g. brazing, or unsoldering taking account of the properties of the materials to be soldered
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • C—CHEMISTRY; METALLURGY
    • C21—METALLURGY OF IRON
    • C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
    • C21D9/50—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for welded joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Piles And Underground Anchors (AREA)

Abstract

Assemblycleaning as necessary W O 17 / 13695 1 Al (12) INTERNATIONAL APPLICATION PUBLISHED UNDER THE PATENT COOPERATION TREATY (PCT) (19) World Intellectual Property Organization International Bureau (43) International Publication Date 17 August 2017 (17.08.2017) WIPO I PCT (10) International Publication Number WO 2017/136951 Al (51) International Patent Classification: B23K 1/00 (2006.01) B23K 1/20 (2006.01) (21) International Application Number: PCT/CA2017/050164 (22) International Filing Date: 10 February 2017 (10.02.2017) (25) Filing Language: English (26) Publication Language: English (30) Priority Data: 62/294,065 11 February 2016 (11.02.2016) US (71) Applicants: CELESTICA INTERNATIONAL INC. [CA/CA]; 844 Don Mills Road, Toronto, Ontario M3C 1V7 (CA). DY 4 SYSTEMS INC. [CA/CA]; 333 Palladi- um Drive, Kanata, Ontario K2V 1A6 (CA). THE GOV- ERNING COUNCIL OF THE UNIVERSITY OF TORONTO [CA/CA]; University of Toronto - 27 King's College Circle, Toronto, Ontario M5S 1A1 (CA). BAE SYSTEMS CONTROLS INC. [US/US]; 1098 Clark Street, Endicott, New York 13760 (US). HONEYWELL AEROSPACE [US/US]; 1944 E Sky Harbour Circle, Phoenix, Arizona 85034 (US). (72) Inventors: SNUGOVSKY, Polina; 844 Don Mills Road, Toronto, Ontario M3C 1V7 (CA). KOSIBA, Eva; 844 Don Mills Road, Toronto, Ontario M3C 1V7 (CA). KENNEDY, Jeffrey K.; 2800 Hilldale Ave. NE, Min- neapolis, Minnesota 55418 (US). HILLMAN, David; 400 Collins Rd. NE, Cedar Rapids, Iowa 52498 (US). ADAMS, David; 400 Collins Rd. NE, Cedar Rapids, Iowa 52498 (US). MESCHTER, Stephan; 1098 Clark Street, Endicott, New York 13760 (US). PEROVIC, Doug D.; 184 College Street, Toronto, Ontario M5S 3E4 (CA). ROBINSON, Michael 0.; 1944 E. Sky Harbor Circle, Phoenix, Arizona 85034 (US). JUAREZ, Joseph; 1944 E. Sky Harbor Circle, Phoenix, Arizona 85034 (US). STRAZNICKY, Ivan; 333 Palladium Drive, Kanata, Ontario K2V 1A6 (CA). SNUGOVSKY, Leonid; 184 College Street, Toronto, Ontario M5S 3E4 (CA). RO- MANSKY, Marianne; 844 Don Mills Road, Toronto, Ontario M3C 1V7 (CA). (74) Agents: SLANEY, Brett J. et al.; Blake, Cassels & Gray- don LLP, Commerce Court West, 199 Bay Street, Suite 4000, Toronto, Ontario M5L 1A9 (CA). (81) Designated States (unless otherwise indicated, for every kind of national protection available): AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BN, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DJ, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IR, IS, JP, KE, KG, KH, KN, KP, KR, KW, KZ, LA, LC, LK, LR, LS, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PA, PE, PG, PH, PL, PT, QA, RO, RS, RU, RW, SA, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW. (84) Designated States (unless otherwise indicated, for every kind of regional protection available): ARIPO (BW, GH, GM, KE, LR, LS, MW, MZ, NA, RW, SD, SL, ST, SZ, TZ, UG, ZM, ZW), Eurasian (AM, AZ, BY, KG, KZ, RU, TJ, TM), European (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR), OAPI (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, KM, ML, MR, NE, SN, TD, TG). [Continued on next page] (54) Title: THERMAL TREATMENT FOR PRECONDITIONING OR RESTORATION OF A SOLDER JOINT Pre-conditioning Process 10 12 14 16 Placement of Solder paste deposition surface mount components Reflow soldering Thermal treatment Soldering pin through hole components by wave soldering / 18 20 (57) : A thermal treatment method for conditioning or restoring bismuth containing lead-free solder in a solder joint as - sembly. The method comprising heating the solder in the assembly to a temperature near the solvus. 11111111111111 0 111011111111111 010 11111 III 0111 0111 11111 IR H 01111111111111 0111111 —› FIG. 1 WO 2017/136951 Al MIDEDIM000101011101010M011110i1OHMEM01111111011110111111 Published: — with international search report (Art. 21(3))
SG11201806779YA 2016-02-11 2017-02-10 Thermal treatment for preconditioning or restoration of a solder joint SG11201806779YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201662294065P 2016-02-11 2016-02-11
PCT/CA2017/050164 WO2017136951A1 (en) 2016-02-11 2017-02-10 Thermal treatment for preconditioning or restoration of a solder joint

Publications (1)

Publication Number Publication Date
SG11201806779YA true SG11201806779YA (en) 2018-09-27

Family

ID=59562906

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201806779YA SG11201806779YA (en) 2016-02-11 2017-02-10 Thermal treatment for preconditioning or restoration of a solder joint
SG10201914078RA SG10201914078RA (en) 2016-02-11 2017-02-10 Thermal treatment for preconditioning or restoration of a solder joint

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201914078RA SG10201914078RA (en) 2016-02-11 2017-02-10 Thermal treatment for preconditioning or restoration of a solder joint

Country Status (6)

Country Link
US (2) US20180345395A1 (en)
EP (1) EP3414039B1 (en)
CN (1) CN109661289A (en)
CA (1) CA3014085A1 (en)
SG (2) SG11201806779YA (en)
WO (1) WO2017136951A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108857132B (en) * 2018-07-24 2021-04-20 哈尔滨工业大学（深圳） Method for evaluating reliability of lead-free welding spot
US11740953B2 (en) 2021-01-22 2023-08-29 Google Llc Solder joint damage-prevention mode for a computing device
JP6936926B1 (en) * 2021-03-10 2021-09-22 千住金属工業株式会社 Solder alloys, solder powders, solder pastes, and solder fittings
CN114211070B (en) * 2021-12-31 2023-09-19 北京工业大学 Welding method for enabling welding spot crystal grains to be oriented into multiple twin crystals

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8807730D0 (en) * 1988-03-31 1988-05-05 Cookson Group Plc Low toxicity soldering compositions
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
FI98899C (en) * 1994-10-28 1997-09-10 Jorma Kalevi Kivilahti Method for connecting electronic components by soldering
AU2481602A (en) * 2000-11-08 2002-05-21 Corus Aluminium Walzprod Gmbh Brazing product having a low melting point
KR100790978B1 (en) * 2006-01-24 2008-01-02 삼성전자주식회사 A joining method at low temperature, anda mounting method of semiconductor package using the joining method
WO2009011341A1 (en) * 2007-07-13 2009-01-22 Senju Metal Industry Co., Ltd. Lead-free solder for vehicle, and in-vehicle electronic circuit
CN102275043A (en) * 2010-06-10 2011-12-14 中国科学院金属研究所 Method for eliminating brittleness of connecting interface between SnBi soldering flux and Cu substrate
EP2834037A4 (en) * 2012-03-20 2016-03-16 Alpha Metals Solder preforms and solder alloy assembly methods
US20150258636A1 (en) 2012-10-04 2015-09-17 Celestica International Inc. Solder alloy for low-temperature processing

Also Published As

Publication number Publication date
SG10201914078RA (en) 2020-03-30
EP3414039B1 (en) 2023-06-14
CA3014085A1 (en) 2017-08-17
EP3414039A1 (en) 2018-12-19
US20230249272A1 (en) 2023-08-10
EP3414039A4 (en) 2019-11-20
CN109661289A (en) 2019-04-19
US20180345395A1 (en) 2018-12-06
WO2017136951A1 (en) 2017-08-17

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