SG11201408001YA - Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system - Google Patents

Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Info

Publication number
SG11201408001YA
SG11201408001YA SG11201408001YA SG11201408001YA SG11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA SG 11201408001Y A SG11201408001Y A SG 11201408001YA
Authority
SG
Singapore
Prior art keywords
heat
international
computer system
heat pipe
parts
Prior art date
Application number
SG11201408001YA
Other languages
English (en)
Inventor
John Alexander Wilson
Robert Haden Garrett
Original Assignee
Razer Asia Pacific Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Razer Asia Pacific Pte Ltd filed Critical Razer Asia Pacific Pte Ltd
Publication of SG11201408001YA publication Critical patent/SG11201408001YA/en

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
SG11201408001YA 2012-08-27 2012-08-27 Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system SG11201408001YA (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2012/052424 WO2014035362A1 (en) 2012-08-27 2012-08-27 Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Publications (1)

Publication Number Publication Date
SG11201408001YA true SG11201408001YA (en) 2015-01-29

Family

ID=50184009

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201408001YA SG11201408001YA (en) 2012-08-27 2012-08-27 Computer systems, parts of a housing for a computer system, heat exchangers, and methods for assembling parts of a computer system

Country Status (7)

Country Link
US (1) US9665139B2 (zh)
EP (1) EP2888640A4 (zh)
CN (1) CN104412196B (zh)
AU (1) AU2012388764B2 (zh)
SG (1) SG11201408001YA (zh)
TW (1) TWI621940B (zh)
WO (1) WO2014035362A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106462201B (zh) 2014-05-20 2020-06-05 雷蛇(亚太)私人有限公司 用于计算机系统的机壳、其零件以及其中增强气流的方法
CN105357937A (zh) * 2015-11-30 2016-02-24 英业达科技有限公司 电子装置
CN107102710A (zh) * 2017-06-28 2017-08-29 昆山特酷信息科技有限公司 笔记本电脑的散热系统
USD901485S1 (en) * 2018-02-05 2020-11-10 Huawei Technologies Co., Ltd. Computer
US11503743B2 (en) * 2021-03-12 2022-11-15 Baidu Usa Llc High availability fluid connector for liquid cooling
CN113107885B (zh) * 2021-04-08 2022-04-12 合肥联宝信息技术有限公司 一种用于笔记本电脑底面的散热结构以及散热方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6352103B1 (en) 1996-05-22 2002-03-05 Intel Corporation High performance notebook PC cooling system
US6288895B1 (en) 1996-09-30 2001-09-11 Intel Corporation Apparatus for cooling electronic components within a computer system enclosure
US5986882A (en) 1997-10-16 1999-11-16 Compaq Computer Corporation Electronic apparatus having removable processor/heat pipe cooling device modules therein
US6122167A (en) * 1998-06-02 2000-09-19 Dell Usa, L.P. Integrated hybrid cooling with EMI shielding for a portable computer
US6353536B1 (en) 1998-06-25 2002-03-05 Kabushiki Kaisha Toshiba Electronic equipment system and extension device for expanding the functions of electronic equipment
US6181553B1 (en) * 1998-09-04 2001-01-30 International Business Machines Corporation Arrangement and method for transferring heat from a portable personal computer
US6141215A (en) 1999-01-12 2000-10-31 Dell Usa, L.P. Hybrid cooling heat exchanger fin geometry and orientation
US6266241B1 (en) 1999-09-29 2001-07-24 Hewlett-Packard Company Notebook computer with ergonomic stand
JP3634825B2 (ja) * 2002-06-28 2005-03-30 株式会社東芝 電子機器
US20040201958A1 (en) 2003-04-14 2004-10-14 Lev Jeffrey A. System and method for cooling an electronic device
US20050145371A1 (en) 2003-12-31 2005-07-07 Eric Distefano Thermal solution for electronics cooling using a heat pipe in combination with active loop solution
JP4377742B2 (ja) * 2004-04-30 2009-12-02 株式会社東芝 放熱器、冷却装置および冷却装置を有する電子機器
CN100530616C (zh) * 2005-09-23 2009-08-19 富准精密工业(深圳)有限公司 散热模组
TWI267346B (en) 2005-09-23 2006-11-21 Foxconn Tech Co Ltd Thermal module
US7529085B2 (en) * 2006-06-30 2009-05-05 Lenovo (Singapore) Pte. Ltd. Thermal docking fansink
WO2009043240A1 (en) 2007-09-29 2009-04-09 Biao Qin Flat heat pipe radiator and application thereof
US7969730B1 (en) 2008-02-08 2011-06-28 Motion Computer, Inc. Portable computer with thermal control and power source shield
US9754857B2 (en) * 2009-03-23 2017-09-05 Hewlett-Packard Development Company, L.P. Folded fin heat transfer device
US20110292605A1 (en) * 2010-06-01 2011-12-01 Kuan-Chih Chen Heat-dissipating hinge and a portable electronic device with the same
JP5254416B2 (ja) * 2011-09-30 2013-08-07 株式会社東芝 電子機器

Also Published As

Publication number Publication date
EP2888640A1 (en) 2015-07-01
TWI621940B (zh) 2018-04-21
US20150170993A1 (en) 2015-06-18
WO2014035362A1 (en) 2014-03-06
CN104412196A (zh) 2015-03-11
AU2012388764A1 (en) 2015-01-29
CN104412196B (zh) 2019-04-30
AU2012388764B2 (en) 2016-02-18
TW201409215A (zh) 2014-03-01
US9665139B2 (en) 2017-05-30
EP2888640A4 (en) 2016-01-20

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