EP3314651A4 - Package assembly with gathered insulated wires - Google Patents

Package assembly with gathered insulated wires Download PDF

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Publication number
EP3314651A4
EP3314651A4 EP15896572.3A EP15896572A EP3314651A4 EP 3314651 A4 EP3314651 A4 EP 3314651A4 EP 15896572 A EP15896572 A EP 15896572A EP 3314651 A4 EP3314651 A4 EP 3314651A4
Authority
EP
European Patent Office
Prior art keywords
gathered
package assembly
insulated wires
insulated
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15896572.3A
Other languages
German (de)
French (fr)
Other versions
EP3314651A1 (en
EP3314651B1 (en
Inventor
Gong Ouyang
Beom-Taek Lee
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of EP3314651A1 publication Critical patent/EP3314651A1/en
Publication of EP3314651A4 publication Critical patent/EP3314651A4/en
Application granted granted Critical
Publication of EP3314651B1 publication Critical patent/EP3314651B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
EP15896572.3A 2015-06-26 2015-06-26 Package assembly with gathered insulated wires Active EP3314651B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2015/038109 WO2016209286A1 (en) 2015-06-26 2015-06-26 Package assembly with gathered insulated wires

Publications (3)

Publication Number Publication Date
EP3314651A1 EP3314651A1 (en) 2018-05-02
EP3314651A4 true EP3314651A4 (en) 2018-12-12
EP3314651B1 EP3314651B1 (en) 2023-04-19

Family

ID=57585304

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15896572.3A Active EP3314651B1 (en) 2015-06-26 2015-06-26 Package assembly with gathered insulated wires

Country Status (8)

Country Link
US (1) US9935036B2 (en)
EP (1) EP3314651B1 (en)
JP (1) JP2018518828A (en)
KR (1) KR102422980B1 (en)
CN (1) CN108064417B (en)
SG (1) SG11201708367SA (en)
TW (1) TWI741983B (en)
WO (1) WO2016209286A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10734321B2 (en) 2017-09-28 2020-08-04 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated circuit and method of manufacturing same
JP7008819B2 (en) * 2018-06-27 2022-01-25 三菱電機株式会社 Power module and its manufacturing method and power converter
JP6971952B2 (en) 2018-11-07 2021-11-24 三菱電機株式会社 Semiconductor device
TWI763110B (en) 2020-11-04 2022-05-01 瑞昱半導體股份有限公司 Ball grid array package and packaging substratre thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812580B1 (en) * 2003-06-09 2004-11-02 Freescale Semiconductor, Inc. Semiconductor package having optimized wire bond positioning
US20060175712A1 (en) * 2005-02-10 2006-08-10 Microbonds, Inc. High performance IC package and method
US20120228783A1 (en) * 2011-03-11 2012-09-13 Siang Ng Kok Mixed wire bonding profile and pad-layout configurations in ic packaging processes for high-speed electronic devices

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5818949A (en) * 1981-07-28 1983-02-03 Nec Corp Semiconductor device
JP2880734B2 (en) * 1989-08-31 1999-04-12 株式会社東芝 Integrated circuit and its connection circuit
JP3690342B2 (en) * 2001-12-10 2005-08-31 凸版印刷株式会社 Bonding wire and semiconductor device using the same
JP4271435B2 (en) * 2002-12-09 2009-06-03 シャープ株式会社 Semiconductor device
US20040119172A1 (en) * 2002-12-18 2004-06-24 Downey Susan H. Packaged IC using insulated wire
US7675168B2 (en) * 2005-02-25 2010-03-09 Agere Systems Inc. Integrated circuit with staggered differential wire bond pairs
US7626123B2 (en) * 2005-12-12 2009-12-01 Raytheon Sarcos, Llc Electrical microfilament to circuit interface
US7538413B2 (en) 2006-12-28 2009-05-26 Micron Technology, Inc. Semiconductor components having through interconnects
US7825527B2 (en) * 2008-06-13 2010-11-02 Altera Corporation Return loss techniques in wirebond packages for high-speed data communications
US7718471B1 (en) * 2008-11-12 2010-05-18 White Electronic Designs Corporation Method and apparatus for stacked die package with insulated wire bonds
US8723338B2 (en) * 2012-08-15 2014-05-13 Stats Chippac Ltd. Integrated circuit packaging system with array contacts and method of manufacture thereof
US9078352B2 (en) * 2012-10-29 2015-07-07 Avago Technologies General Ip (Singapore) Pte. Ltd. Low inductance flex bond with low thermal resistance
US9613877B2 (en) * 2013-10-10 2017-04-04 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods for forming semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6812580B1 (en) * 2003-06-09 2004-11-02 Freescale Semiconductor, Inc. Semiconductor package having optimized wire bond positioning
US20060175712A1 (en) * 2005-02-10 2006-08-10 Microbonds, Inc. High performance IC package and method
US20120228783A1 (en) * 2011-03-11 2012-09-13 Siang Ng Kok Mixed wire bonding profile and pad-layout configurations in ic packaging processes for high-speed electronic devices

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016209286A1 *

Also Published As

Publication number Publication date
CN108064417A (en) 2018-05-22
SG11201708367SA (en) 2018-01-30
EP3314651A1 (en) 2018-05-02
KR102422980B1 (en) 2022-07-19
US9935036B2 (en) 2018-04-03
TW201711151A (en) 2017-03-16
JP2018518828A (en) 2018-07-12
US20170207146A1 (en) 2017-07-20
WO2016209286A1 (en) 2016-12-29
CN108064417B (en) 2022-01-18
KR20180021138A (en) 2018-02-28
EP3314651B1 (en) 2023-04-19
TWI741983B (en) 2021-10-11

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