SG11201505714WA - Sheet-form thermosetting resin composition for sealing electronic component, resin-sealed semiconductor device, and method of manufacturing resin-sealed semiconductor device - Google Patents
Sheet-form thermosetting resin composition for sealing electronic component, resin-sealed semiconductor device, and method of manufacturing resin-sealed semiconductor deviceInfo
- Publication number
- SG11201505714WA SG11201505714WA SG11201505714WA SG11201505714WA SG11201505714WA SG 11201505714W A SG11201505714W A SG 11201505714WA SG 11201505714W A SG11201505714W A SG 11201505714WA SG 11201505714W A SG11201505714W A SG 11201505714WA SG 11201505714W A SG11201505714W A SG 11201505714WA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- sealed semiconductor
- resin
- sheet
- electronic component
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
- C08J2363/02—Polyglycidyl ethers of bis-phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013010225 | 2013-01-23 | ||
JP2014005102A JP6251575B2 (en) | 2013-01-23 | 2014-01-15 | Sheet-like thermosetting resin composition for encapsulating electronic components, resin-encapsulated semiconductor device, and method for producing resin-encapsulated semiconductor device |
PCT/JP2014/051123 WO2014115725A1 (en) | 2013-01-23 | 2014-01-21 | Thermosetting resin composition for sealing sheet-form electronic component, resin-sealed semiconductor device, and method of manufacturing resin-sealed semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201505714WA true SG11201505714WA (en) | 2015-09-29 |
Family
ID=51227516
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201505714WA SG11201505714WA (en) | 2013-01-23 | 2014-01-21 | Sheet-form thermosetting resin composition for sealing electronic component, resin-sealed semiconductor device, and method of manufacturing resin-sealed semiconductor device |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6251575B2 (en) |
KR (1) | KR20150108916A (en) |
CN (1) | CN104937036A (en) |
SG (1) | SG11201505714WA (en) |
TW (1) | TW201446870A (en) |
WO (1) | WO2014115725A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6302801B2 (en) * | 2014-09-03 | 2018-03-28 | 日東電工株式会社 | Sealing sheet |
EP3138887B1 (en) * | 2015-02-04 | 2021-08-18 | LG Chem, Ltd. | Pressure-sensitive adhesive composition |
KR101826545B1 (en) | 2015-07-31 | 2018-02-07 | 현대자동차 주식회사 | Exhaust system for vehicle |
JP2017088656A (en) * | 2015-11-04 | 2017-05-25 | 信越化学工業株式会社 | Flame-retardant resin composition, flame-retardant resin film and semiconductor device and method for producing the same |
JP6168259B1 (en) * | 2015-12-25 | 2017-07-26 | 住友ベークライト株式会社 | Resin composition for sealing, and semiconductor device |
JP6819067B2 (en) * | 2016-03-31 | 2021-01-27 | 住友ベークライト株式会社 | Thermosetting resin composition, resin film with carrier, printed wiring board and semiconductor device |
WO2019188255A1 (en) * | 2018-03-26 | 2019-10-03 | リンテック株式会社 | Resin sheet and method for producing same |
JP7222320B2 (en) * | 2019-06-25 | 2023-02-15 | 味の素株式会社 | resin composition |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0841171A (en) * | 1994-07-27 | 1996-02-13 | Matsushita Electric Works Ltd | Sealing epoxy resin composition |
JPH09202850A (en) * | 1995-11-20 | 1997-08-05 | Matsushita Electric Works Ltd | Epoxy resin composition for sealing use, semiconductor device using the same, and production of the composition |
JPH1180559A (en) * | 1997-08-29 | 1999-03-26 | Nippon Zeon Co Ltd | Material for sealing gap between semiconductor chip and substrate |
JP2003249510A (en) * | 2002-02-26 | 2003-09-05 | Asuriito Fa Kk | Method for sealing semiconductor |
JP2004018602A (en) * | 2002-06-13 | 2004-01-22 | Nitto Denko Corp | Semiconductor sealing resin composition and semiconductor device using the same |
JP2004067774A (en) * | 2002-08-02 | 2004-03-04 | Sumitomo Bakelite Co Ltd | Epoxy resin composition and semiconductor device |
JP4850510B2 (en) * | 2005-12-28 | 2012-01-11 | 京セラケミカル株式会社 | Resin composition for sealing and semiconductor device |
JP5157473B2 (en) * | 2007-03-28 | 2013-03-06 | 住友ベークライト株式会社 | Epoxy resin composition for semiconductor encapsulation and semiconductor device |
JP2011246596A (en) * | 2010-05-26 | 2011-12-08 | Kyocera Chemical Corp | Sheet-like resin composition and circuit component sealed by using the same |
JP5882040B2 (en) * | 2011-05-20 | 2016-03-09 | 日東電工株式会社 | Resin kneaded product, resin sheet, and method for producing resin kneaded product |
JP2013006171A (en) * | 2011-05-20 | 2013-01-10 | Nitto Denko Corp | Kneading machine |
US20150017450A1 (en) * | 2012-01-26 | 2015-01-15 | Toray Industries, Inc. | Resin composition and semiconductor mounting substrate obtained by molding same |
-
2014
- 2014-01-15 JP JP2014005102A patent/JP6251575B2/en active Active
- 2014-01-21 CN CN201480005497.4A patent/CN104937036A/en active Pending
- 2014-01-21 SG SG11201505714WA patent/SG11201505714WA/en unknown
- 2014-01-21 WO PCT/JP2014/051123 patent/WO2014115725A1/en active Application Filing
- 2014-01-21 KR KR1020157022786A patent/KR20150108916A/en not_active Application Discontinuation
- 2014-01-23 TW TW103102481A patent/TW201446870A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6251575B2 (en) | 2017-12-20 |
JP2014159555A (en) | 2014-09-04 |
TW201446870A (en) | 2014-12-16 |
KR20150108916A (en) | 2015-09-30 |
CN104937036A (en) | 2015-09-23 |
WO2014115725A1 (en) | 2014-07-31 |
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