SG11201406449YA - Wafer shipper - Google Patents
Wafer shipperInfo
- Publication number
- SG11201406449YA SG11201406449YA SG11201406449YA SG11201406449YA SG11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA
- Authority
- SG
- Singapore
- Prior art keywords
- wafer shipper
- shipper
- wafer
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261621777P | 2012-04-09 | 2012-04-09 | |
PCT/US2013/035846 WO2013155113A1 (en) | 2012-04-09 | 2013-04-09 | Wafer shipper |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201406449YA true SG11201406449YA (en) | 2014-11-27 |
Family
ID=49328108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201406449YA SG11201406449YA (en) | 2012-04-09 | 2013-04-09 | Wafer shipper |
Country Status (8)
Country | Link |
---|---|
US (1) | US9478450B2 (en) |
EP (1) | EP2837024B1 (en) |
JP (1) | JP6203819B2 (en) |
KR (1) | KR102093202B1 (en) |
CN (1) | CN104350591B (en) |
SG (1) | SG11201406449YA (en) |
TW (1) | TWI596693B (en) |
WO (1) | WO2013155113A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014073295A1 (en) * | 2012-11-09 | 2014-05-15 | シャープ株式会社 | Field-effect transistor |
EP3234991B1 (en) * | 2014-12-18 | 2021-07-07 | Entegris, Inc. | Wafer container with shock condition protection |
TWM510539U (en) * | 2015-03-13 | 2015-10-11 | Entegris Inc | Modified spring cushion for film frame shipper |
US10482226B1 (en) | 2016-01-22 | 2019-11-19 | State Farm Mutual Automobile Insurance Company | System and method for autonomous vehicle sharing using facial recognition |
US10020213B1 (en) * | 2016-12-30 | 2018-07-10 | Sunpower Corporation | Semiconductor wafer carriers |
TWM553052U (en) * | 2017-08-31 | 2017-12-11 | Chung King Enterprise Co Ltd | Wafer carrier box and lower holder for the wafer carrier box |
JP6877317B2 (en) * | 2017-11-10 | 2021-05-26 | 三菱電機株式会社 | Wafer container |
US10811292B2 (en) * | 2018-09-12 | 2020-10-20 | Texas Instruments Incorporated | Transport packaging and method for expanded wafers |
KR20220035198A (en) * | 2019-07-19 | 2022-03-21 | 엔테그리스, 아이엔씨. | Wafer Cushion |
JP7313975B2 (en) * | 2019-08-27 | 2023-07-25 | 信越ポリマー株式会社 | Substrate storage container |
JP7392621B2 (en) | 2020-09-30 | 2023-12-06 | トヨタ自動車株式会社 | Separator for zinc secondary batteries |
CN118139796A (en) * | 2021-09-22 | 2024-06-04 | 恩特格里斯公司 | Technological carrier |
WO2024196646A1 (en) * | 2023-03-17 | 2024-09-26 | Entegris, Inc. | Wide insertion angle process carrier |
CN116805608A (en) * | 2023-08-29 | 2023-09-26 | 芯岛新材料(浙江)有限公司 | Wafer box |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4842136A (en) * | 1987-02-13 | 1989-06-27 | Canon Kabushiki Kaisha | Dust-proof container having improved construction for holding a reticle therein |
US4966284A (en) | 1987-07-07 | 1990-10-30 | Empak, Inc. | Substrate package |
US4793488A (en) | 1987-07-07 | 1988-12-27 | Empak, Inc. | Package for semiconductor wafers |
US4949848A (en) | 1988-04-29 | 1990-08-21 | Fluoroware, Inc. | Wafer carrier |
US5228568A (en) | 1991-08-30 | 1993-07-20 | Shin-Etsu Handotai Co., Ltd. | Semiconductor wafer basket |
US5273159A (en) | 1992-05-26 | 1993-12-28 | Empak, Inc. | Wafer suspension box |
US5555981A (en) * | 1992-05-26 | 1996-09-17 | Empak, Inc. | Wafer suspension box |
JP2556346Y2 (en) * | 1993-08-09 | 1997-12-03 | 小松化成株式会社 | Semiconductor wafer transfer container |
JPH0729842U (en) * | 1993-11-10 | 1995-06-02 | 信越ポリマー株式会社 | Wafer storage container |
JPH09107026A (en) | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | Wafer cassette for wafer receiving container |
US6736268B2 (en) | 1997-07-11 | 2004-05-18 | Entegris, Inc. | Transport module |
KR100371392B1 (en) * | 1997-08-30 | 2003-05-12 | 주식회사 엘지화학 | Storage and transferring container for silicone wafer |
JPH11121601A (en) * | 1997-10-20 | 1999-04-30 | Dainippon Ink & Chem Inc | Wafer-housing container |
JP3709958B2 (en) * | 1998-01-26 | 2005-10-26 | 三菱マテリアル株式会社 | Plate-shaped member storage container, inner box structure thereof, and injection mold for inner box molding |
US6214127B1 (en) * | 1998-02-04 | 2001-04-10 | Micron Technology, Inc. | Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier |
US5992638A (en) * | 1998-11-11 | 1999-11-30 | Empak, Inc. | Advanced wafer shipper |
US6082540A (en) * | 1999-01-06 | 2000-07-04 | Fluoroware, Inc. | Cushion system for wafer carriers |
JP3938293B2 (en) * | 2001-05-30 | 2007-06-27 | 信越ポリマー株式会社 | Precision substrate storage container and its holding member |
TW511649U (en) | 2001-09-12 | 2002-11-21 | Ind Tech Res Inst | Wafer retainer |
US6951284B2 (en) * | 2001-11-14 | 2005-10-04 | Entegris, Inc. | Wafer carrier with wafer retaining system |
JP4133407B2 (en) * | 2003-02-13 | 2008-08-13 | ミライアル株式会社 | Thin plate storage container |
US20050186378A1 (en) | 2004-02-23 | 2005-08-25 | Bhatt Sanjiv M. | Compositions comprising carbon nanotubes and articles formed therefrom |
US7523830B2 (en) * | 2004-11-23 | 2009-04-28 | Entegris, Inc. | Wafer container with secondary wafer restraint system |
WO2009060782A1 (en) * | 2007-11-09 | 2009-05-14 | Shin-Etsu Polymer Co., Ltd. | Retainer and substrate storing container |
TWI562940B (en) * | 2008-01-13 | 2016-12-21 | Entegris Inc | Wafer container and method of manufacture |
MY159162A (en) * | 2010-03-11 | 2016-12-30 | Entegris Inc | Thin wafer shipper |
-
2013
- 2013-04-09 CN CN201380024494.0A patent/CN104350591B/en active Active
- 2013-04-09 TW TW102112483A patent/TWI596693B/en active
- 2013-04-09 SG SG11201406449YA patent/SG11201406449YA/en unknown
- 2013-04-09 EP EP13774978.4A patent/EP2837024B1/en active Active
- 2013-04-09 KR KR1020147029751A patent/KR102093202B1/en active IP Right Grant
- 2013-04-09 WO PCT/US2013/035846 patent/WO2013155113A1/en active Application Filing
- 2013-04-09 US US14/391,696 patent/US9478450B2/en active Active
- 2013-04-09 JP JP2015505859A patent/JP6203819B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP2015518279A (en) | 2015-06-25 |
WO2013155113A1 (en) | 2013-10-17 |
TWI596693B (en) | 2017-08-21 |
EP2837024B1 (en) | 2020-06-17 |
US20150068949A1 (en) | 2015-03-12 |
EP2837024A4 (en) | 2015-11-04 |
CN104350591B (en) | 2017-02-22 |
TW201405696A (en) | 2014-02-01 |
JP6203819B2 (en) | 2017-09-27 |
US9478450B2 (en) | 2016-10-25 |
KR20150002686A (en) | 2015-01-07 |
CN104350591A (en) | 2015-02-11 |
KR102093202B1 (en) | 2020-03-25 |
EP2837024A1 (en) | 2015-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2824703A4 (en) | Semiconductor device | |
SG11201406449YA (en) | Wafer shipper | |
EP2814059A4 (en) | Semiconductor device | |
EP2732272A4 (en) | Wafer inspection | |
EP2804212A4 (en) | Semiconductor device | |
EP2866250A4 (en) | Semiconductor device | |
EP2814060A4 (en) | Semiconductor device | |
EP2704189A4 (en) | Semiconductor device | |
EP2827364A4 (en) | Semiconductor device | |
SG11201404918YA (en) | Etching composition | |
EP2822039A4 (en) | Semiconductor device | |
EP2887401A4 (en) | Semiconductor device | |
HK1220956A1 (en) | Package | |
GB201118868D0 (en) | Semiconductor compounds | |
EP2850385A4 (en) | Substrate inspection | |
GB2507980B (en) | Inspection arrangement | |
EP2790323A4 (en) | Semiconductor device | |
EP2871676A4 (en) | Semiconductor device | |
EP2846423A4 (en) | Semiconductor package | |
ZA201406533B (en) | Package | |
EP2863419A4 (en) | Semiconductor device | |
EP2869340A4 (en) | Semiconductor device | |
EP2892054A4 (en) | Semiconductor device | |
EP2871679A4 (en) | Semiconductor device | |
GB201217617D0 (en) | Semiconductor materials |