SG11201602233PA - Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package - Google Patents
Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor packageInfo
- Publication number
- SG11201602233PA SG11201602233PA SG11201602233PA SG11201602233PA SG11201602233PA SG 11201602233P A SG11201602233P A SG 11201602233PA SG 11201602233P A SG11201602233P A SG 11201602233PA SG 11201602233P A SG11201602233P A SG 11201602233PA SG 11201602233P A SG11201602233P A SG 11201602233PA
- Authority
- SG
- Singapore
- Prior art keywords
- curable resin
- resin sheet
- thermally curable
- semiconductor chip
- semiconductor package
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000011347 resin Substances 0.000 title 1
- 229920005989 resin Polymers 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
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- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06568—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking the devices decreasing in size, e.g. pyramidical stack
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L24/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L24/80 - H01L24/90
- H01L24/92—Specific sequence of method steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18161—Exposing the passive side of the semiconductor or solid-state body of a flip chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013196854 | 2013-09-24 | ||
JP2014167223A JP6320239B2 (en) | 2013-09-24 | 2014-08-20 | Semiconductor chip sealing thermosetting resin sheet and semiconductor package manufacturing method |
PCT/JP2014/073755 WO2015045846A1 (en) | 2013-09-24 | 2014-09-09 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package |
Publications (1)
Publication Number | Publication Date |
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SG11201602233PA true SG11201602233PA (en) | 2016-05-30 |
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Family Applications (1)
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SG11201602233PA SG11201602233PA (en) | 2013-09-24 | 2014-09-09 | Thermally curable resin sheet for sealing semiconductor chip, and method for manufacturing semiconductor package |
Country Status (7)
Country | Link |
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US (1) | US9659883B2 (en) |
JP (1) | JP6320239B2 (en) |
KR (1) | KR20160060073A (en) |
CN (1) | CN105555848B (en) |
SG (1) | SG11201602233PA (en) |
TW (1) | TW201516122A (en) |
WO (1) | WO2015045846A1 (en) |
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JP6792322B2 (en) * | 2015-05-12 | 2020-11-25 | 昭和電工マテリアルズ株式会社 | Semiconductor devices and methods for manufacturing semiconductor devices |
TWI618615B (en) * | 2015-08-12 | 2018-03-21 | Zhao Chang Wen | Method for forming thermosetting resin package sheet |
JP2017088759A (en) * | 2015-11-11 | 2017-05-25 | リンテック株式会社 | Adhesive sheet |
JP6224188B1 (en) | 2016-08-08 | 2017-11-01 | 太陽インキ製造株式会社 | Semiconductor encapsulant |
WO2018083885A1 (en) * | 2016-11-02 | 2018-05-11 | 住友ベークライト株式会社 | Epoxy resin composition and structure |
US9865570B1 (en) * | 2017-02-14 | 2018-01-09 | Globalfoundries Inc. | Integrated circuit package with thermally conductive pillar |
JP7066975B2 (en) * | 2017-03-10 | 2022-05-16 | 味の素株式会社 | Resin composition, resin sheet, circuit board and semiconductor chip package |
WO2018207862A1 (en) * | 2017-05-10 | 2018-11-15 | 三井化学株式会社 | Method for producing semiconductor device and intermediate for semiconductor device |
CN109300794B (en) * | 2017-07-25 | 2021-02-02 | 中芯国际集成电路制造(上海)有限公司 | Package structure and method for forming the same |
JP6781677B2 (en) * | 2017-08-01 | 2020-11-04 | 芝浦メカトロニクス株式会社 | Electronic component mounting equipment and mounting method, and package component manufacturing method |
JP7224296B2 (en) * | 2017-10-31 | 2023-02-17 | ナガセケムテックス株式会社 | Mounting structure manufacturing method and sheet used therefor |
KR20200081336A (en) | 2017-11-17 | 2020-07-07 | 린텍 가부시키가이샤 | Resin sheet |
JP6934638B2 (en) * | 2017-12-21 | 2021-09-15 | パナソニックIpマネジメント株式会社 | Semiconductor package and printed circuit board |
JP7267272B2 (en) * | 2018-06-08 | 2023-05-01 | リンテック株式会社 | Method for manufacturing cured encapsulant |
CN109135191B (en) * | 2018-08-14 | 2020-04-07 | 苏州德林泰精工科技有限公司 | Resin gasket for chip stacking and packaging and preparation method thereof |
JP7221046B2 (en) * | 2018-12-26 | 2023-02-13 | 東京応化工業株式会社 | Adhesive composition, laminate, method for producing laminate, and method for producing electronic component |
KR102488314B1 (en) * | 2018-12-27 | 2023-01-13 | 주식회사 두산 | Non-conductive adhesive film for semiconductor package and method for manufacturing semiconductor packag using the same |
JP7289108B2 (en) * | 2019-02-21 | 2023-06-09 | パナソニックIpマネジメント株式会社 | Semiconductor sealing material and semiconductor device |
KR102516291B1 (en) * | 2020-06-30 | 2023-03-31 | (주)이녹스첨단소재 | Insulation film for electronic device manufacturing |
JPWO2022190898A1 (en) * | 2021-03-11 | 2022-09-15 |
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JP2660631B2 (en) * | 1992-03-19 | 1997-10-08 | 株式会社日立製作所 | Resin-sealed semiconductor device |
JP4038363B2 (en) | 2000-12-25 | 2008-01-23 | 日本特殊陶業株式会社 | Wiring board |
US7145254B2 (en) * | 2001-07-26 | 2006-12-05 | Denso Corporation | Transfer-molded power device and method for manufacturing transfer-molded power device |
JP4225162B2 (en) * | 2003-08-18 | 2009-02-18 | 日立化成工業株式会社 | Sealing film |
JP2005302971A (en) * | 2004-04-09 | 2005-10-27 | Toshiba Corp | Process for producing semiconductor chip mounting body, and semiconductor chip mounting body |
JP4730652B2 (en) | 2004-06-02 | 2011-07-20 | ナガセケムテックス株式会社 | Manufacturing method of electronic parts |
JP2006241449A (en) * | 2005-02-07 | 2006-09-14 | San Nopco Ltd | Thermosetting resin composition |
SG160331A1 (en) | 2005-03-25 | 2010-04-29 | Sumitomo Bakelite Co | Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating |
EP2024454B1 (en) * | 2006-05-16 | 2012-09-19 | Lord Corporation | Curable protectant for electronic assemblies |
JP5608977B2 (en) * | 2006-12-05 | 2014-10-22 | 住友ベークライト株式会社 | Semiconductor package, core layer material, buildup layer material, and sealing resin composition |
WO2010041651A1 (en) * | 2008-10-10 | 2010-04-15 | 住友ベークライト株式会社 | Semiconductor device |
CN102812066B (en) * | 2010-03-19 | 2014-08-06 | 积水化学工业株式会社 | Curable composition, dicing-die bonding tape, connecting structure and method for producing semiconductor tape with cohesive/adhesive layer |
JP2012227441A (en) * | 2011-04-21 | 2012-11-15 | Sumitomo Bakelite Co Ltd | Semiconductor device manufacturing method and semiconductor device |
JP5903920B2 (en) | 2012-02-16 | 2016-04-13 | 富士通株式会社 | Semiconductor device manufacturing method and electronic device manufacturing method |
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US9659883B2 (en) | 2017-05-23 |
US20160211228A1 (en) | 2016-07-21 |
KR20160060073A (en) | 2016-05-27 |
CN105555848B (en) | 2019-04-23 |
CN105555848A (en) | 2016-05-04 |
JP6320239B2 (en) | 2018-05-09 |
JP2015086359A (en) | 2015-05-07 |
WO2015045846A1 (en) | 2015-04-02 |
TW201516122A (en) | 2015-05-01 |
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