SG11201505205QA - Microcontact printing with high relief stamps in a roll-to-roll process - Google Patents

Microcontact printing with high relief stamps in a roll-to-roll process

Info

Publication number
SG11201505205QA
SG11201505205QA SG11201505205QA SG11201505205QA SG11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA
Authority
SG
Singapore
Prior art keywords
roll
microcontact printing
high relief
stamps
relief stamps
Prior art date
Application number
SG11201505205QA
Other languages
English (en)
Inventor
Mikhail L Pekurovsky
Lyudmila A Pekurovsky
Matthew H Frey
Daniel P Meehan
Jonathan J O'hare
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201505205QA publication Critical patent/SG11201505205QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/54—Inking devices
    • B41K3/60—Inking devices using rollers, e.g. rollers with integral ink-supply devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F5/00—Rotary letterpress machines
    • B41F5/24—Rotary letterpress machines for flexographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • B41M1/04—Flexographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nanotechnology (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Printing Methods (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201505205QA 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process SG11201505205QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261747980P 2012-12-31 2012-12-31
PCT/US2013/076546 WO2014105633A1 (en) 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process

Publications (1)

Publication Number Publication Date
SG11201505205QA true SG11201505205QA (en) 2015-08-28

Family

ID=51021975

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201505205QA SG11201505205QA (en) 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process

Country Status (9)

Country Link
US (1) US10195884B2 (https=)
EP (1) EP2938501B1 (https=)
JP (1) JP6469019B2 (https=)
KR (1) KR102132298B1 (https=)
CN (1) CN104903112B (https=)
BR (1) BR112015015557A2 (https=)
SG (1) SG11201505205QA (https=)
TW (1) TWI653155B (https=)
WO (1) WO2014105633A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411516B1 (ko) * 2014-12-31 2022-06-21 쓰리엠 이노베이티브 프로퍼티즈 캄파니 균일성을 개선하기 위한 미세접촉 인쇄 장치 및 방법
US20210008866A1 (en) * 2017-12-29 2021-01-14 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
CN111526990B (zh) * 2017-12-29 2022-09-27 3M创新有限公司 非平面图案化纳米结构表面及用于其制造的印刷方法
JP2019142206A (ja) * 2018-02-19 2019-08-29 株式会社ダイセル モールドの製造方法、及びこれを利用した成形体の製造方法
WO2020003084A1 (en) * 2018-06-29 2020-01-02 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
KR20220024785A (ko) * 2019-06-19 2022-03-03 샤크렛 테크놀러지스, 아이엔씨. 텍스처링된 표면 배경을 갖는 물품을 형성하기 위한 방법 및 장치
EP4248272B1 (en) 2020-12-21 2024-02-28 3M Innovative Properties Company Arrayed structured replication articles and methods
CN112590417B (zh) * 2020-12-25 2023-06-02 重庆新士腾包装制品有限公司 一种珍珠棉印刷工艺

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5079600A (en) 1987-03-06 1992-01-07 Schnur Joel M High resolution patterning on solid substrates
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
WO2004013697A2 (en) 2002-07-26 2004-02-12 Koninklijke Philips Electronics N.V. Micro-contact printing method
JP4541061B2 (ja) * 2004-07-29 2010-09-08 株式会社日立製作所 材料転写方法、プラズマディスプレイ用基板の製造方法
WO2006043244A1 (en) * 2004-10-22 2006-04-27 Koninklijke Philips Electronics N.V. Roller micro-contact printer with pressure control
EP1657070B1 (en) 2004-11-10 2008-04-23 Sony Deutschland GmbH A stamp for soft lithography, in particular micro contact printing and a method of preparing the same
WO2006096123A1 (en) * 2005-03-08 2006-09-14 Optovent Ab Micro and nano structures in an elastomeric material
FR2894515B1 (fr) * 2005-12-08 2008-02-15 Essilor Int Procede de transfert d'un motif micronique sur un article optique et article optique ainsi obtenu
JP4967765B2 (ja) * 2007-04-05 2012-07-04 日立化成工業株式会社 凹版及びその製造方法
DE102007007914A1 (de) 2007-02-14 2008-08-21 Giesecke & Devrient Gmbh Prägelack für mikrooptische Sicherheitselemente
JP2009028947A (ja) 2007-07-25 2009-02-12 Seiko Epson Corp マイクロコンタクトプリント用版および電子装置の製造方法
US8734708B2 (en) * 2007-10-29 2014-05-27 Dow Corning Corporation Polar polydimethysiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer
EP2231793B1 (en) 2007-12-19 2014-01-22 3M Innovative Properties Company Ink solutions for microcontact printing
EP2257969B1 (en) * 2008-02-28 2017-12-20 3M Innovative Properties Company Methods of patterning a conductor on a substrate
EP2100732A1 (en) * 2008-03-13 2009-09-16 Fischer & Krecke GmbH Method and calibration tool for calibrating a rotary printing press
CN103365077B (zh) * 2008-06-06 2016-06-08 皇家飞利浦电子股份有限公司 用于软光刻的硅酮橡胶材料
US9003970B2 (en) * 2008-06-30 2015-04-14 3M Innovative Properties Company Solvent assisted method of microcontact printing
JP5843784B2 (ja) 2009-12-22 2016-01-13 スリーエム イノベイティブ プロパティズ カンパニー 加圧ローラーを使用するマイクロコンタクトプリンティングのための装置及び方法
TW201223777A (en) 2010-12-13 2012-06-16 Metal Ind Res & Dev Ct Roller-type micro-contact printing device and printing method thereof
KR20140088171A (ko) * 2011-10-25 2014-07-09 유니-픽셀 디스플레이스, 인코포레이티드 Ｕｖ 경화의 최적화

Also Published As

Publication number Publication date
EP2938501A4 (en) 2016-08-24
WO2014105633A1 (en) 2014-07-03
CN104903112B (zh) 2017-12-26
KR102132298B1 (ko) 2020-07-09
JP2016509367A (ja) 2016-03-24
US20150343823A1 (en) 2015-12-03
BR112015015557A2 (pt) 2017-07-11
KR20150103695A (ko) 2015-09-11
JP6469019B2 (ja) 2019-02-13
TWI653155B (zh) 2019-03-11
EP2938501B1 (en) 2019-03-27
EP2938501A1 (en) 2015-11-04
CN104903112A (zh) 2015-09-09
US10195884B2 (en) 2019-02-05
TW201501952A (zh) 2015-01-16

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