SG11201709249VA - Sound transducer assembly with a mems sound transducer - Google Patents

Sound transducer assembly with a mems sound transducer

Info

Publication number
SG11201709249VA
SG11201709249VA SG11201709249VA SG11201709249VA SG11201709249VA SG 11201709249V A SG11201709249V A SG 11201709249VA SG 11201709249V A SG11201709249V A SG 11201709249VA SG 11201709249V A SG11201709249V A SG 11201709249VA SG 11201709249V A SG11201709249V A SG 11201709249VA
Authority
SG
Singapore
Prior art keywords
sound transducer
mems
assembly
transducer assembly
mems sound
Prior art date
Application number
SG11201709249VA
Other languages
English (en)
Inventor
Clerici Andrea Rusconi
Ferruccio Bottoni
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of SG11201709249VA publication Critical patent/SG11201709249VA/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R17/00—Piezoelectric transducers; Electrostrictive transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2884—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of the enclosure structure, i.e. strengthening or shape of the enclosure
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
SG11201709249VA 2015-05-13 2016-05-10 Sound transducer assembly with a mems sound transducer SG11201709249VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015107560.1A DE102015107560A1 (de) 2015-05-13 2015-05-13 Schallwandleranordnung mit MEMS-Schallwandler
PCT/EP2016/060426 WO2016180820A1 (de) 2015-05-13 2016-05-10 Schallwandleranordnung mit mems-schallwandler

Publications (1)

Publication Number Publication Date
SG11201709249VA true SG11201709249VA (en) 2017-12-28

Family

ID=55963359

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201709249VA SG11201709249VA (en) 2015-05-13 2016-05-10 Sound transducer assembly with a mems sound transducer
SG10201909786Q SG10201909786QA (en) 2015-05-13 2016-05-10 Sound transducer assembly with a mems sound transducer

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201909786Q SG10201909786QA (en) 2015-05-13 2016-05-10 Sound transducer assembly with a mems sound transducer

Country Status (10)

Country Link
US (1) US10412505B2 (zh)
EP (1) EP3295683B1 (zh)
KR (1) KR20180014726A (zh)
CN (1) CN107864696B (zh)
AU (1) AU2016261293B2 (zh)
CA (1) CA2985721A1 (zh)
DE (1) DE102015107560A1 (zh)
HK (1) HK1247015A1 (zh)
SG (2) SG11201709249VA (zh)
WO (1) WO2016180820A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
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DK3279621T5 (da) 2016-08-26 2021-05-31 Sonion Nederland Bv Vibrationssensor med lavfrekvens roll-off responskurve
DE102017108594A1 (de) * 2017-04-21 2018-10-25 USound GmbH Lautsprechereinheit mit einem elektrodynamischen und einem MEMS-Lautsprecher
DE102017114008A1 (de) 2017-06-23 2018-12-27 USound GmbH In-Ohr Hörer
DE102017114142A1 (de) 2017-06-26 2018-12-27 USound GmbH Schallwandleranordnung mit einer MEMS-Einheit
EP3651479B1 (de) * 2018-11-08 2022-06-01 Usound GmbH Herstellungsverfahren für zumindest eine membraneinheit eines mems-wandlers
DE102019101325A1 (de) * 2019-01-17 2020-07-23 USound GmbH Herstellungsverfahren für mehrere MEMS-Schallwandler
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
CN110677788B (zh) * 2019-09-24 2021-01-15 维沃移动通信有限公司 一种发声模组及电子设备
JP6857271B1 (ja) * 2019-10-14 2021-04-14 シャープ株式会社 スピーカ装置及び表示装置
US11395073B2 (en) * 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
KR20230020989A (ko) * 2020-05-08 2023-02-13 프라운호퍼-게젤샤프트 추르 푀르데룽 데어 안제반텐 포르슝 에 파우 체적 흐름과의 고효율적 상호작용을 위한 mems
CN111918188B (zh) * 2020-07-10 2021-12-14 瑞声科技（南京）有限公司 一种mems扬声器及其制造工艺
DE102021133329A1 (de) 2021-12-03 2023-06-07 USound GmbH MEMS-Schallwandler mit einer Dämpfungsschicht aus Klebstoff
CN114125675A (zh) * 2021-12-21 2022-03-01 歌尔微电子股份有限公司 Mems器件、麦克风及电子产品

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US3953675A (en) * 1972-05-08 1976-04-27 Babbco, Ltd. Audio speaker system
DE10053326A1 (de) 2000-10-27 2002-05-08 Bosch Gmbh Robert Mikromechanisches Bauelement und Herstellungsverfahren
US7434305B2 (en) * 2000-11-28 2008-10-14 Knowles Electronics, Llc. Method of manufacturing a microphone
US6675932B2 (en) * 2001-07-02 2004-01-13 Harman International Industries, Inc. Speaker housing configured to minimize standing waves and resonate above the frequency range of transducers
US6588544B2 (en) * 2001-08-06 2003-07-08 Joseph C. Fox Speaker box with molded plastic end caps
WO2007024909A1 (en) * 2005-08-23 2007-03-01 Analog Devices, Inc. Multi-microphone system
EP2073569B1 (en) * 2007-07-20 2014-05-07 Kuraray Chemical Co., Ltd. Material for speaker device and speaker device using it
JP2010187076A (ja) * 2009-02-10 2010-08-26 Funai Electric Co Ltd マイクロホンユニット
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JP5691181B2 (ja) * 2010-01-27 2015-04-01 船井電機株式会社 マイクロホンユニット、及び、それを備えた音声入力装置
US8577063B2 (en) * 2010-02-18 2013-11-05 Analog Devices, Inc. Packages and methods for packaging MEMS microphone devices
JP5029727B2 (ja) * 2010-06-01 2012-09-19 オムロン株式会社 半導体装置及びマイクロフォン
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DE102014105754B4 (de) * 2014-04-24 2022-02-10 USound GmbH Lautsprecheranordnung mit leiterplattenintegriertem ASIC
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Also Published As

Publication number Publication date
AU2016261293A1 (en) 2017-12-14
US10412505B2 (en) 2019-09-10
CA2985721A1 (en) 2016-11-17
HK1247015A1 (zh) 2018-09-14
AU2016261293B2 (en) 2020-12-10
CN107864696B (zh) 2021-02-02
WO2016180820A1 (de) 2016-11-17
EP3295683A1 (de) 2018-03-21
SG10201909786QA (en) 2019-11-28
EP3295683B1 (de) 2022-05-04
US20180139543A1 (en) 2018-05-17
DE102015107560A1 (de) 2016-11-17
KR20180014726A (ko) 2018-02-09
CN107864696A (zh) 2018-03-30

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