SG11201707139TA - Suction equipment - Google Patents

Suction equipment

Info

Publication number
SG11201707139TA
SG11201707139TA SG11201707139TA SG11201707139TA SG11201707139TA SG 11201707139T A SG11201707139T A SG 11201707139TA SG 11201707139T A SG11201707139T A SG 11201707139TA SG 11201707139T A SG11201707139T A SG 11201707139TA SG 11201707139T A SG11201707139T A SG 11201707139TA
Authority
SG
Singapore
Prior art keywords
suction equipment
suction
equipment
Prior art date
Application number
SG11201707139TA
Other languages
English (en)
Inventor
Hitoshi Iwasaka
Hideyuki Tokunaga
Yuji Kasai
Original Assignee
Harmotec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harmotec Co Ltd filed Critical Harmotec Co Ltd
Publication of SG11201707139TA publication Critical patent/SG11201707139TA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90—Devices for picking-up and depositing articles or materials
    • B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2201/00—Indexing codes relating to handling devices, e.g. conveyors, characterised by the type of product or load being conveyed or handled
    • B65G2201/02—Articles
    • B65G2201/0214—Articles of special size, shape or weigh
    • B65G2201/022—Flat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
  • Coating Apparatus (AREA)
SG11201707139TA 2015-03-03 2016-02-29 Suction equipment SG11201707139TA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015041426A JP5908136B1 (ja) 2015-03-03 2015-03-03 吸引装置
PCT/JP2016/055972 WO2016140171A1 (fr) 2015-03-03 2016-02-29 Dispositif d'aspiration

Publications (1)

Publication Number Publication Date
SG11201707139TA true SG11201707139TA (en) 2017-10-30

Family

ID=55793183

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707139TA SG11201707139TA (en) 2015-03-03 2016-02-29 Suction equipment

Country Status (8)

Country Link
US (1) US10189166B2 (fr)
EP (1) EP3081349B1 (fr)
JP (1) JP5908136B1 (fr)
KR (2) KR101737293B1 (fr)
MY (1) MY179672A (fr)
SG (1) SG11201707139TA (fr)
TW (1) TWI605916B (fr)
WO (1) WO2016140171A1 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6326451B2 (ja) * 2016-06-08 2018-05-16 株式会社ハーモテック 搬送装置及び吸引装置
JP6814009B2 (ja) * 2016-10-04 2021-01-13 株式会社ディスコ 搬送パッド及びウエーハの搬送方法
JP6744630B2 (ja) * 2016-12-16 2020-08-19 株式会社ハーモテック 邪魔板
US10391723B2 (en) * 2017-08-31 2019-08-27 The Boeing Company Rotary compaction tool
JP2019042895A (ja) * 2017-09-05 2019-03-22 株式会社ハーモテック 吸引装置
JP7148105B2 (ja) * 2017-09-20 2022-10-05 株式会社ハーモテック 吸引装置
TW201922427A (zh) 2017-11-01 2019-06-16 瑞士商諾華公司 用於人工晶狀體和接觸鏡片之白努利夾持器
EP3712929B1 (fr) * 2017-11-17 2023-09-13 Hamamatsu Photonics K.K. Procédé d'aspiration
JP6924488B2 (ja) * 2018-04-12 2021-08-25 株式会社ハーモテック 旋回流形成体
CN108501025B (zh) * 2018-06-05 2023-08-18 苏州神运机器人有限公司 一种带吹气功能的吸盘架
WO2020161937A1 (fr) * 2019-02-05 2020-08-13 パナソニックＩｐマネジメント株式会社 Dispositif capteur
US11551964B2 (en) * 2020-11-17 2023-01-10 Western Digital Technologies, Inc. Semiconductor wafer transfer arm
CN114955532B (zh) * 2022-04-11 2023-02-14 广东冠星陶瓷企业有限公司 一种自动化陶瓷无印迹吸附设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067762A (en) * 1985-06-18 1991-11-26 Hiroshi Akashi Non-contact conveying device
JPS6351446U (fr) * 1986-09-22 1988-04-07
JP3054896B2 (ja) * 1992-07-27 2000-06-19 博 明石 小穴を有する板状体用空気保持装置
US6467297B1 (en) * 2000-10-12 2002-10-22 Jetek, Inc. Wafer holder for rotating and translating wafers
JP4669252B2 (ja) 2000-06-09 2011-04-13 株式会社ハーモテック 旋回流形成体および非接触搬送装置
EP1233442B1 (fr) * 2001-02-20 2009-10-14 Harmotec Corporation Dispositif de transport sans contact
JP4342331B2 (ja) * 2004-02-09 2009-10-14 株式会社コガネイ 非接触搬送装置
JP4437415B2 (ja) * 2004-03-03 2010-03-24 リンク・パワー株式会社 非接触保持装置および非接触保持搬送装置
JP4491340B2 (ja) * 2004-12-28 2010-06-30 株式会社コガネイ 搬送装置
JP2006341346A (ja) * 2005-06-09 2006-12-21 Fujifilm Holdings Corp 非接触型搬送装置
JP4243766B2 (ja) * 2006-10-02 2009-03-25 Ｓｍｃ株式会社 非接触搬送装置
KR100859835B1 (ko) 2008-05-13 2008-09-23 한국뉴매틱(주) 비접촉식 진공패드
JP2010253567A (ja) 2009-04-21 2010-11-11 Seiko Epson Corp 吸引保持ハンド、吸引保持方法、及び搬送装置
JP5282734B2 (ja) 2009-12-28 2013-09-04 国立大学法人東京工業大学 非接触チャック
JP5822437B2 (ja) 2010-06-16 2015-11-24 日本空圧システム株式会社 保持具
JP2013030654A (ja) * 2011-07-29 2013-02-07 Kimihiro Eguchi 基板保持機構、半導体基板の分離処理装置および半導体基板の分離方法
JP5875294B2 (ja) 2011-08-29 2016-03-02 日本空圧システム株式会社 保持具
JP5921323B2 (ja) * 2012-05-11 2016-05-24 株式会社妙徳 搬送保持具及び搬送保持装置
JP2014107318A (ja) 2012-11-26 2014-06-09 Seiko Epson Corp 基板保持装置、液滴吐出装置
JP2014227260A (ja) 2013-05-22 2014-12-08 株式会社ハーモテック 搬送装置

Also Published As

Publication number Publication date
JP2016159405A (ja) 2016-09-05
JP5908136B1 (ja) 2016-04-26
US20180065257A1 (en) 2018-03-08
TWI605916B (zh) 2017-11-21
US10189166B2 (en) 2019-01-29
KR101737293B1 (ko) 2017-05-17
EP3081349B1 (fr) 2018-01-24
WO2016140171A1 (fr) 2016-09-09
KR20160113157A (ko) 2016-09-28
KR101737300B1 (ko) 2017-05-17
TW201706093A (zh) 2017-02-16
MY179672A (en) 2020-11-11
EP3081349A1 (fr) 2016-10-19
EP3081349A4 (fr) 2016-12-28
KR20170038105A (ko) 2017-04-05

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