SG11201708367SA - Package assembly with gathered insulated wires - Google Patents

Package assembly with gathered insulated wires

Info

Publication number
SG11201708367SA
SG11201708367SA SG11201708367SA SG11201708367SA SG11201708367SA SG 11201708367S A SG11201708367S A SG 11201708367SA SG 11201708367S A SG11201708367S A SG 11201708367SA SG 11201708367S A SG11201708367S A SG 11201708367SA SG 11201708367S A SG11201708367S A SG 11201708367SA
Authority
SG
Singapore
Prior art keywords
gathered
package assembly
insulated wires
insulated
wires
Prior art date
Application number
SG11201708367SA
Inventor
Gong Ouyang
Beom-Taek Lee
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of SG11201708367SA publication Critical patent/SG11201708367SA/en

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    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
SG11201708367SA 2015-06-26 2015-06-26 Package assembly with gathered insulated wires SG11201708367SA (en)

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JP (1) JP2018518828A (en)
KR (1) KR102422980B1 (en)
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US10734321B2 (en) 2017-09-28 2020-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit and method of manufacturing same
JP7008819B2 (en) * 2018-06-27 2022-01-25 三菱電機株式会社 Power module and its manufacturing method and power converter
JP6971952B2 (en) 2018-11-07 2021-11-24 三菱電機株式会社 Semiconductor device
TWI763110B (en) 2020-11-04 2022-05-01 瑞昱半導體股份有限公司 Ball grid array package and packaging substratre thereof

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JP2880734B2 (en) * 1989-08-31 1999-04-12 株式会社東芝 Integrated circuit and its connection circuit
JP3690342B2 (en) * 2001-12-10 2005-08-31 凸版印刷株式会社 Bonding wire and semiconductor device using the same
JP4271435B2 (en) * 2002-12-09 2009-06-03 シャープ株式会社 Semiconductor device
US20040119172A1 (en) 2002-12-18 2004-06-24 Downey Susan H. Packaged IC using insulated wire
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EP3314651A4 (en) 2018-12-12
TWI741983B (en) 2021-10-11
EP3314651B1 (en) 2023-04-19
KR102422980B1 (en) 2022-07-19
JP2018518828A (en) 2018-07-12
US20170207146A1 (en) 2017-07-20
KR20180021138A (en) 2018-02-28
US9935036B2 (en) 2018-04-03
EP3314651A1 (en) 2018-05-02
CN108064417A (en) 2018-05-22
WO2016209286A1 (en) 2016-12-29
TW201711151A (en) 2017-03-16

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