SG11201505205QA - Microcontact printing with high relief stamps in a roll-to-roll process - Google Patents

Microcontact printing with high relief stamps in a roll-to-roll process

Info

Publication number
SG11201505205QA
SG11201505205QA SG11201505205QA SG11201505205QA SG11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA SG 11201505205Q A SG11201505205Q A SG 11201505205QA
Authority
SG
Singapore
Prior art keywords
roll
microcontact printing
high relief
stamps
relief stamps
Prior art date
Application number
SG11201505205QA
Other languages
English (en)
Inventor
Mikhail L Pekurovsky
Lyudmila A Pekurovsky
Matthew H Frey
Daniel P Meehan
Jonathan J O'hare
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of SG11201505205QA publication Critical patent/SG11201505205QA/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K3/00—Apparatus for stamping articles having integral means for supporting the articles to be stamped
    • B41K3/54—Inking devices
    • B41K3/60—Inking devices using rollers, e.g. rollers with integral ink-supply devices
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F5/00—Rotary letterpress machines
    • B41F5/24—Rotary letterpress machines for flexographic printing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M1/00—Inking and printing with a printer's forme
    • B41M1/02—Letterpress printing, e.g. book printing
    • B41M1/04—Flexographic printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Methods (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
SG11201505205QA 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process SG11201505205QA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261747980P 2012-12-31 2012-12-31
PCT/US2013/076546 WO2014105633A1 (en) 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process

Publications (1)

Publication Number Publication Date
SG11201505205QA true SG11201505205QA (en) 2015-08-28

Family

ID=51021975

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201505205QA SG11201505205QA (en) 2012-12-31 2013-12-19 Microcontact printing with high relief stamps in a roll-to-roll process

Country Status (9)

Country Link
US (1) US10195884B2 (enExample)
EP (1) EP2938501B1 (enExample)
JP (1) JP6469019B2 (enExample)
KR (1) KR102132298B1 (enExample)
CN (1) CN104903112B (enExample)
BR (1) BR112015015557A2 (enExample)
SG (1) SG11201505205QA (enExample)
TW (1) TWI653155B (enExample)
WO (1) WO2014105633A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102411516B1 (ko) * 2014-12-31 2022-06-21 쓰리엠 이노베이티브 프로퍼티즈 캄파니 균일성을 개선하기 위한 미세접촉 인쇄 장치 및 방법
EP3732046A4 (en) * 2017-12-29 2021-09-29 3M Innovative Properties Company NON-PLANAR PATTERNED NANOSTRUCTURED SURFACE AND PRINTING PROCESS FOR PRODUCING IT
WO2019130221A1 (en) * 2017-12-29 2019-07-04 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
JP2019142206A (ja) * 2018-02-19 2019-08-29 株式会社ダイセル モールドの製造方法、及びこれを利用した成形体の製造方法
US20210260901A1 (en) * 2018-06-29 2021-08-26 3M Innovative Properties Company Nonplanar patterned nanostructured surface and printing methods for making thereof
JP2022537566A (ja) * 2019-06-19 2022-08-26 シャークレット テクノロジーズ インコーポレイテッド テクスチャー加工された表面を有する物品を形成する方法および装置
US12235577B2 (en) 2020-12-21 2025-02-25 3M Innovative Properties Company Arrayed structured replication articles and methods
CN112590417B (zh) * 2020-12-25 2023-06-02 重庆新士腾包装制品有限公司 一种珍珠棉印刷工艺

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5079600A (en) 1987-03-06 1992-01-07 Schnur Joel M High resolution patterning on solid substrates
US5512131A (en) 1993-10-04 1996-04-30 President And Fellows Of Harvard College Formation of microstamped patterns on surfaces and derivative articles
EP1527374A2 (en) 2002-07-26 2005-05-04 Koninklijke Philips Electronics N.V. Micro-contact printing method
JP4541061B2 (ja) * 2004-07-29 2010-09-08 株式会社日立製作所 材料転写方法、プラズマディスプレイ用基板の製造方法
WO2006043244A1 (en) * 2004-10-22 2006-04-27 Koninklijke Philips Electronics N.V. Roller micro-contact printer with pressure control
EP1657070B1 (en) 2004-11-10 2008-04-23 Sony Deutschland GmbH A stamp for soft lithography, in particular micro contact printing and a method of preparing the same
US8017218B2 (en) * 2005-03-08 2011-09-13 Forskarpatent I Linkoping Ab Micro and nano structures in an elastomeric material
FR2894515B1 (fr) * 2005-12-08 2008-02-15 Essilor Int Procede de transfert d'un motif micronique sur un article optique et article optique ainsi obtenu
JP4967765B2 (ja) * 2007-04-05 2012-07-04 日立化成工業株式会社 凹版及びその製造方法
DE102007007914A1 (de) 2007-02-14 2008-08-21 Giesecke & Devrient Gmbh Prägelack für mikrooptische Sicherheitselemente
JP2009028947A (ja) 2007-07-25 2009-02-12 Seiko Epson Corp マイクロコンタクトプリント用版および電子装置の製造方法
US8734708B2 (en) * 2007-10-29 2014-05-27 Dow Corning Corporation Polar polydimethysiloxane molds, methods of making the molds, and methods of using the molds for pattern transfer
US9027480B2 (en) 2007-12-19 2015-05-12 3M Innovative Properties Company Ink solutions for microcontact printing
US8425792B2 (en) * 2008-02-28 2013-04-23 3M Innovative Properties Company Methods of patterning a conductor on a substrate
EP2100732A1 (en) * 2008-03-13 2009-09-16 Fischer & Krecke GmbH Method and calibration tool for calibrating a rotary printing press
EP2599835B1 (en) * 2008-06-06 2016-07-20 Koninklijke Philips N.V. Silicone rubber material for soft lithography
WO2010002788A1 (en) * 2008-06-30 2010-01-07 3M Innovative Properties Company Solvent assisted method of microcontact printing
CN102666103B (zh) * 2009-12-22 2016-04-06 3M创新有限公司 用于使用增压辊的微接触印刷的装置及方法
TW201223777A (en) * 2010-12-13 2012-06-16 Metal Ind Res & Dev Ct Roller-type micro-contact printing device and printing method thereof
TW201334637A (zh) * 2011-10-25 2013-08-16 優尼畫素顯示器公司 Ｕｖ硬化之最適化

Also Published As

Publication number Publication date
BR112015015557A2 (pt) 2017-07-11
JP6469019B2 (ja) 2019-02-13
KR102132298B1 (ko) 2020-07-09
US10195884B2 (en) 2019-02-05
KR20150103695A (ko) 2015-09-11
WO2014105633A1 (en) 2014-07-03
TW201501952A (zh) 2015-01-16
EP2938501B1 (en) 2019-03-27
JP2016509367A (ja) 2016-03-24
EP2938501A4 (en) 2016-08-24
EP2938501A1 (en) 2015-11-04
CN104903112B (zh) 2017-12-26
CN104903112A (zh) 2015-09-09
US20150343823A1 (en) 2015-12-03
TWI653155B (zh) 2019-03-11

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