SG11201703585RA - Analyzing and utilizing landscapes - Google Patents

Analyzing and utilizing landscapes

Info

Publication number
SG11201703585RA
SG11201703585RA SG11201703585RA SG11201703585RA SG11201703585RA SG 11201703585R A SG11201703585R A SG 11201703585RA SG 11201703585R A SG11201703585R A SG 11201703585RA SG 11201703585R A SG11201703585R A SG 11201703585RA SG 11201703585R A SG11201703585R A SG 11201703585RA
Authority
SG
Singapore
Prior art keywords
landscapes
analyzing
utilizing
utilizing landscapes
Prior art date
Application number
SG11201703585RA
Other languages
English (en)
Inventor
Tal Marciano
Barak Bringoltz
Evgeni Gurevich
Ido Adam
Za'ev Lindenfeld
Zeng Zhao
Yoel Feler
Daniel Kandel
Nadav Carmel
Amnon Manassen
Nuriel Amir
Oded Kaminsky
Tal Yaziv
Ofer Zaharan
Moshe Cooper
Roee Sulimarski
Tom Leviant
Noga Sella
Boris Efraty
Lilach Saltoun
Amir Handelman
Eltsafon Ashwal
Ohad Bachar
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of SG11201703585RA publication Critical patent/SG11201703585RA/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70625—Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
SG11201703585RA 2014-11-25 2015-11-24 Analyzing and utilizing landscapes SG11201703585RA (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462083891P 2014-11-25 2014-11-25
US201562100384P 2015-01-06 2015-01-06
PCT/US2015/062523 WO2016086056A1 (en) 2014-11-25 2015-11-24 Analyzing and utilizing landscapes

Publications (1)

Publication Number Publication Date
SG11201703585RA true SG11201703585RA (en) 2017-06-29

Family

ID=56075006

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201703585RA SG11201703585RA (en) 2014-11-25 2015-11-24 Analyzing and utilizing landscapes

Country Status (8)

Country Link
US (1) US10831108B2 (OSRAM)
JP (3) JP6770958B2 (OSRAM)
KR (1) KR102269514B1 (OSRAM)
CN (2) CN107078074B (OSRAM)
IL (1) IL251972B (OSRAM)
SG (1) SG11201703585RA (OSRAM)
TW (2) TWI711096B (OSRAM)
WO (1) WO2016086056A1 (OSRAM)

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Also Published As

Publication number Publication date
KR102269514B1 (ko) 2021-06-25
KR20170088403A (ko) 2017-08-01
JP2022065040A (ja) 2022-04-26
JP6770958B2 (ja) 2020-10-21
TW202018836A (zh) 2020-05-16
US20160313658A1 (en) 2016-10-27
US10831108B2 (en) 2020-11-10
IL251972B (en) 2022-03-01
WO2016086056A1 (en) 2016-06-02
JP2020201293A (ja) 2020-12-17
TWI711096B (zh) 2020-11-21
CN107078074B (zh) 2021-05-25
CN112698551A (zh) 2021-04-23
JP7023337B2 (ja) 2022-02-21
JP2017537317A (ja) 2017-12-14
TWI719804B (zh) 2021-02-21
TW201633419A (zh) 2016-09-16
CN112698551B (zh) 2024-04-23
IL251972A0 (en) 2017-06-29
CN107078074A (zh) 2017-08-18

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