SG11201704871QA - Method for electromagnetic shielding and thermal management of active components - Google Patents

Method for electromagnetic shielding and thermal management of active components

Info

Publication number
SG11201704871QA
SG11201704871QA SG11201704871QA SG11201704871QA SG11201704871QA SG 11201704871Q A SG11201704871Q A SG 11201704871QA SG 11201704871Q A SG11201704871Q A SG 11201704871QA SG 11201704871Q A SG11201704871Q A SG 11201704871QA SG 11201704871Q A SG11201704871Q A SG 11201704871QA
Authority
SG
Singapore
Prior art keywords
electromagnetic shielding
active components
thermal management
management
shielding
Prior art date
Application number
SG11201704871QA
Other languages
English (en)
Inventor
Kenichiroh Mukai
Kwonil Kim
Lee Gaherty
Lutz Brandt
Tafadzwa Magaya
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of SG11201704871QA publication Critical patent/SG11201704871QA/en

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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    • C23C18/1635—Composition of the substrate
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    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Electrochemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
SG11201704871QA 2014-12-22 2015-12-22 Method for electromagnetic shielding and thermal management of active components SG11201704871QA (en)

Applications Claiming Priority (2)

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EP14199574 2014-12-22
PCT/EP2015/002594 WO2016102066A1 (en) 2014-12-22 2015-12-22 Method for electromagnetic shielding and thermal management of active components

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JP (1) JP2018502453A (zh)
KR (1) KR102049650B1 (zh)
CN (1) CN107112311B (zh)
SG (1) SG11201704871QA (zh)
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JP6679162B2 (ja) * 2016-02-17 2020-04-15 株式会社ディスコ 半導体パッケージの製造方法
US10854556B2 (en) * 2016-10-12 2020-12-01 Advanced Semiconductor Engineering Korea, Inc. Semiconductor package device and method of manufacturing the same
KR102187350B1 (ko) 2018-11-20 2020-12-07 주식회사 에스모머티리얼즈 반도체 패키지 제조용 몰딩 장치 및 이를 통하여 제조된 반도체 패키지
JP2020136331A (ja) * 2019-02-14 2020-08-31 株式会社日産アーク 半導体装置及びその製造方法
CN113436978B (zh) * 2021-05-10 2024-03-12 江苏长电科技股份有限公司 一种bga溅镀工艺方法

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EP3238249B1 (en) 2020-12-09
TWI691027B (zh) 2020-04-11
KR102049650B1 (ko) 2019-11-28
KR20170099982A (ko) 2017-09-01
TW201637151A (zh) 2016-10-16
US20170330861A1 (en) 2017-11-16
EP3238249A1 (en) 2017-11-01
US10249572B2 (en) 2019-04-02
JP2018502453A (ja) 2018-01-25
CN107112311B (zh) 2020-10-02
WO2016102066A1 (en) 2016-06-30
CN107112311A (zh) 2017-08-29

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