SG11201608913YA - Loud speaker arrangement with circuit-board-integrated asic - Google Patents

Loud speaker arrangement with circuit-board-integrated asic

Info

Publication number
SG11201608913YA
SG11201608913YA SG11201608913YA SG11201608913YA SG11201608913YA SG 11201608913Y A SG11201608913Y A SG 11201608913YA SG 11201608913Y A SG11201608913Y A SG 11201608913YA SG 11201608913Y A SG11201608913Y A SG 11201608913YA SG 11201608913Y A SG11201608913Y A SG 11201608913YA
Authority
SG
Singapore
Prior art keywords
board
circuit
loud speaker
speaker arrangement
integrated asic
Prior art date
Application number
SG11201608913YA
Other languages
English (en)
Inventor
Clerici Andrea Rusconi
Ferruccio Bottoni
Original Assignee
USound GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by USound GmbH filed Critical USound GmbH
Publication of SG11201608913YA publication Critical patent/SG11201608913YA/en

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/04Microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00Electrostatic transducers
    • H04R19/02Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00Circuits for transducers, loudspeakers or microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003Mems transducers or their use

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
SG11201608913YA 2014-04-24 2015-04-24 Loud speaker arrangement with circuit-board-integrated asic SG11201608913YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014105754.6A DE102014105754B4 (de) 2014-04-24 2014-04-24 Lautsprecheranordnung mit leiterplattenintegriertem ASIC
PCT/EP2015/058898 WO2015162248A1 (fr) 2014-04-24 2015-04-24 Système de haut-parleur muni d'un circuit asic intégré dans une carte de circuit imprimé

Publications (1)

Publication Number Publication Date
SG11201608913YA true SG11201608913YA (en) 2016-11-29

Family

ID=53039401

Family Applications (2)

Application Number Title Priority Date Filing Date
SG11201608913YA SG11201608913YA (en) 2014-04-24 2015-04-24 Loud speaker arrangement with circuit-board-integrated asic
SG10201809403YA SG10201809403YA (en) 2014-04-24 2015-04-24 Loudspeaker array with circuit board-integrated asic

Family Applications After (1)

Application Number Title Priority Date Filing Date
SG10201809403YA SG10201809403YA (en) 2014-04-24 2015-04-24 Loudspeaker array with circuit board-integrated asic

Country Status (9)

Country Link
US (1) US10097927B2 (fr)
EP (1) EP3135044B1 (fr)
KR (1) KR20160146952A (fr)
CN (1) CN107027341B (fr)
AU (1) AU2015250799B2 (fr)
CA (1) CA2946784A1 (fr)
DE (1) DE102014105754B4 (fr)
SG (2) SG11201608913YA (fr)
WO (1) WO2015162248A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9301043B2 (en) * 2013-05-01 2016-03-29 Harman International Industries, Inc. Sealed speaker system having a pressure vent
DE102015107560A1 (de) 2015-05-13 2016-11-17 USound GmbH Schallwandleranordnung mit MEMS-Schallwandler
DE102019121258A1 (de) * 2019-08-06 2021-02-11 USound GmbH Mobiltelefon mit einem eine rückseitige Sekundäröffnung aufweisenden Audiosystem
US11805342B2 (en) 2019-09-22 2023-10-31 xMEMS Labs, Inc. Sound producing package structure and manufacturing method thereof
US11395073B2 (en) * 2020-04-18 2022-07-19 xMEMS Labs, Inc. Sound producing package structure and method for packaging sound producing package structure
US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
CN113114831B (zh) * 2021-04-12 2023-05-26 维沃移动通信有限公司 电子设备
CN113539850A (zh) * 2021-07-16 2021-10-22 芯知微(上海)电子科技有限公司 一种系统级封装方法及封装结构
CN113645556A (zh) * 2021-08-27 2021-11-12 歌尔微电子股份有限公司 Mems麦克风封装结构及封装方法
CN217116396U (zh) * 2022-03-03 2022-08-02 瑞声开泰科技(武汉)有限公司 Mems扬声器
DE102022209706A1 (de) 2022-09-15 2024-03-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein MEMS, Verfahren zum Herstellen eines MEMS und Verfahren zum Auslegen eines MEMS
CN115767404A (zh) * 2022-11-29 2023-03-07 瑞声开泰科技(武汉)有限公司 Mems扬声器制备工艺及mems扬声器

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EP0774888B1 (fr) * 1995-11-16 2003-03-19 Matsushita Electric Industrial Co., Ltd Panneau à circuit imprimé et assemblage de celui-ci
US7166910B2 (en) * 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
TWI267315B (en) * 2002-07-01 2006-11-21 Sony Ericsson Mobile Comm Ab Communication terminal
TWI348872B (en) * 2007-10-17 2011-09-11 Ind Tech Res Inst Electro-acoustic sensing device
US7869206B2 (en) * 2008-09-05 2011-01-11 Apple Inc. Handheld computing device
US8199953B2 (en) * 2008-10-30 2012-06-12 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Multi-aperture acoustic horn
US7825509B1 (en) * 2009-06-13 2010-11-02 Mwm Acoustics, Llc Transducer package with transducer die unsupported by a substrate
JP2011114506A (ja) * 2009-11-26 2011-06-09 Funai Electric Co Ltd マイクロホンユニット
WO2011076289A1 (fr) * 2009-12-24 2011-06-30 Nokia Corporation Appareil
CN101895798B (zh) * 2010-07-29 2013-03-13 青岛海信移动通信技术股份有限公司 扬声器音腔密封结构以及便携式移动终端
US8618619B1 (en) * 2011-01-28 2013-12-31 Amkor Technology, Inc. Top port with interposer MEMS microphone package and method
US20130001550A1 (en) * 2011-06-29 2013-01-03 Invensense, Inc. Hermetically sealed mems device with a portion exposed to the environment with vertically integrated electronics
DE102011084393A1 (de) * 2011-10-13 2013-04-18 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
US9402137B2 (en) 2011-11-14 2016-07-26 Infineon Technologies Ag Sound transducer with interdigitated first and second sets of comb fingers
DE102011086722A1 (de) * 2011-11-21 2013-05-23 Robert Bosch Gmbh Mikromechanische Funktionsvorrichtung, insbesondere Lautsprechervorrichtung, und entsprechendes Herstellungsverfahren
CN202374407U (zh) * 2011-11-24 2012-08-08 比亚迪股份有限公司 一种音腔装置及应用其的电子产品
US8995694B2 (en) * 2012-02-01 2015-03-31 Knowles Electronics, Llc Embedded circuit in a MEMS device
US8866237B2 (en) * 2012-02-27 2014-10-21 Texas Instruments Incorporated Methods for embedding controlled-cavity MEMS package in integration board
DE102012205921A1 (de) 2012-04-12 2013-10-17 Robert Bosch Gmbh Membrananordnung für einen mikro-elektromechanischen Messumformer und Verfahren zum Herstellen einer Membrananordnung
US9078063B2 (en) * 2012-08-10 2015-07-07 Knowles Electronics, Llc Microphone assembly with barrier to prevent contaminant infiltration
US9216897B2 (en) * 2013-06-05 2015-12-22 Invensense, Inc. Capacitive sensing structure with embedded acoustic channels
DE102013212173B4 (de) * 2013-06-26 2016-06-02 Robert Bosch Gmbh MEMS-Bauelement mit einer auslenkbaren Membran und einem feststehenden Gegenelement sowie Verfahren zu dessen Herstellung

Also Published As

Publication number Publication date
CA2946784A1 (fr) 2015-10-29
WO2015162248A1 (fr) 2015-10-29
EP3135044A1 (fr) 2017-03-01
DE102014105754A1 (de) 2015-10-29
US20170048624A1 (en) 2017-02-16
EP3135044B1 (fr) 2019-06-05
CN107027341A (zh) 2017-08-08
AU2015250799B2 (en) 2019-04-04
AU2015250799A1 (en) 2016-11-17
KR20160146952A (ko) 2016-12-21
SG10201809403YA (en) 2018-11-29
CN107027341B (zh) 2020-03-13
DE102014105754B4 (de) 2022-02-10
US10097927B2 (en) 2018-10-09

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