SG11201605151TA - Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor device - Google Patents
Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor deviceInfo
- Publication number
- SG11201605151TA SG11201605151TA SG11201605151TA SG11201605151TA SG11201605151TA SG 11201605151T A SG11201605151T A SG 11201605151TA SG 11201605151T A SG11201605151T A SG 11201605151TA SG 11201605151T A SG11201605151T A SG 11201605151TA SG 11201605151T A SG11201605151T A SG 11201605151TA
- Authority
- SG
- Singapore
- Prior art keywords
- double
- semiconductor device
- sealing sheet
- manufacturing semiconductor
- sheet provided
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Geometry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013270259A JP6272690B2 (en) | 2013-12-26 | 2013-12-26 | Sealing sheet with double-sided separator and method for manufacturing semiconductor device |
PCT/JP2014/083928 WO2015098851A1 (en) | 2013-12-26 | 2014-12-22 | Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201605151TA true SG11201605151TA (en) | 2016-08-30 |
Family
ID=53478705
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201605151TA SG11201605151TA (en) | 2013-12-26 | 2014-12-22 | Sealing sheet provided with double-sided separator, and method for manufacturing semiconductor device |
Country Status (7)
Country | Link |
---|---|
US (1) | US20170040187A1 (en) |
JP (1) | JP6272690B2 (en) |
KR (1) | KR20160101911A (en) |
CN (1) | CN105874582B (en) |
SG (1) | SG11201605151TA (en) |
TW (1) | TWI643294B (en) |
WO (1) | WO2015098851A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017088759A (en) * | 2015-11-11 | 2017-05-25 | リンテック株式会社 | Adhesive sheet |
WO2018150893A1 (en) * | 2017-02-17 | 2018-08-23 | パナソニックIpマネジメント株式会社 | Solar cell module |
JP2019046897A (en) | 2017-08-31 | 2019-03-22 | リンテック株式会社 | Resin sheet and semiconductor device |
JP6960276B2 (en) | 2017-08-31 | 2021-11-05 | リンテック株式会社 | How to use resin sheets, semiconductor devices, and resin sheets |
JP6676593B2 (en) | 2017-09-08 | 2020-04-08 | リンテック株式会社 | Resin sheet and semiconductor device |
US20210345484A1 (en) * | 2018-10-22 | 2021-11-04 | Toyobo Co., Ltd. | Method for manufacturing device connected body, and device connected body |
JP7200961B2 (en) | 2020-03-06 | 2023-01-10 | 味の素株式会社 | Semiconductor device manufacturing method and resin sheet |
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JP4383768B2 (en) * | 2003-04-23 | 2009-12-16 | スリーエム イノベイティブ プロパティズ カンパニー | Film adhesive for sealing, film laminate for sealing, and sealing method |
JP4754185B2 (en) * | 2004-05-27 | 2011-08-24 | リンテック株式会社 | Semiconductor sealing resin sheet and semiconductor device manufacturing method using the same |
JP4730652B2 (en) | 2004-06-02 | 2011-07-20 | ナガセケムテックス株式会社 | Manufacturing method of electronic parts |
US20070025441A1 (en) * | 2005-07-28 | 2007-02-01 | Nokia Corporation | Method, module, device and system for rate control provision for video encoders capable of variable bit rate encoding |
JP5223657B2 (en) * | 2008-12-24 | 2013-06-26 | 株式会社村田製作所 | Electronic component manufacturing method and manufacturing apparatus |
US20120224062A1 (en) * | 2009-08-07 | 2012-09-06 | Light Blue Optics Ltd | Head up displays |
JP2011228637A (en) * | 2010-03-30 | 2011-11-10 | Furukawa Electric Co Ltd:The | Chip protecting film |
JP5385247B2 (en) * | 2010-12-03 | 2014-01-08 | 信越化学工業株式会社 | Wafer mold material and semiconductor device manufacturing method |
JP5623970B2 (en) * | 2011-04-22 | 2014-11-12 | 信越化学工業株式会社 | Resin laminate, semiconductor device and manufacturing method thereof |
JP6051630B2 (en) * | 2011-07-13 | 2016-12-27 | 味の素株式会社 | Semiconductor package |
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