SG11201805654SA - Metrology device and metrology method - Google Patents

Metrology device and metrology method

Info

Publication number
SG11201805654SA
SG11201805654SA SG11201805654SA SG11201805654SA SG11201805654SA SG 11201805654S A SG11201805654S A SG 11201805654SA SG 11201805654S A SG11201805654S A SG 11201805654SA SG 11201805654S A SG11201805654S A SG 11201805654SA SG 11201805654S A SG11201805654S A SG 11201805654SA
Authority
SG
Singapore
Prior art keywords
substrate
substrate stack
beam path
metrology
detector
Prior art date
Application number
SG11201805654SA
Other languages
English (en)
Inventor
Martin Eibelhuber
Markus Heilig
Boris Povazay
Original Assignee
Ev Group E Thallner Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ev Group E Thallner Gmbh filed Critical Ev Group E Thallner Gmbh
Publication of SG11201805654SA publication Critical patent/SG11201805654SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01H—MEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H9/00—Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by using radiation-sensitive means, e.g. optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1717—Systems in which incident light is modified in accordance with the properties of the material investigated with a modulation of one or more physical properties of the sample during the optical investigation, e.g. electro-reflectance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2418—Probes using optoacoustic interaction with the material, e.g. laser radiation, photoacoustics
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/1702—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids
    • G01N2021/1706—Systems in which incident light is modified in accordance with the properties of the material investigated with opto-acoustic detection, e.g. for gases or analysing solids in solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/41—Refractivity; Phase-affecting properties, e.g. optical path length
    • G01N21/45—Refractivity; Phase-affecting properties, e.g. optical path length using interferometric methods; using Schlieren methods
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Optics & Photonics (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Radar Systems Or Details Thereof (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
SG11201805654SA 2016-02-17 2016-02-17 Metrology device and metrology method SG11201805654SA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2016/053327 WO2017140353A1 (de) 2016-02-17 2016-02-17 Metrologievorrichtung und metrologieverfahren

Publications (1)

Publication Number Publication Date
SG11201805654SA true SG11201805654SA (en) 2018-07-30

Family

ID=55443231

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201805654SA SG11201805654SA (en) 2016-02-17 2016-02-17 Metrology device and metrology method

Country Status (8)

Country Link
US (1) US10656078B2 (ja)
EP (1) EP3417283B9 (ja)
JP (1) JP6816155B2 (ja)
KR (1) KR102448312B1 (ja)
CN (1) CN109196351B (ja)
SG (1) SG11201805654SA (ja)
TW (1) TWI720129B (ja)
WO (1) WO2017140353A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11476144B2 (en) * 2018-12-03 2022-10-18 Kla Corporation Single cell in-die metrology targets and measurement methods
DE102021105946A1 (de) 2021-03-11 2022-09-15 Asml Netherlands B.V. Messvorrichtung und Verfahren zur Rauheits- und/oder Defektmessung an einer Oberfläche

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139302A (en) * 1977-02-17 1979-02-13 Dr. Ralph M. Grant Engineering Consultants, Inc. Method and apparatus for interferometric deformation analysis
DE2709686C2 (de) * 1977-03-05 1982-09-09 Krautkrämer, GmbH, 5000 Köln Optisches interferometrisches Verfahren zur berührungslosen Messung der durch Ultraschallwellen verursachten Oberflächenauslenkung eines Prüflings
JPH071254B2 (ja) 1990-07-24 1995-01-11 浜松ホトニクス株式会社 超音波検出装置
US20010015809A1 (en) * 1997-12-22 2001-08-23 Marvin B. Klein Homodyne interferometer using photorefractive polymer composite and method of sensing material
US6219145B1 (en) * 1998-02-17 2001-04-17 California Institute Of Technology Interferometric system for precision imaging of vibrating structures
US6008887A (en) * 1998-03-20 1999-12-28 Lasson Technologies, Inc. Single beam laser surface velocity and displacement measurement apparatus
US6795198B1 (en) * 1998-05-28 2004-09-21 Martin Fuchs Method and device for measuring thin films and semiconductor substrates using reflection mode geometry
AU2002308466A1 (en) * 2001-04-24 2002-11-05 National Research Council Of Canada Method and apparatus for probing objects in motion
US7770454B2 (en) 2003-09-26 2010-08-10 Lsp Technologies, Inc. Laser system and method for non-destructive bond detection and evaluation
CN100491968C (zh) 2005-07-28 2009-05-27 上海交通大学 测试金刚石涂层刀具附着强度及使用寿命的测量装置
BRPI0720394A2 (pt) 2007-02-21 2014-01-14 Lockheed Corp Robô articulado para inspeção ultrasônica a laser
WO2009008010A2 (en) * 2007-07-12 2009-01-15 Defence Research And Development Organisation Method and apparatus for the simultaneous generation and detection of optical diffraction interference pattern on a detector
JP5134888B2 (ja) * 2007-08-23 2013-01-30 オリンパスメディカルシステムズ株式会社 生体観測装置
JP5192846B2 (ja) * 2008-02-25 2013-05-08 オリンパスメディカルシステムズ株式会社 生体観測装置及び生体観測装置の作動方法
TW201105969A (en) * 2009-07-07 2011-02-16 Sony Corp Microfluidic device
WO2011093108A1 (ja) * 2010-02-01 2011-08-04 パナソニック株式会社 超音波プローブおよびそれを用いた超音波検査装置
CN101871894B (zh) * 2010-06-23 2012-05-23 南京大学 利用闪频检测实现材料内部缺陷的动态加载成像表征方法
JP2012047607A (ja) * 2010-08-27 2012-03-08 Hitachi Ltd 内部欠陥検査方法及びその装置
KR20160021301A (ko) 2010-11-12 2016-02-24 에베 그룹 에. 탈너 게엠베하 웨이퍼 스택에 있는 결함 및 층 두께를 측정하기 위한 측정 장치 및 측정 방법
JP5715234B2 (ja) * 2011-02-28 2015-05-07 東芝三菱電機産業システム株式会社 金属材の特性測定装置
EP2795669B1 (de) 2011-12-22 2020-06-17 EV Group E. Thallner GmbH Biegsame substrathalterung, vorrichtung und verfahren zum lösen eines ersten substrats
DE112014000401T5 (de) * 2013-02-08 2015-10-01 Borgwarner Inc. Abgasturbolader sowie Verfahren zur Herstellung eines Strömungsgehäuses eines Abgasturbolader
JP2014161484A (ja) * 2013-02-25 2014-09-08 Canon Inc 音響波取得装置およびその制御方法
CN105283744B (zh) * 2013-06-05 2018-05-18 Ev 集团 E·索尔纳有限责任公司 用以确定压力地图的测量装置及方法
SG11201606136UA (en) 2014-02-03 2016-09-29 Ev Group E Thallner Gmbh Method and device for bonding substrates
CN107073642B (zh) * 2014-07-14 2020-07-28 康宁股份有限公司 使用长度和直径可调的激光束焦线来加工透明材料的系统和方法
JP2015166751A (ja) 2015-07-03 2015-09-24 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウェーハスタック内の層厚さ及び欠陥を測定する測定デバイス及び方法

Also Published As

Publication number Publication date
CN109196351B (zh) 2021-08-20
EP3417283A1 (de) 2018-12-26
JP6816155B2 (ja) 2021-01-20
TW201734480A (zh) 2017-10-01
WO2017140353A1 (de) 2017-08-24
EP3417283B9 (de) 2020-07-29
EP3417283B1 (de) 2019-09-04
KR102448312B1 (ko) 2022-09-27
CN109196351A (zh) 2019-01-11
TWI720129B (zh) 2021-03-01
US10656078B2 (en) 2020-05-19
KR20180111830A (ko) 2018-10-11
JP2019505804A (ja) 2019-02-28
US20190025194A1 (en) 2019-01-24

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