EP3135044B1 - Système de haut-parleur muni d'un circuit asic intégré dans une carte de circuit imprimé - Google Patents

Système de haut-parleur muni d'un circuit asic intégré dans une carte de circuit imprimé Download PDF

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Publication number
EP3135044B1
EP3135044B1 EP15719663.5A EP15719663A EP3135044B1 EP 3135044 B1 EP3135044 B1 EP 3135044B1 EP 15719663 A EP15719663 A EP 15719663A EP 3135044 B1 EP3135044 B1 EP 3135044B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
cavity
loudspeaker
mems
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15719663.5A
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German (de)
English (en)
Other versions
EP3135044A1 (fr
Inventor
Andrea Rusconi Clerici Beltrami
Ferruccio Bottoni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
USound GmbH
Original Assignee
USound GmbH
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Publication date
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Publication of EP3135044A1 publication Critical patent/EP3135044A1/fr
Application granted granted Critical
Publication of EP3135044B1 publication Critical patent/EP3135044B1/fr
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R3/00—Circuits for transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/003—Mems transducers or their use

Definitions

  • MEMS microelectromechanical systems.
  • MEMS speakers or microspeakers for example, from the DE 10 2012 220 819 A1 known.
  • the sound is generated by a vibrating diaphragm of the MEMS loudspeaker.
  • Such a microspeaker usually has to generate a high air volume shift in order to achieve a significant sound pressure level.
  • Known MEMS speakers have the disadvantage that they have a relatively large volume of construction.
  • the third printed circuit board cavity is preferably, in particular directly, formed in the region of the opening of the second printed circuit board cavity.
  • the MEMS speaker is further fixed in particular form-fitting in the circuit board.
  • the MEMS loudspeaker with the circuit board cohesively, in particular by gluing, and / or non-positively, in particular by pressing, be firmly connected to the circuit board.
  • the MEMS loudspeaker is oriented relative to the printed circuit board in such a way that the substrate cavity and the second printed circuit board cavity together form the cavity of the MEMS loudspeaker.
  • the volume of the cavity which is formed at least by the second circuit board cavity, can be additionally increased by the volume of the substrate cavity.
  • the second substrate opening of the MEMS loudspeaker is preferably oriented toward the second printed circuit board cavity.
  • the MEMS loudspeaker is oriented relative to the printed circuit board such that the substrate cavity, in particular together with the fourth printed circuit board cavity, at least partially forms the sound channel.
  • the speaker assembly can be made very compact.
  • the second substrate opening faces away from the second circuit board cavity.
  • first and second circuit board cavities in particular the first and second recesses, are arranged next to one another. Furthermore, it is advantageous if the first and second printed circuit board cavities are separated from one another. To be able to form the loudspeaker arrangement as narrow as possible, it is alternatively also advantageous if the first and second circuit board cavities are arranged one above the other and / or, in particular by means of a layer, are separated from one another.
  • the MEMS loudspeaker 3 is designed such that it can generate sound waves in the audible wavelength spectrum.
  • the MEMS loudspeaker 3 comprises a carrier substrate 5.
  • the carrier substrate 5 has at least one substrate cavity 6.
  • the substrate cavity 6 in turn has a first, image-oriented upper, substrate opening 7 and a second, image-oriented lower, substrate opening 8 in the area of two opposite sides of the carrier substrate 5.
  • the carrier substrate 5 thus forms a frame.
  • the MEMS loudspeaker 3 further comprises a membrane 9. This is connected in the edge region 10 of the carrier substrate 5 fixed thereto.
  • the membrane 9 thus spans the frame-shaped carrier substrate 5 in the region of the first substrate opening 7.
  • the MEMS loudspeaker 3 can be excited via the ASIC 4 in such a way that the membrane 9 is vibrated relative to the carrier substrate 5 in order to generate sound energy.
  • the loudspeaker arrangement 1 has electrical, in particular passive, additional components 12a, 12b.
  • This electronic Additional components 12a, 12b are likewise embedded in the printed circuit board 2. According to the in FIG. 1 illustrated embodiment, these are arranged in the same first printed circuit board cavity 11.
  • the first printed circuit board cavity 11 could also comprise a plurality of separate printed circuit board cavities, wherein an electronic component, ie the ASIC 4 and / or an additional component 12a, 12b, could be arranged separately in each one. It is advantageous if these printed circuit board cavities are arranged in a plane of the loudspeaker arrangement 1.
  • the circuit board 2 comprises a second circuit board cavity 13.
  • the second circuit board cavity 13 has an opening 14. This is closed by the MEMS loudspeaker 3.
  • the MEMS loudspeaker 3 extends over at least the entire width of the opening 14.
  • the second printed circuit board cavity 13 forms part of a cavity 15 of the MEMS loudspeaker 3.
  • the cavity 15 serves to increase the sound pressure of the MEMS loudspeaker 3. Due to the installation position of the MEMS speaker 3, the other part of the cavity 15 is formed by the substrate cavity 6 of the MEMS speaker 3.
  • the cavity 15 of the MEMS speaker 3 is in accordance with the in FIG. 1 illustrated embodiment thus formed very large, since this is formed both by the second circuit board cavity 13 and by the substrate cavity 6.
  • FIG. 1 is the opening 14 of the second circuit board cavity 13 on the outside of the circuit board 2, in this case the built-in top 19 of the circuit board 2 is formed.
  • the MEMS speaker 3 on the outside or top 19 of the circuit board 2 is arranged.
  • the MEMS loudspeaker 3 is oriented in such a way relative to the printed circuit board 2 that its second substrate opening 8 points towards the printed circuit board 2.
  • the volume of the cavity 15 can be increased since the cavity 15 now also includes the substrate cavity 6 in addition to the second printed circuit board cavity 13.
  • the first and second printed circuit board cavity 11, 13 are arranged one above the other.
  • the printed circuit board 2 has at least one continuous layer, ie without recess 24, so that the two printed circuit board cavities 11, 13 are separated from one another.
  • the MEMS loudspeaker 3 terminates flush with the upper side 19 of the printed circuit board 2.
  • the height of the third circuit board cavity 25 compared to the height of the MEMS speaker 3 but also be designed to be larger, so that the MEMS speaker 3 to the top 19 of the circuit board 2 has a distance.
  • the second and fourth circuit board cavities 13, 27 are spaced from each other by means of the third circuit board cavity 25. Further, these are separated from each other by the MEMS speaker 3 integrated in the third circuit board cavity 25.
  • the fourth circuit board cavity 27 is analogous to the first, second and third circuit board cavity 11, 13, 25 formed by at least one layer 23 of the circuit board 2, which has a correspondingly wide recess 24 for forming the fourth circuit board cavity 27.
  • the formation of the fourth circuit board cavity 27 it is of course also possible for the formation of the fourth circuit board cavity 27 to have a plurality of layers 23 with corresponding recesses 24 arranged one above the other.
  • the MEMS speaker 3 relative to the circuit board 2 is oriented such that the substrate cavity 6 and the second circuit board cavity 13 together form the cavity 15 of the MEMS speaker 3.
  • the second substrate opening 8 is oriented toward the second printed circuit board cavity 13.
  • the MEMS loudspeaker 3 can also be arranged rotated through 180 ° in the printed circuit board 2.
  • the MEMS speaker 3 relative to the circuit board 2 is thus oriented so that the substrate cavity 6 together with the fourth printed circuit board cavity 27 form the Schallleitkanal 21.
  • horizontally extending region 31 include.
  • the sound channel 21 or region 31 extending at a 90 ° angle to the z-axis would thus be arranged directly adjacent to the MEMS loudspeaker 3.
  • the fourth cavity 27 may also be formed in an attachment 36 separate from the printed circuit board 2.
  • This separate attachment 36 is then connected to the circuit board 2, in particular glued.
  • the attachment 36 has a different material to the circuit board 2.
  • the ASIC 4 and the MEMS speaker in the circuit board 2 is integrated or embedded and / or the circuit board.
  • 2 separate attachment 36 comprises at least partially, in the present case completely, the sound-conducting channel 21, preferably the first and / or the second region 30, 31.
  • FIG. 6 shows the speaker assembly 1 with an alternative embodiment of the MEMS loudspeaker 3.
  • the MEMS loudspeaker 3 is formed with a plurality of sound-generating membrane regions 32, of which only one is provided with a reference numeral for the sake of clarity.
  • Each of these membrane regions 32 is assigned its own substrate cavity 6.
  • the substrate cavities 6 are separated from one another by webs 33. According to the in FIG. 6 illustrated embodiment, all substrate cavities 6 open into the common second circuit board cavity thirteenth

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Obtaining Desirable Characteristics In Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Claims (13)

  1. Ensemble de haut-parleur (1)
    avec une carte imprimée (2),
    un haut-parleur MEMS (3) pour générer des ondes acoustiques dans le spectre de longueur d'onde audible, qui comprend une membrane (9) déflectible le long d'un axe z, et
    un circuit intégré spécifique ASIC (4) électriquement relié avec le haut-parleur MEMS (3),
    dans lequel la carte imprimée (2) présente une première cavité (11) de carte imprimée, dans laquelle est disposé l'ASIC (4), et
    dans lequel la carte imprimée (2) présente une seconde cavité (13) de carte imprimée avec une ouverture (14),
    laquelle est fermée par le haut-parleur MEMS (3) de sorte que la seconde cavité (13) de carte imprimée forme au moins une partie d'une cavité (15) du haut-parleur MEMS (3),
    caractérisé en ce que
    la première cavité (11) de carte imprimée est fermée, de sorte que l'ASIC (4) est complètement intégré et encastré dans la carte imprimée (2), et
    en ce que l'ensemble de haut-parleur (1) présente un canal de conduction acoustique (21) adjacent au haut-parleur MEMS (3) et présentant une ouverture de sortie acoustique (22),
    en ce que le canal de conduction acoustique (21) s'étend obliquement par rapport à l'axe z du haut-parleur MEMS et
    en ce que l'ouverture de sortie acoustique (22) est disposée sur une surface latérale de l'ensemble de haut-parleur (1).
  2. Ensemble de haut-parleur selon la revendication précédente, caractérisé en ce que le canal de conduction acoustique (21) est incliné de 90° par rapport à l'axe z.
  3. Ensemble haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que la carte imprimée (2) présente une troisième cavité (25) de carte imprimée, en particulier adjacente à la seconde cavité (13) de carte imprimée et/ou disposée dans la zone de l'ouverture (14), dans laquelle est au moins partiellement disposé le haut-parleur MEMS (3).
  4. Ensemble de haut-parleur selon la revendication 3, caractérisé en ce que le haut-parleur MEMS (3) est intégré dans la carte imprimée (2), en particulier de sorte que la troisième cavité (25) de carte imprimée entoure le haut-parleur MEMS (3) par complémentarité de forme en sa zone de bordure (10), en particulier, dans la zone de sa face orientée vers la seconde cavité (13) de carte imprimée.
  5. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que le canal de conduction acoustique (21) est disposé dans une position adjacente à la troisième cavité (25) de carte imprimée et/ou est formé au moins partiellement par une quatrième cavité (27) de carte imprimée de la carte imprimé (2).
  6. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que la largeur du canal de conduction acoustique (21) s'agrandit au moins en certaines régions dans la direction de l'ouverture de sortie (22).
  7. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que le canal de conduction acoustique (21) présente une première région (30) et une seconde région (31), qui sont inclinées l'une par rapport à l'autre d'un certain angle, en particulier de 90°.
  8. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que la seconde et la quatrième cavités (13, 27) de carte imprimée sont distancées l'une de l'autre à l'aide de la troisième cavité (25) de carte imprimée et/ou séparées l'une de l'autre par le haut-parleur MEMS (3) qui y est intégré.
  9. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que la carte imprimée (2) est réalisée en forme de sandwich à partir d'une multitude de couches (23) reliées les uns avec les autres dont une au moins présente un premier évidement (24) au moyen duquel la première cavité (11) de carte imprimée est au moins partiellement formée et/ou
    présente un second évidemment (24) au moyen duquel sont formés au moins partiellement la seconde, la troisième et/ou la quatrième cavités (13, 25, 27) de carte imprimée.
  10. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que la première et la seconde cavités (11, 13) de carte imprimée sont disposés l'une à côté de l'autre ou l'une au-dessus de l'autre et/ou sont séparées l'une de l'autre.
  11. Ensemble de haut-parleur selon l'une ou plusieurs des revendications précédentes, caractérisé en ce que la carte imprimée (2) présente au moins un canal de compensation de pression (16) qui, partant de la seconde cavité (13) de carte imprimée, s'étend jusqu'à une surface extérieure de l'ensemble de haut-parleur (1).
  12. Ensemble de haut-parleur selon la revendication 11, caractérisé en ce que le canal de compensation de pression (16) présente une ouverture de compensation (18) sur la surface extérieure, de préférence sur une surface latérale, sur une surface inférieure et/ou une surface supérieure de l'ensemble de haut-parleur (1), en particulier de la carte imprimée (2).
  13. Ensemble de haut-parleur selon les revendications 11 ou 12, caractérisé en ce que le canal de compensation de pression (16) présente une première région (28), en particulier reliée avec la seconde cavité (13) de carte imprimée, et une seconde région (29), en particulier reliée avec l'ouverture de compensation (18), qui sont inclinées l'une par rapport à l'autre d'un certain angle, en particulier de 90°.
EP15719663.5A 2014-04-24 2015-04-24 Système de haut-parleur muni d'un circuit asic intégré dans une carte de circuit imprimé Active EP3135044B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014105754.6A DE102014105754B4 (de) 2014-04-24 2014-04-24 Lautsprecheranordnung mit leiterplattenintegriertem ASIC
PCT/EP2015/058898 WO2015162248A1 (fr) 2014-04-24 2015-04-24 Système de haut-parleur muni d'un circuit asic intégré dans une carte de circuit imprimé

Publications (2)

Publication Number Publication Date
EP3135044A1 EP3135044A1 (fr) 2017-03-01
EP3135044B1 true EP3135044B1 (fr) 2019-06-05

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EP15719663.5A Active EP3135044B1 (fr) 2014-04-24 2015-04-24 Système de haut-parleur muni d'un circuit asic intégré dans une carte de circuit imprimé

Country Status (9)

Country Link
US (1) US10097927B2 (fr)
EP (1) EP3135044B1 (fr)
KR (1) KR20160146952A (fr)
CN (1) CN107027341B (fr)
AU (1) AU2015250799B2 (fr)
CA (1) CA2946784A1 (fr)
DE (1) DE102014105754B4 (fr)
SG (2) SG11201608913YA (fr)
WO (1) WO2015162248A1 (fr)

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DE102019121258A1 (de) * 2019-08-06 2021-02-11 USound GmbH Mobiltelefon mit einem eine rückseitige Sekundäröffnung aufweisenden Audiosystem
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US11252511B2 (en) 2019-12-27 2022-02-15 xMEMS Labs, Inc. Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus
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Also Published As

Publication number Publication date
US10097927B2 (en) 2018-10-09
DE102014105754B4 (de) 2022-02-10
WO2015162248A1 (fr) 2015-10-29
AU2015250799B2 (en) 2019-04-04
EP3135044A1 (fr) 2017-03-01
SG11201608913YA (en) 2016-11-29
CN107027341B (zh) 2020-03-13
US20170048624A1 (en) 2017-02-16
CA2946784A1 (fr) 2015-10-29
CN107027341A (zh) 2017-08-08
DE102014105754A1 (de) 2015-10-29
AU2015250799A1 (en) 2016-11-17
SG10201809403YA (en) 2018-11-29
KR20160146952A (ko) 2016-12-21

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