SG11201406449YA - Wafer shipper - Google Patents

Wafer shipper

Info

Publication number
SG11201406449YA
SG11201406449YA SG11201406449YA SG11201406449YA SG11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA SG 11201406449Y A SG11201406449Y A SG 11201406449YA
Authority
SG
Singapore
Prior art keywords
wafer shipper
shipper
wafer
Prior art date
Application number
SG11201406449YA
Inventor
Russ V Raschke
Barry Gregerson
Jason Todd Steffens
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of SG11201406449YA publication Critical patent/SG11201406449YA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
SG11201406449YA 2012-04-09 2013-04-09 Wafer shipper SG11201406449YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261621777P 2012-04-09 2012-04-09
PCT/US2013/035846 WO2013155113A1 (en) 2012-04-09 2013-04-09 Wafer shipper

Publications (1)

Publication Number Publication Date
SG11201406449YA true SG11201406449YA (en) 2014-11-27

Family

ID=49328108

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201406449YA SG11201406449YA (en) 2012-04-09 2013-04-09 Wafer shipper

Country Status (8)

Country Link
US (1) US9478450B2 (en)
EP (1) EP2837024B1 (en)
JP (1) JP6203819B2 (en)
KR (1) KR102093202B1 (en)
CN (1) CN104350591B (en)
SG (1) SG11201406449YA (en)
TW (1) TWI596693B (en)
WO (1) WO2013155113A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014073295A1 (en) * 2012-11-09 2014-05-15 シャープ株式会社 Field-effect transistor
TWI680525B (en) * 2014-12-18 2019-12-21 美商恩特葛瑞斯股份有限公司 Wafer container with shock condition protection
TWM510539U (en) * 2015-03-13 2015-10-11 Entegris Inc Modified spring cushion for film frame shipper
US10020213B1 (en) * 2016-12-30 2018-07-10 Sunpower Corporation Semiconductor wafer carriers
TWM553052U (en) * 2017-08-31 2017-12-11 Chung King Enterprise Co Ltd Wafer carrier box and lower holder for the wafer carrier box
JP6877317B2 (en) * 2017-11-10 2021-05-26 三菱電機株式会社 Wafer container
US10811292B2 (en) * 2018-09-12 2020-10-20 Texas Instruments Incorporated Transport packaging and method for expanded wafers
CN114287055A (en) * 2019-07-19 2022-04-05 恩特格里斯公司 Wafer buffer
JP7313975B2 (en) * 2019-08-27 2023-07-25 信越ポリマー株式会社 Substrate storage container
JP7392621B2 (en) 2020-09-30 2023-12-06 トヨタ自動車株式会社 Separator for zinc secondary batteries
US20230088106A1 (en) * 2021-09-22 2023-03-23 Entegris, Inc. Process carrier
CN116805608A (en) * 2023-08-29 2023-09-26 芯岛新材料(浙江)有限公司 Wafer box

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4842136A (en) * 1987-02-13 1989-06-27 Canon Kabushiki Kaisha Dust-proof container having improved construction for holding a reticle therein
US4966284A (en) 1987-07-07 1990-10-30 Empak, Inc. Substrate package
US4793488A (en) 1987-07-07 1988-12-27 Empak, Inc. Package for semiconductor wafers
US4949848A (en) 1988-04-29 1990-08-21 Fluoroware, Inc. Wafer carrier
US5228568A (en) 1991-08-30 1993-07-20 Shin-Etsu Handotai Co., Ltd. Semiconductor wafer basket
US5555981A (en) * 1992-05-26 1996-09-17 Empak, Inc. Wafer suspension box
US5273159A (en) 1992-05-26 1993-12-28 Empak, Inc. Wafer suspension box
JP2556346Y2 (en) * 1993-08-09 1997-12-03 小松化成株式会社 Semiconductor wafer transfer container
JPH0729842U (en) * 1993-11-10 1995-06-02 信越ポリマー株式会社 Wafer storage container
JPH09107026A (en) 1995-10-12 1997-04-22 Shin Etsu Polymer Co Ltd Wafer cassette for wafer receiving container
US6736268B2 (en) 1997-07-11 2004-05-18 Entegris, Inc. Transport module
KR100371392B1 (en) 1997-08-30 2003-05-12 주식회사 엘지화학 Storage and transferring container for silicone wafer
JPH11121601A (en) * 1997-10-20 1999-04-30 Dainippon Ink & Chem Inc Wafer-housing container
JP3709958B2 (en) * 1998-01-26 2005-10-26 三菱マテリアル株式会社 Plate-shaped member storage container, inner box structure thereof, and injection mold for inner box molding
US6214127B1 (en) * 1998-02-04 2001-04-10 Micron Technology, Inc. Methods of processing electronic device workpieces and methods of positioning electronic device workpieces within a workpiece carrier
US5992638A (en) * 1998-11-11 1999-11-30 Empak, Inc. Advanced wafer shipper
US6082540A (en) * 1999-01-06 2000-07-04 Fluoroware, Inc. Cushion system for wafer carriers
JP3938293B2 (en) * 2001-05-30 2007-06-27 信越ポリマー株式会社 Precision substrate storage container and its holding member
TW511649U (en) 2001-09-12 2002-11-21 Ind Tech Res Inst Wafer retainer
US6951284B2 (en) * 2001-11-14 2005-10-04 Entegris, Inc. Wafer carrier with wafer retaining system
JP4133407B2 (en) * 2003-02-13 2008-08-13 ミライアル株式会社 Thin plate storage container
US20050186378A1 (en) 2004-02-23 2005-08-25 Bhatt Sanjiv M. Compositions comprising carbon nanotubes and articles formed therefrom
US7523830B2 (en) * 2004-11-23 2009-04-28 Entegris, Inc. Wafer container with secondary wafer restraint system
US8356713B2 (en) * 2007-11-09 2013-01-22 Shin-Etsu Polymer Co., Ltd. Retainer and substrate storage container
KR20100105875A (en) * 2008-01-13 2010-09-30 엔테그리스, 아이엔씨. Method and apparatuses for large diameter wafter handling
EP2544965B1 (en) 2010-03-11 2019-05-22 Entegris, Inc. Thin wafer shipper

Also Published As

Publication number Publication date
EP2837024A1 (en) 2015-02-18
EP2837024B1 (en) 2020-06-17
KR102093202B1 (en) 2020-03-25
KR20150002686A (en) 2015-01-07
JP6203819B2 (en) 2017-09-27
US9478450B2 (en) 2016-10-25
WO2013155113A1 (en) 2013-10-17
TWI596693B (en) 2017-08-21
TW201405696A (en) 2014-02-01
CN104350591A (en) 2015-02-11
EP2837024A4 (en) 2015-11-04
US20150068949A1 (en) 2015-03-12
JP2015518279A (en) 2015-06-25
CN104350591B (en) 2017-02-22

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