SG11201510784RA - Method and device for treating a substrate surface - Google Patents
Method and device for treating a substrate surfaceInfo
- Publication number
- SG11201510784RA SG11201510784RA SG11201510784RA SG11201510784RA SG11201510784RA SG 11201510784R A SG11201510784R A SG 11201510784RA SG 11201510784R A SG11201510784R A SG 11201510784RA SG 11201510784R A SG11201510784R A SG 11201510784RA SG 11201510784R A SG11201510784R A SG 11201510784RA
- Authority
- SG
- Singapore
- Prior art keywords
- treating
- substrate surface
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/EP2013/064151 WO2015000520A1 (en) | 2013-07-04 | 2013-07-04 | Method and device for treating a substrate surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201510784RA true SG11201510784RA (en) | 2016-02-26 |
Family
ID=48747550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201510784RA SG11201510784RA (en) | 2013-07-04 | 2013-07-04 | Method and device for treating a substrate surface |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160126085A1 (en) |
| EP (1) | EP3017462B9 (en) |
| JP (1) | JP6227131B2 (en) |
| KR (1) | KR20160026869A (en) |
| CN (1) | CN105340073A (en) |
| SG (1) | SG11201510784RA (en) |
| TW (1) | TWI619160B (en) |
| WO (1) | WO2015000520A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102259484B1 (en) | 2014-02-03 | 2021-06-02 | 에베 그룹 에. 탈너 게엠베하 | Method and device for bonding substrates |
| CN109348643B (en) * | 2018-12-06 | 2019-12-24 | 四川英创力电子科技股份有限公司 | Circuit board desizing liquid and preparation method thereof |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4050083A (en) * | 1976-09-22 | 1977-09-20 | Cutler-Hammer, Inc. | Integrated thermally sensitive power switching semiconductor device, including a thermally self-protected version |
| US4507078A (en) * | 1983-03-28 | 1985-03-26 | Silicon Valley Group, Inc. | Wafer handling apparatus and method |
| JPH04348051A (en) * | 1991-01-30 | 1992-12-03 | Toshiba Corp | Wafer heating treatment apparatus |
| US5342738A (en) * | 1991-06-04 | 1994-08-30 | Sony Corporation | Resist film developing method and an apparatus for carrying out the same |
| IT227686Y1 (en) * | 1992-11-20 | 1997-12-15 | Hitech Systems Srl | CONVEYOR FOR THE DISPOSAL OF GENERIC PRODUCTS WITH PACKAGING OR BOXING MACHINES |
| JPH06181173A (en) * | 1992-12-11 | 1994-06-28 | Nec Corp | Heating system |
| JP3247976B2 (en) * | 1993-09-06 | 2002-01-21 | 東京エレクトロン株式会社 | Heat treatment equipment |
| JPH07254545A (en) * | 1994-03-15 | 1995-10-03 | Oki Electric Ind Co Ltd | Heat treatment method for semiconductor substrate and device therefor |
| JPH07273100A (en) * | 1994-03-31 | 1995-10-20 | Toshiba Corp | Method and apparatus for heat-treatment of semiconductor device |
| JPH10209023A (en) * | 1997-01-28 | 1998-08-07 | Matsushita Electric Ind Co Ltd | Method and apparatus for treating substrate |
| JPH11272342A (en) * | 1998-03-24 | 1999-10-08 | Dainippon Screen Mfg Co Ltd | Device and method for heat treatment of substrate |
| EP1391140B1 (en) * | 2001-04-30 | 2012-10-10 | Lam Research Corporation | Method and apparatus for controlling the spatial temperature distribution across the surface of a workpiece support |
| JP3950424B2 (en) * | 2003-02-10 | 2007-08-01 | 東京エレクトロン株式会社 | Heat treatment equipment |
| JP4250469B2 (en) * | 2003-07-14 | 2009-04-08 | キヤノンマーケティングジャパン株式会社 | Heat treatment apparatus and heat treatment method |
| US7244665B2 (en) * | 2004-04-29 | 2007-07-17 | Micron Technology, Inc. | Wafer edge ring structures and methods of formation |
| JP2008235302A (en) * | 2007-03-16 | 2008-10-02 | Dainippon Screen Mfg Co Ltd | Equipment and method for processing substrate |
| JP2009164483A (en) * | 2008-01-09 | 2009-07-23 | Panasonic Corp | Method of manufacturing semiconductor device, and semiconductor substrate processing device |
| JP5239988B2 (en) * | 2009-03-24 | 2013-07-17 | 東京エレクトロン株式会社 | Mounting table structure and processing device |
| EP2383771B1 (en) * | 2010-04-29 | 2020-04-22 | EV Group GmbH | Method and device for loosening a polymer coating from a surface of a substrate |
| CN103348205B (en) * | 2010-12-10 | 2016-03-23 | 马克·萨瓦瑞斯 | drying device and method |
| JP2012250230A (en) * | 2011-06-02 | 2012-12-20 | Tokyo Ohka Kogyo Co Ltd | Heating device, coating device and heating method |
| CN202230996U (en) * | 2011-09-01 | 2012-05-23 | 中微半导体设备(上海)有限公司 | Electrostatic chuck capable of carrying out regional temperature control |
-
2013
- 2013-07-04 JP JP2016522291A patent/JP6227131B2/en active Active
- 2013-07-04 US US14/896,065 patent/US20160126085A1/en not_active Abandoned
- 2013-07-04 KR KR1020157034452A patent/KR20160026869A/en not_active Application Discontinuation
- 2013-07-04 CN CN201380077961.6A patent/CN105340073A/en active Pending
- 2013-07-04 SG SG11201510784RA patent/SG11201510784RA/en unknown
- 2013-07-04 EP EP13734389.3A patent/EP3017462B9/en active Active
- 2013-07-04 WO PCT/EP2013/064151 patent/WO2015000520A1/en active Application Filing
-
2014
- 2014-07-04 TW TW103123203A patent/TWI619160B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| EP3017462B1 (en) | 2017-09-13 |
| TWI619160B (en) | 2018-03-21 |
| WO2015000520A1 (en) | 2015-01-08 |
| EP3017462A1 (en) | 2016-05-11 |
| US20160126085A1 (en) | 2016-05-05 |
| KR20160026869A (en) | 2016-03-09 |
| EP3017462B9 (en) | 2017-12-27 |
| JP2016525275A (en) | 2016-08-22 |
| CN105340073A (en) | 2016-02-17 |
| TW201511121A (en) | 2015-03-16 |
| JP6227131B2 (en) | 2017-11-08 |
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